TW200701400A - Method for processing substrate - Google Patents
Method for processing substrateInfo
- Publication number
- TW200701400A TW200701400A TW095117361A TW95117361A TW200701400A TW 200701400 A TW200701400 A TW 200701400A TW 095117361 A TW095117361 A TW 095117361A TW 95117361 A TW95117361 A TW 95117361A TW 200701400 A TW200701400 A TW 200701400A
- Authority
- TW
- Taiwan
- Prior art keywords
- bond pads
- planarization layer
- filter region
- substrate
- scribe lines
- Prior art date
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Dicing (AREA)
Abstract
A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and the bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/156,794 US7507598B2 (en) | 2003-06-06 | 2005-06-20 | Image sensor fabrication method and structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200701400A true TW200701400A (en) | 2007-01-01 |
TWI312552B TWI312552B (en) | 2009-07-21 |
Family
ID=37583604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95117361A TWI312552B (en) | 2005-06-20 | 2006-05-16 | Method for processing substrate |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1885526A (en) |
TW (1) | TWI312552B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015170702A (en) * | 2014-03-06 | 2015-09-28 | ソニー株式会社 | Solid state imaging apparatus, manufacturing method thereof and electronic apparatus |
US9252179B2 (en) * | 2014-06-13 | 2016-02-02 | Visera Technologies Company Limited | Image sensor structures |
-
2006
- 2006-05-16 TW TW95117361A patent/TWI312552B/en not_active IP Right Cessation
- 2006-05-29 CN CN 200610083628 patent/CN1885526A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1885526A (en) | 2006-12-27 |
TWI312552B (en) | 2009-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |