TW200633855A - Adhesiveless bonding method for plastic substrates - Google Patents

Adhesiveless bonding method for plastic substrates

Info

Publication number
TW200633855A
TW200633855A TW094108043A TW94108043A TW200633855A TW 200633855 A TW200633855 A TW 200633855A TW 094108043 A TW094108043 A TW 094108043A TW 94108043 A TW94108043 A TW 94108043A TW 200633855 A TW200633855 A TW 200633855A
Authority
TW
Taiwan
Prior art keywords
plastic substrate
connecting surface
bonding method
plastic substrates
plastic
Prior art date
Application number
TW094108043A
Other languages
Chinese (zh)
Other versions
TWI275487B (en
Inventor
Che-Hsin Lin
Yue-Feng Lin
Original Assignee
Univ Nat Sun Yat Sen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Sun Yat Sen filed Critical Univ Nat Sun Yat Sen
Priority to TW94108043A priority Critical patent/TWI275487B/en
Publication of TW200633855A publication Critical patent/TW200633855A/en
Application granted granted Critical
Publication of TWI275487B publication Critical patent/TWI275487B/en

Links

Abstract

An adhesiveless bonding method for plastic substrates comprises the following steps: fabricating at least one first plastic substrate provided with at least one first connecting surface; fabricating at least one second plastic substrate correspondingly provided with at least one second connecting surface; atmospheric plasma treating the first connecting surface of the first plastic substrate and the second connecting surface of the second plastic substrate for improving bonding properties of the first connecting surface and the second connecting surface; and, pressing the first plastic substrate and the second plastic substrate in connecting the first connecting surface with the second connecting surface so as to integrate the first plastic substrate and the second plastic substrate into a unit.
TW94108043A 2005-03-16 2005-03-16 Adhesiveless bonding method for plastic substrates TWI275487B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94108043A TWI275487B (en) 2005-03-16 2005-03-16 Adhesiveless bonding method for plastic substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94108043A TWI275487B (en) 2005-03-16 2005-03-16 Adhesiveless bonding method for plastic substrates

Publications (2)

Publication Number Publication Date
TW200633855A true TW200633855A (en) 2006-10-01
TWI275487B TWI275487B (en) 2007-03-11

Family

ID=38645958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94108043A TWI275487B (en) 2005-03-16 2005-03-16 Adhesiveless bonding method for plastic substrates

Country Status (1)

Country Link
TW (1) TWI275487B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102689484A (en) * 2011-03-25 2012-09-26 韶阳科技股份有限公司 Method for bonding base material mainly including fluoro-based material modified by atmosphere plasmas with substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010032728A1 (en) * 2008-09-16 2010-03-25 株式会社朝日ラバー Bonded object of three-dimensional silicone rubber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102689484A (en) * 2011-03-25 2012-09-26 韶阳科技股份有限公司 Method for bonding base material mainly including fluoro-based material modified by atmosphere plasmas with substrate

Also Published As

Publication number Publication date
TWI275487B (en) 2007-03-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees