TW200634431A - Photosensitive resin and a method of preparing the same - Google Patents

Photosensitive resin and a method of preparing the same

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Publication number
TW200634431A
TW200634431A TW095104756A TW95104756A TW200634431A TW 200634431 A TW200634431 A TW 200634431A TW 095104756 A TW095104756 A TW 095104756A TW 95104756 A TW95104756 A TW 95104756A TW 200634431 A TW200634431 A TW 200634431A
Authority
TW
Taiwan
Prior art keywords
preparing
same
photosensitive resin
mole
organic group
Prior art date
Application number
TW095104756A
Other languages
Chinese (zh)
Other versions
TWI392962B (en
Inventor
Yoshitaka Aoki
Michihiro Sugo
Hideto Kato
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200634431A publication Critical patent/TW200634431A/en
Application granted granted Critical
Publication of TWI392962B publication Critical patent/TWI392962B/en

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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

A polyimide resin having a number average molecular weight of from 2,000 to 800,000 and a repeating unit represented by the following formula (1): wherein X is a tetravalent organic group, Y is a divalent organic group, 75 to 98 mole % of R 1 is hydrogen atom, and 2 to 25 mole % of R 1 is 1,2-naphthoquinonediazide sulfonyl group.
TW95104756A 2005-02-14 2006-02-13 Photosensitive resin composition and method for producing the same TWI392962B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005036394 2005-02-14

Publications (2)

Publication Number Publication Date
TW200634431A true TW200634431A (en) 2006-10-01
TWI392962B TWI392962B (en) 2013-04-11

Family

ID=48803328

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95104756A TWI392962B (en) 2005-02-14 2006-02-13 Photosensitive resin composition and method for producing the same

Country Status (1)

Country Link
TW (1) TWI392962B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105001421A (en) * 2015-07-03 2015-10-28 中科院广州化学有限公司南雄材料生产基地 Preparation of polyimide solid powder containing phenolic hydroxyl group and application thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100347611C (en) * 2001-07-03 2007-11-07 日立化成工业株式会社 Photosensitive resin composition, method for producing pattern and electronic parts
JP2004310076A (en) * 2003-03-26 2004-11-04 Sumitomo Bakelite Co Ltd Positive photosensitive resin composition, and semiconductor device and display element

Also Published As

Publication number Publication date
TWI392962B (en) 2013-04-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees