TW200642114A - Semiconductor light-emitting apparatus integrated with heat conducting/dissipating module - Google Patents

Semiconductor light-emitting apparatus integrated with heat conducting/dissipating module

Info

Publication number
TW200642114A
TW200642114A TW094117784A TW94117784A TW200642114A TW 200642114 A TW200642114 A TW 200642114A TW 094117784 A TW094117784 A TW 094117784A TW 94117784 A TW94117784 A TW 94117784A TW 200642114 A TW200642114 A TW 200642114A
Authority
TW
Taiwan
Prior art keywords
heat conducting
semiconductor light
emitting apparatus
carrier
dissipating module
Prior art date
Application number
TW094117784A
Other languages
Chinese (zh)
Other versions
TWI274428B (en
Inventor
Jen-Shyan Chen
Original Assignee
Jen-Shyan Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jen-Shyan Chen filed Critical Jen-Shyan Chen
Priority to TW094117784A priority Critical patent/TWI274428B/en
Publication of TW200642114A publication Critical patent/TW200642114A/en
Application granted granted Critical
Publication of TWI274428B publication Critical patent/TWI274428B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A light-emitting apparatus includes a heat conducting/dissipating module and at least one semiconductor light-emitting module. The heat conducting/dissipating module includes a heat conducting device and at least one heat-dissipating fin. The heat conducting device has at least one flat part. The at least one heat-dissipating fin is mounted on a circumference of the heat conducting device. The at least one semiconductor light-emitting module includes a carrier, a plurality of exterior electrodes, at least one semiconductor light-emitting die, and at least two conducting wires. The carrier is flatly mounted on the flat part of the heat conducting device. The plurality of exterior electrodes are disposed on the carrier. The at least one semiconductor light-emitting die is mounted on the carrier and electrically connecting to the plurality of exterior electrodes separately. The at least two conducting wires, for connecting a power or grounding, are electrically connecting to the plurality of exterior electrodes.
TW094117784A 2005-05-31 2005-05-31 Semiconductor light-emitting apparatus integrated with heat conducting/dissipating module TWI274428B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094117784A TWI274428B (en) 2005-05-31 2005-05-31 Semiconductor light-emitting apparatus integrated with heat conducting/dissipating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094117784A TWI274428B (en) 2005-05-31 2005-05-31 Semiconductor light-emitting apparatus integrated with heat conducting/dissipating module

Publications (2)

Publication Number Publication Date
TW200642114A true TW200642114A (en) 2006-12-01
TWI274428B TWI274428B (en) 2007-02-21

Family

ID=38623164

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117784A TWI274428B (en) 2005-05-31 2005-05-31 Semiconductor light-emitting apparatus integrated with heat conducting/dissipating module

Country Status (1)

Country Link
TW (1) TWI274428B (en)

Also Published As

Publication number Publication date
TWI274428B (en) 2007-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees