TW200640034A - Light-emitting device with a heat sinking fluid, heat sinking apparatus and heat sinking method for the same - Google Patents

Light-emitting device with a heat sinking fluid, heat sinking apparatus and heat sinking method for the same

Info

Publication number
TW200640034A
TW200640034A TW094115180A TW94115180A TW200640034A TW 200640034 A TW200640034 A TW 200640034A TW 094115180 A TW094115180 A TW 094115180A TW 94115180 A TW94115180 A TW 94115180A TW 200640034 A TW200640034 A TW 200640034A
Authority
TW
Taiwan
Prior art keywords
heat sinking
light
fluid
emitting device
light source
Prior art date
Application number
TW094115180A
Other languages
Chinese (zh)
Other versions
TWI284428B (en
Inventor
Mao-Sheng Huang
Tsung-Ham Su
Wen-Chun Liu
Ying-Hui Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094115180A priority Critical patent/TWI284428B/en
Publication of TW200640034A publication Critical patent/TW200640034A/en
Application granted granted Critical
Publication of TWI284428B publication Critical patent/TWI284428B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

A light-emitting device including with a heat sinking fluid comprises a light source, a heat sinking fluid encapsulating the light source, a container for containing the heat sinking fluid. The light source is a light-emitting diode or an encapsulated light-emitting diode, and the heat sinking fluid can contact the light-emitting device directly or indirectly via a heat sinking plate. The heat sinking fluid can be white oil such as marcol 82, and the containing can be made of glass or acrylic. Compared to the prior art, the present invention uses the heat sinking fluid to transfer heat generated by the light source rapidly to the environment, heat will not be accumulated around the light source, and the emitting intensity and efficiency of the light-emitting device can be increased.
TW094115180A 2005-05-11 2005-05-11 Light-emitting device with a heat sinking fluid TWI284428B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094115180A TWI284428B (en) 2005-05-11 2005-05-11 Light-emitting device with a heat sinking fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094115180A TWI284428B (en) 2005-05-11 2005-05-11 Light-emitting device with a heat sinking fluid

Publications (2)

Publication Number Publication Date
TW200640034A true TW200640034A (en) 2006-11-16
TWI284428B TWI284428B (en) 2007-07-21

Family

ID=39455109

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115180A TWI284428B (en) 2005-05-11 2005-05-11 Light-emitting device with a heat sinking fluid

Country Status (1)

Country Link
TW (1) TWI284428B (en)

Also Published As

Publication number Publication date
TWI284428B (en) 2007-07-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees