TW200635775A - Bonded type thermosetting dipping resin sheet - Google Patents

Bonded type thermosetting dipping resin sheet

Info

Publication number
TW200635775A
TW200635775A TW094111720A TW94111720A TW200635775A TW 200635775 A TW200635775 A TW 200635775A TW 094111720 A TW094111720 A TW 094111720A TW 94111720 A TW94111720 A TW 94111720A TW 200635775 A TW200635775 A TW 200635775A
Authority
TW
Taiwan
Prior art keywords
type thermosetting
bonded type
dipping resin
dipping
resin
Prior art date
Application number
TW094111720A
Other languages
English (en)
Other versions
TWI280919B (en
Inventor
chao-hui Guo
xiao-hang Zhong
Jian Liu
Jing Li
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works filed Critical Illinois Tool Works
Priority to TW94111720A priority Critical patent/TWI280919B/zh
Publication of TW200635775A publication Critical patent/TW200635775A/zh
Application granted granted Critical
Publication of TWI280919B publication Critical patent/TWI280919B/zh

Links

Landscapes

  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
TW94111720A 2005-04-13 2005-04-13 Bonded type thermosetting dipping resin sheet TWI280919B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94111720A TWI280919B (en) 2005-04-13 2005-04-13 Bonded type thermosetting dipping resin sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94111720A TWI280919B (en) 2005-04-13 2005-04-13 Bonded type thermosetting dipping resin sheet

Publications (2)

Publication Number Publication Date
TW200635775A true TW200635775A (en) 2006-10-16
TWI280919B TWI280919B (en) 2007-05-11

Family

ID=38741550

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94111720A TWI280919B (en) 2005-04-13 2005-04-13 Bonded type thermosetting dipping resin sheet

Country Status (1)

Country Link
TW (1) TWI280919B (zh)

Also Published As

Publication number Publication date
TWI280919B (en) 2007-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees