TW200633855A - Adhesiveless bonding method for plastic substrates - Google Patents
Adhesiveless bonding method for plastic substratesInfo
- Publication number
- TW200633855A TW200633855A TW094108043A TW94108043A TW200633855A TW 200633855 A TW200633855 A TW 200633855A TW 094108043 A TW094108043 A TW 094108043A TW 94108043 A TW94108043 A TW 94108043A TW 200633855 A TW200633855 A TW 200633855A
- Authority
- TW
- Taiwan
- Prior art keywords
- plastic substrate
- connecting surface
- bonding method
- plastic substrates
- plastic
- Prior art date
Links
Abstract
An adhesiveless bonding method for plastic substrates comprises the following steps: fabricating at least one first plastic substrate provided with at least one first connecting surface; fabricating at least one second plastic substrate correspondingly provided with at least one second connecting surface; atmospheric plasma treating the first connecting surface of the first plastic substrate and the second connecting surface of the second plastic substrate for improving bonding properties of the first connecting surface and the second connecting surface; and, pressing the first plastic substrate and the second plastic substrate in connecting the first connecting surface with the second connecting surface so as to integrate the first plastic substrate and the second plastic substrate into a unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94108043A TWI275487B (en) | 2005-03-16 | 2005-03-16 | Adhesiveless bonding method for plastic substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94108043A TWI275487B (en) | 2005-03-16 | 2005-03-16 | Adhesiveless bonding method for plastic substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200633855A true TW200633855A (en) | 2006-10-01 |
TWI275487B TWI275487B (en) | 2007-03-11 |
Family
ID=38645958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94108043A TWI275487B (en) | 2005-03-16 | 2005-03-16 | Adhesiveless bonding method for plastic substrates |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI275487B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102689484A (en) * | 2011-03-25 | 2012-09-26 | 韶阳科技股份有限公司 | Method for bonding base material mainly including fluoro-based material modified by atmosphere plasmas with substrate |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010032728A1 (en) * | 2008-09-16 | 2010-03-25 | 株式会社朝日ラバー | Bonded object of three-dimensional silicone rubber |
-
2005
- 2005-03-16 TW TW94108043A patent/TWI275487B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102689484A (en) * | 2011-03-25 | 2012-09-26 | 韶阳科技股份有限公司 | Method for bonding base material mainly including fluoro-based material modified by atmosphere plasmas with substrate |
Also Published As
Publication number | Publication date |
---|---|
TWI275487B (en) | 2007-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |