Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW94101545ApriorityCriticalpatent/TWI289089B/en
Publication of TW200626288ApublicationCriticalpatent/TW200626288A/en
Application grantedgrantedCritical
Publication of TWI289089BpublicationCriticalpatent/TWI289089B/en
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices
(AREA)
Abstract
Disclosed is a method for improving HSS CMP performance. After performing a HSS CMP process for a predetermined time, DI water is introduced and the polishing process is continued, so that the CMP rate and performance can be improved.
TW94101545A2005-01-192005-01-19Method for improving HSS CMP performance
TWI289089B
(en)
Method for producing water containing metal ion and water treatment method using said production method, and tool for producing water containing metal ion and water treatment device using said production tool