TW200634272A - Process for a thin-plated heat pipe - Google Patents
Process for a thin-plated heat pipeInfo
- Publication number
- TW200634272A TW200634272A TW094109573A TW94109573A TW200634272A TW 200634272 A TW200634272 A TW 200634272A TW 094109573 A TW094109573 A TW 094109573A TW 94109573 A TW94109573 A TW 94109573A TW 200634272 A TW200634272 A TW 200634272A
- Authority
- TW
- Taiwan
- Prior art keywords
- thin
- heat pipe
- suction disk
- insufficiency
- plated heat
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention is about process for a thin-plated heat pipe. This process comprises an electronic packaging, opening of the packaging forming a substantially flat surface, and a suction disk performing the aspirating and filling operation. This suction disk comprises a distorted part and a hole that pierces through it. The outer edge of the distorted part forms a suction ring that adheres to its surface. The first and second clamping elements will be pressed by this surface in normal direction to seal the opening. This process will improve the insufficiency of sealing through welding and gluing. The suction disk can be used multiple times. In the traditional process, when the clamping force is removed, a tight seal cannot be reached. This new process can improve the insufficiency of the existing process.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94109573A TWI288812B (en) | 2005-03-28 | 2005-03-28 | Process for a thin-plated heat pipe |
US11/219,605 US7469740B2 (en) | 2005-03-28 | 2005-09-02 | Heat dissipating device |
US11/219,001 US7461450B2 (en) | 2005-03-28 | 2005-09-02 | Method for making a heat dissipating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94109573A TWI288812B (en) | 2005-03-28 | 2005-03-28 | Process for a thin-plated heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200634272A true TW200634272A (en) | 2006-10-01 |
TWI288812B TWI288812B (en) | 2007-10-21 |
Family
ID=39228461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94109573A TWI288812B (en) | 2005-03-28 | 2005-03-28 | Process for a thin-plated heat pipe |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI288812B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI423856B (en) * | 2010-02-05 | 2014-01-21 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI798538B (en) * | 2020-03-11 | 2023-04-11 | 汎海科技股份有限公司 | Heat dissipating device |
-
2005
- 2005-03-28 TW TW94109573A patent/TWI288812B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI423856B (en) * | 2010-02-05 | 2014-01-21 |
Also Published As
Publication number | Publication date |
---|---|
TWI288812B (en) | 2007-10-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |