TW200634272A - Process for a thin-plated heat pipe - Google Patents

Process for a thin-plated heat pipe

Info

Publication number
TW200634272A
TW200634272A TW094109573A TW94109573A TW200634272A TW 200634272 A TW200634272 A TW 200634272A TW 094109573 A TW094109573 A TW 094109573A TW 94109573 A TW94109573 A TW 94109573A TW 200634272 A TW200634272 A TW 200634272A
Authority
TW
Taiwan
Prior art keywords
thin
heat pipe
suction disk
insufficiency
plated heat
Prior art date
Application number
TW094109573A
Other languages
Chinese (zh)
Other versions
TWI288812B (en
Inventor
Pei-Pei Chen
xiu-wei Yang
Jau-Ching Lin
Wen-Hua Yu
Yan-Wen Chen
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW94109573A priority Critical patent/TWI288812B/en
Priority to US11/219,605 priority patent/US7469740B2/en
Priority to US11/219,001 priority patent/US7461450B2/en
Publication of TW200634272A publication Critical patent/TW200634272A/en
Application granted granted Critical
Publication of TWI288812B publication Critical patent/TWI288812B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention is about process for a thin-plated heat pipe. This process comprises an electronic packaging, opening of the packaging forming a substantially flat surface, and a suction disk performing the aspirating and filling operation. This suction disk comprises a distorted part and a hole that pierces through it. The outer edge of the distorted part forms a suction ring that adheres to its surface. The first and second clamping elements will be pressed by this surface in normal direction to seal the opening. This process will improve the insufficiency of sealing through welding and gluing. The suction disk can be used multiple times. In the traditional process, when the clamping force is removed, a tight seal cannot be reached. This new process can improve the insufficiency of the existing process.
TW94109573A 2005-03-28 2005-03-28 Process for a thin-plated heat pipe TWI288812B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW94109573A TWI288812B (en) 2005-03-28 2005-03-28 Process for a thin-plated heat pipe
US11/219,605 US7469740B2 (en) 2005-03-28 2005-09-02 Heat dissipating device
US11/219,001 US7461450B2 (en) 2005-03-28 2005-09-02 Method for making a heat dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94109573A TWI288812B (en) 2005-03-28 2005-03-28 Process for a thin-plated heat pipe

Publications (2)

Publication Number Publication Date
TW200634272A true TW200634272A (en) 2006-10-01
TWI288812B TWI288812B (en) 2007-10-21

Family

ID=39228461

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94109573A TWI288812B (en) 2005-03-28 2005-03-28 Process for a thin-plated heat pipe

Country Status (1)

Country Link
TW (1) TWI288812B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423856B (en) * 2010-02-05 2014-01-21

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI798538B (en) * 2020-03-11 2023-04-11 汎海科技股份有限公司 Heat dissipating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423856B (en) * 2010-02-05 2014-01-21

Also Published As

Publication number Publication date
TWI288812B (en) 2007-10-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees