TW200640656A - Apparatus for and method of manufacturing photosensitive laminated body - Google Patents
Apparatus for and method of manufacturing photosensitive laminated bodyInfo
- Publication number
- TW200640656A TW200640656A TW094147679A TW94147679A TW200640656A TW 200640656 A TW200640656 A TW 200640656A TW 094147679 A TW094147679 A TW 094147679A TW 94147679 A TW94147679 A TW 94147679A TW 200640656 A TW200640656 A TW 200640656A
- Authority
- TW
- Taiwan
- Prior art keywords
- mechanisms
- substrate
- attached
- laminated body
- cooling
- Prior art date
Links
Landscapes
- Laminated Bodies (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
A manufacturing apparatus (20) has first and second reel-out mechanisms (32a, 32b), first and second processing mechanisms (36a, 36b), first and second label bonding mechanisms (40a, 40b), first and second reservoir mechanisms (42a, 42b), first and second peeling mechanisms (44a, 44b), a substrate feed mechanism (45), an attachment mechanism (46), and a base peeling mechanism (186). A cooling mechanism (122) is disposed between the attachment mechanism (46) and the base peeling mechanism (186), for cooling an attached substrate (24a), the attached substrate (24a) being made up of a glass substrate (24) and a photosensitive web (22) attached thereto, from which a protective film (30) has been peeled off, together with a heating mechanism (182) for heating a resin layer, for example a cushion layer (27), inside the cooled attached substrate (24a) to within a predetermined temperature range, which is at or below the glass transition temperature.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005083867 | 2005-03-23 | ||
JP2005192070A JP4774243B2 (en) | 2004-07-06 | 2005-06-30 | Photosensitive laminate manufacturing apparatus and manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200640656A true TW200640656A (en) | 2006-12-01 |
TWI356766B TWI356766B (en) | 2012-01-21 |
Family
ID=46728122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94147679A TWI356766B (en) | 2005-03-23 | 2005-12-30 | Apparatus for and method of manufacturing photosen |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI356766B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI405517B (en) * | 2009-03-23 | 2013-08-11 | Seho Robot Ind Co Ltd | Punching machine for stiffener of fpcb |
CN110065289A (en) * | 2019-05-29 | 2019-07-30 | 厦门弘信电子科技股份有限公司 | A kind of chip fast press automatically |
-
2005
- 2005-12-30 TW TW94147679A patent/TWI356766B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI405517B (en) * | 2009-03-23 | 2013-08-11 | Seho Robot Ind Co Ltd | Punching machine for stiffener of fpcb |
CN110065289A (en) * | 2019-05-29 | 2019-07-30 | 厦门弘信电子科技股份有限公司 | A kind of chip fast press automatically |
Also Published As
Publication number | Publication date |
---|---|
TWI356766B (en) | 2012-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |