TW200631147A - Heat spreader and application thereof - Google Patents

Heat spreader and application thereof

Info

Publication number
TW200631147A
TW200631147A TW094105751A TW94105751A TW200631147A TW 200631147 A TW200631147 A TW 200631147A TW 094105751 A TW094105751 A TW 094105751A TW 94105751 A TW94105751 A TW 94105751A TW 200631147 A TW200631147 A TW 200631147A
Authority
TW
Taiwan
Prior art keywords
heat spreader
application
heat
suited
clamping
Prior art date
Application number
TW094105751A
Other languages
Chinese (zh)
Other versions
TWI267179B (en
Inventor
Jun-Cheng Liu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094105751A priority Critical patent/TWI267179B/en
Publication of TW200631147A publication Critical patent/TW200631147A/en
Application granted granted Critical
Publication of TWI267179B publication Critical patent/TWI267179B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

A heat spreader suited for chip package structure is provided. The heat slug is designed with a cambered surface in the central area of the top portion to reduce the deformation produced by the clamping of the mold tooling.
TW094105751A 2005-02-25 2005-02-25 Heat spreader and application thereof TWI267179B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094105751A TWI267179B (en) 2005-02-25 2005-02-25 Heat spreader and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094105751A TWI267179B (en) 2005-02-25 2005-02-25 Heat spreader and application thereof

Publications (2)

Publication Number Publication Date
TW200631147A true TW200631147A (en) 2006-09-01
TWI267179B TWI267179B (en) 2006-11-21

Family

ID=38191776

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105751A TWI267179B (en) 2005-02-25 2005-02-25 Heat spreader and application thereof

Country Status (1)

Country Link
TW (1) TWI267179B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI453871B (en) * 2011-01-26 2014-09-21 Powertech Technology Inc Chip encapsulating mold chase and chip encapsulating method

Also Published As

Publication number Publication date
TWI267179B (en) 2006-11-21

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