TW200641701A - Image capturing package structure without chassis - Google Patents

Abstract

The invention provides an image capturing package structure without chassis, which includes a substrate for carrying semiconductor devices, a high-efficiency LED, a protection layer for blocking specific light source, a photosensitive device, and a conductor and protection layer allowing light source of specific spectrum to pass therethrough and blocking non-specific light source. The high-efficiency LED, the photosensitive device and the protection layer for blocking specific light source are arranged on the substrate for carrying semiconductor devices, and are packaged to form an independent optical image capturing device via the conductor and protection layer allowing light source of specific spectrum to pass therethrough and blocking non-specific light source, thereby being able to directly capture signals from the design of optical path without having to convert optical signals as employed in the conventional optical mechanism. Accordingly, it is able to prevent the size of product from being restricted by the optical mechanism or avoid over-lengthy output path, which may result in that the optical image capturing structure is over-large or over thick, causing a problem of being unable to use or utilize the structure in the manufacture of the product.