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Application filed by Sigurd Microelectronics CorpfiledCriticalSigurd Microelectronics Corp
Priority to TW094120277ApriorityCriticalpatent/TW200701485A/en
Publication of TW200701485ApublicationCriticalpatent/TW200701485A/en
A package structure of light sensor comprises a substrate which has a top face and a down face on which metal lines and multiple are formed, a plurality of conductors extending through the substrate to electrically connect the metal lines of the top face and down face. A light sensor and a framework surrounding the sensor are set on the substrate. The conductors can be located in an area covered by the framework or in an area between the light sensor and the framework. A light-transmitting cover seals on the framework to complete the package structure. Besides, the substrate and the framework can be replaced by a receiving substrate that has a receiving space. The invention can raise reliability of device and quality of products according to the package structure.
TW094120277A2005-06-172005-06-17Package structure of light sensor
TW200701485A
(en)