TW200634431A - Photosensitive resin and a method of preparing the same - Google Patents
Photosensitive resin and a method of preparing the sameInfo
- Publication number
- TW200634431A TW200634431A TW095104756A TW95104756A TW200634431A TW 200634431 A TW200634431 A TW 200634431A TW 095104756 A TW095104756 A TW 095104756A TW 95104756 A TW95104756 A TW 95104756A TW 200634431 A TW200634431 A TW 200634431A
- Authority
- TW
- Taiwan
- Prior art keywords
- preparing
- same
- photosensitive resin
- mole
- organic group
- Prior art date
Links
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
A polyimide resin having a number average molecular weight of from 2,000 to 800,000 and a repeating unit represented by the following formula (1): wherein X is a tetravalent organic group, Y is a divalent organic group, 75 to 98 mole % of R 1 is hydrogen atom, and 2 to 25 mole % of R 1 is 1,2-naphthoquinonediazide sulfonyl group.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005036394 | 2005-02-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200634431A true TW200634431A (en) | 2006-10-01 |
TWI392962B TWI392962B (en) | 2013-04-11 |
Family
ID=48803328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95104756A TWI392962B (en) | 2005-02-14 | 2006-02-13 | Photosensitive resin composition and method for producing the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI392962B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105001421A (en) * | 2015-07-03 | 2015-10-28 | 中科院广州化学有限公司南雄材料生产基地 | Preparation of polyimide solid powder containing phenolic hydroxyl group and application thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100347611C (en) * | 2001-07-03 | 2007-11-07 | 日立化成工业株式会社 | Photosensitive resin composition, method for producing pattern and electronic parts |
JP2004310076A (en) * | 2003-03-26 | 2004-11-04 | Sumitomo Bakelite Co Ltd | Positive photosensitive resin composition, and semiconductor device and display element |
-
2006
- 2006-02-13 TW TW95104756A patent/TWI392962B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI392962B (en) | 2013-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |