TW200702493A - Copper etchant and method of etching copper - Google Patents

Copper etchant and method of etching copper

Info

Publication number
TW200702493A
TW200702493A TW094123685A TW94123685A TW200702493A TW 200702493 A TW200702493 A TW 200702493A TW 094123685 A TW094123685 A TW 094123685A TW 94123685 A TW94123685 A TW 94123685A TW 200702493 A TW200702493 A TW 200702493A
Authority
TW
Taiwan
Prior art keywords
copper
etching
content
etchant
oxidizer
Prior art date
Application number
TW094123685A
Other languages
Chinese (zh)
Inventor
Stanley Cheng
Original Assignee
Basf Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Ag filed Critical Basf Ag
Priority to TW094123685A priority Critical patent/TW200702493A/en
Publication of TW200702493A publication Critical patent/TW200702493A/en

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

A copper etchant includes an oxidizer, an acid, an alcohol solvent, and water is described. Wherein, the content of the oxidizer is between 1wt%-40wt%, the content of the acid is between 1wt%-90wt%, the content of the alcohol solvent is between 1wt%-50wt%, and the content of the water is between 20wt%-50wt%. Thereby, after etching the copper conductive wire is formed can provide a smooth edge cut.
TW094123685A 2005-07-13 2005-07-13 Copper etchant and method of etching copper TW200702493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094123685A TW200702493A (en) 2005-07-13 2005-07-13 Copper etchant and method of etching copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094123685A TW200702493A (en) 2005-07-13 2005-07-13 Copper etchant and method of etching copper

Publications (1)

Publication Number Publication Date
TW200702493A true TW200702493A (en) 2007-01-16

Family

ID=57910482

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123685A TW200702493A (en) 2005-07-13 2005-07-13 Copper etchant and method of etching copper

Country Status (1)

Country Link
TW (1) TW200702493A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI500819B (en) * 2012-07-24 2015-09-21 Plansee Se Etchant composition, and method for etching multi-layered metal film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI500819B (en) * 2012-07-24 2015-09-21 Plansee Se Etchant composition, and method for etching multi-layered metal film

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