TW200640656A - Apparatus for and method of manufacturing photosensitive laminated body - Google Patents

Apparatus for and method of manufacturing photosensitive laminated body

Info

Publication number
TW200640656A
TW200640656A TW094147679A TW94147679A TW200640656A TW 200640656 A TW200640656 A TW 200640656A TW 094147679 A TW094147679 A TW 094147679A TW 94147679 A TW94147679 A TW 94147679A TW 200640656 A TW200640656 A TW 200640656A
Authority
TW
Taiwan
Prior art keywords
mechanisms
substrate
attached
laminated body
cooling
Prior art date
Application number
TW094147679A
Other languages
Chinese (zh)
Other versions
TWI356766B (en
Inventor
Kazuyoshi Suehara
Nobuyasu Akiyoshi
Kenichi Imoto
Ryoichi Sugihara
Ryo Mori
Chiaki Suzuki
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005192070A external-priority patent/JP4774243B2/en
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200640656A publication Critical patent/TW200640656A/en
Application granted granted Critical
Publication of TWI356766B publication Critical patent/TWI356766B/en

Links

Landscapes

  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

A manufacturing apparatus (20) has first and second reel-out mechanisms (32a, 32b), first and second processing mechanisms (36a, 36b), first and second label bonding mechanisms (40a, 40b), first and second reservoir mechanisms (42a, 42b), first and second peeling mechanisms (44a, 44b), a substrate feed mechanism (45), an attachment mechanism (46), and a base peeling mechanism (186). A cooling mechanism (122) is disposed between the attachment mechanism (46) and the base peeling mechanism (186), for cooling an attached substrate (24a), the attached substrate (24a) being made up of a glass substrate (24) and a photosensitive web (22) attached thereto, from which a protective film (30) has been peeled off, together with a heating mechanism (182) for heating a resin layer, for example a cushion layer (27), inside the cooled attached substrate (24a) to within a predetermined temperature range, which is at or below the glass transition temperature.
TW94147679A 2005-03-23 2005-12-30 Apparatus for and method of manufacturing photosen TWI356766B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005083867 2005-03-23
JP2005192070A JP4774243B2 (en) 2004-07-06 2005-06-30 Photosensitive laminate manufacturing apparatus and manufacturing method

Publications (2)

Publication Number Publication Date
TW200640656A true TW200640656A (en) 2006-12-01
TWI356766B TWI356766B (en) 2012-01-21

Family

ID=46728122

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94147679A TWI356766B (en) 2005-03-23 2005-12-30 Apparatus for and method of manufacturing photosen

Country Status (1)

Country Link
TW (1) TWI356766B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405517B (en) * 2009-03-23 2013-08-11 Seho Robot Ind Co Ltd Punching machine for stiffener of fpcb
CN110065289A (en) * 2019-05-29 2019-07-30 厦门弘信电子科技股份有限公司 A kind of chip fast press automatically

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405517B (en) * 2009-03-23 2013-08-11 Seho Robot Ind Co Ltd Punching machine for stiffener of fpcb
CN110065289A (en) * 2019-05-29 2019-07-30 厦门弘信电子科技股份有限公司 A kind of chip fast press automatically

Also Published As

Publication number Publication date
TWI356766B (en) 2012-01-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees