TW200702676A - Testing apparatus, testing method and semiconductor device - Google Patents

Testing apparatus, testing method and semiconductor device

Info

Publication number
TW200702676A
TW200702676A TW095115704A TW95115704A TW200702676A TW 200702676 A TW200702676 A TW 200702676A TW 095115704 A TW095115704 A TW 095115704A TW 95115704 A TW95115704 A TW 95115704A TW 200702676 A TW200702676 A TW 200702676A
Authority
TW
Taiwan
Prior art keywords
testing
differential
output
output terminal
detecting device
Prior art date
Application number
TW095115704A
Other languages
Chinese (zh)
Other versions
TWI398647B (en
Inventor
Yasushi Shouji
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200702676A publication Critical patent/TW200702676A/en
Application granted granted Critical
Publication of TWI398647B publication Critical patent/TWI398647B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A testing device, including a testing signal supply section, a signal input section, a differential detecting device and a judging section, is provided. The testing signal supply section provides a testing signal to a semiconductor device for testing thereof. The signal input section is inputted an output voltage or an output current from multiple output terminals respectively. The differential detecting device is disposed corresponding to a differential testing object output terminal which is different from a reference output terminal as the standard in multiple output terminals. And, the differential detecting device detects a differential value between the output voltage/output current inputted from the reference output terminal and the output voltage/output current inputted from the differential testing object output terminal. The judging section judges if the unevenness of output voltage/output current outputted from the differential testing object output terminal is in the predetermined reference range according to the differential value detected from the differential testing object output terminal.
TW95115704A 2005-05-09 2006-05-03 Testing apparatus, testing method and semiconductor device TWI398647B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005136075 2005-05-09

Publications (2)

Publication Number Publication Date
TW200702676A true TW200702676A (en) 2007-01-16
TWI398647B TWI398647B (en) 2013-06-11

Family

ID=37396366

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95115704A TWI398647B (en) 2005-05-09 2006-05-03 Testing apparatus, testing method and semiconductor device

Country Status (3)

Country Link
JP (1) JP4157144B2 (en)
TW (1) TWI398647B (en)
WO (1) WO2006120853A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8433990B2 (en) 2007-05-28 2013-04-30 Advantest Corporation Semiconductor test apparatus and test method
TWI402514B (en) * 2008-09-04 2013-07-21 Advantest Corp Test device for testing device under test , transmitting device and receiving device for the test device ,and test method, transmitting method and receiving method for the test device
CN107786189A (en) * 2016-08-26 2018-03-09 精工半导体有限公司 Semiconductor device
TWI815413B (en) * 2021-06-11 2023-09-11 日商愛德萬測試股份有限公司 test device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103675633B (en) * 2012-09-11 2016-06-29 华邦电子股份有限公司 Semiconductor device and detection method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953684A (en) * 1997-03-17 1999-09-14 Hewlett-Packard Company Methods and apparatus for integrated storage of test environment context information
TW531651B (en) * 1999-05-31 2003-05-11 Advantest Corp Test apparatus for detecting tested devices and the test method of tested devices
JP3558964B2 (en) * 1999-07-23 2004-08-25 シャープ株式会社 Semiconductor integrated circuit inspection apparatus and inspection method
JP3522662B2 (en) * 1999-07-23 2004-04-26 シャープ株式会社 Inspection apparatus for semiconductor integrated circuit, inspection method thereof, and storage medium storing inspection program
JP2003202839A (en) * 2002-01-07 2003-07-18 Sony Corp Liquid crystal driving device
TW591237B (en) * 2002-07-31 2004-06-11 Advanced Semiconductor Eng Semiconductor wafer and testing method for the same
JP2004279193A (en) * 2003-03-14 2004-10-07 Matsushita Electric Ind Co Ltd Semiconductor inspection device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8433990B2 (en) 2007-05-28 2013-04-30 Advantest Corporation Semiconductor test apparatus and test method
TWI402514B (en) * 2008-09-04 2013-07-21 Advantest Corp Test device for testing device under test , transmitting device and receiving device for the test device ,and test method, transmitting method and receiving method for the test device
CN107786189A (en) * 2016-08-26 2018-03-09 精工半导体有限公司 Semiconductor device
CN107786189B (en) * 2016-08-26 2022-07-05 艾普凌科有限公司 Semiconductor device with a plurality of semiconductor chips
TWI815413B (en) * 2021-06-11 2023-09-11 日商愛德萬測試股份有限公司 test device

Also Published As

Publication number Publication date
WO2006120853A1 (en) 2006-11-16
JP4157144B2 (en) 2008-09-24
JPWO2006120853A1 (en) 2008-12-18
TWI398647B (en) 2013-06-11

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