TW200634271A - Process of a thin-plate heat pipe and the products - Google Patents
Process of a thin-plate heat pipe and the productsInfo
- Publication number
- TW200634271A TW200634271A TW094109266A TW94109266A TW200634271A TW 200634271 A TW200634271 A TW 200634271A TW 094109266 A TW094109266 A TW 094109266A TW 94109266 A TW94109266 A TW 94109266A TW 200634271 A TW200634271 A TW 200634271A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat pipe
- thin
- plate heat
- products
- plate
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94109266A TWI267618B (en) | 2005-03-25 | 2005-03-25 | Process of a thin-plate heat pipe and the products |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94109266A TWI267618B (en) | 2005-03-25 | 2005-03-25 | Process of a thin-plate heat pipe and the products |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200634271A true TW200634271A (en) | 2006-10-01 |
TWI267618B TWI267618B (en) | 2006-12-01 |
Family
ID=38220386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94109266A TWI267618B (en) | 2005-03-25 | 2005-03-25 | Process of a thin-plate heat pipe and the products |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI267618B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI773292B (zh) * | 2021-04-30 | 2022-08-01 | 奕昌有限公司 | 毛細結構的製造方法及具有該毛細結構的散熱元件 |
-
2005
- 2005-03-25 TW TW94109266A patent/TWI267618B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI773292B (zh) * | 2021-04-30 | 2022-08-01 | 奕昌有限公司 | 毛細結構的製造方法及具有該毛細結構的散熱元件 |
Also Published As
Publication number | Publication date |
---|---|
TWI267618B (en) | 2006-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |