TW200641968A - Multi-chip stack structure - Google Patents
Multi-chip stack structureInfo
- Publication number
- TW200641968A TW200641968A TW094117010A TW94117010A TW200641968A TW 200641968 A TW200641968 A TW 200641968A TW 094117010 A TW094117010 A TW 094117010A TW 94117010 A TW94117010 A TW 94117010A TW 200641968 A TW200641968 A TW 200641968A
- Authority
- TW
- Taiwan
- Prior art keywords
- chips
- chip set
- chip
- bond pads
- stack structure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094117010A TWI255492B (en) | 2005-05-25 | 2005-05-25 | Multi-chip stack structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094117010A TWI255492B (en) | 2005-05-25 | 2005-05-25 | Multi-chip stack structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI255492B TWI255492B (en) | 2006-05-21 |
TW200641968A true TW200641968A (en) | 2006-12-01 |
Family
ID=37613265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094117010A TWI255492B (en) | 2005-05-25 | 2005-05-25 | Multi-chip stack structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI255492B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI455280B (zh) * | 2011-07-19 | 2014-10-01 | 矽品精密工業股份有限公司 | 半導體封裝件 |
TWI499028B (zh) * | 2006-12-20 | 2015-09-01 | Stats Chippac Ltd | 具有偏移堆疊晶粒之積體電路封裝件系統 |
TWI768119B (zh) * | 2018-01-15 | 2022-06-21 | 南韓商愛思開海力士有限公司 | 包含晶片堆疊的半導體封裝 |
-
2005
- 2005-05-25 TW TW094117010A patent/TWI255492B/zh active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI499028B (zh) * | 2006-12-20 | 2015-09-01 | Stats Chippac Ltd | 具有偏移堆疊晶粒之積體電路封裝件系統 |
TWI455280B (zh) * | 2011-07-19 | 2014-10-01 | 矽品精密工業股份有限公司 | 半導體封裝件 |
TWI768119B (zh) * | 2018-01-15 | 2022-06-21 | 南韓商愛思開海力士有限公司 | 包含晶片堆疊的半導體封裝 |
Also Published As
Publication number | Publication date |
---|---|
TWI255492B (en) | 2006-05-21 |
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