TW200624820A - Reinforced probes for testing semiconductor devices - Google Patents
Reinforced probes for testing semiconductor devicesInfo
- Publication number
- TW200624820A TW200624820A TW094124701A TW94124701A TW200624820A TW 200624820 A TW200624820 A TW 200624820A TW 094124701 A TW094124701 A TW 094124701A TW 94124701 A TW94124701 A TW 94124701A TW 200624820 A TW200624820 A TW 200624820A
- Authority
- TW
- Taiwan
- Prior art keywords
- probes
- reinforced
- semiconductor devices
- testing semiconductor
- substrate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58961804P | 2004-07-21 | 2004-07-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200624820A true TW200624820A (en) | 2006-07-16 |
Family
ID=35169676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094124701A TW200624820A (en) | 2004-07-21 | 2005-07-21 | Reinforced probes for testing semiconductor devices |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060028220A1 (zh) |
EP (1) | EP1831703A1 (zh) |
KR (1) | KR20070083499A (zh) |
TW (1) | TW200624820A (zh) |
WO (1) | WO2006014635A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1853930A1 (en) * | 2005-02-24 | 2007-11-14 | SV Probe Pte Ltd. | Probes for a wafer test apparatus |
WO2007002297A2 (en) | 2005-06-24 | 2007-01-04 | Crafts Douglas E | Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures |
US7731503B2 (en) * | 2006-08-21 | 2010-06-08 | Formfactor, Inc. | Carbon nanotube contact structures |
US7836587B2 (en) * | 2006-09-21 | 2010-11-23 | Formfactor, Inc. | Method of repairing a contactor apparatus |
US8130007B2 (en) * | 2006-10-16 | 2012-03-06 | Formfactor, Inc. | Probe card assembly with carbon nanotube probes having a spring mechanism therein |
US8354855B2 (en) * | 2006-10-16 | 2013-01-15 | Formfactor, Inc. | Carbon nanotube columns and methods of making and using carbon nanotube columns as probes |
US8149007B2 (en) * | 2007-10-13 | 2012-04-03 | Formfactor, Inc. | Carbon nanotube spring contact structures with mechanical and electrical components |
US8272124B2 (en) | 2009-04-03 | 2012-09-25 | Formfactor, Inc. | Anchoring carbon nanotube columns |
US20100252317A1 (en) * | 2009-04-03 | 2010-10-07 | Formfactor, Inc. | Carbon nanotube contact structures for use with semiconductor dies and other electronic devices |
US8872176B2 (en) | 2010-10-06 | 2014-10-28 | Formfactor, Inc. | Elastic encapsulated carbon nanotube based electrical contacts |
JP6392630B2 (ja) * | 2014-10-28 | 2018-09-19 | 京セラ株式会社 | 回路基板および回路装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4837622A (en) * | 1985-05-10 | 1989-06-06 | Micro-Probe, Inc. | High density probe card |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5829128A (en) * | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
US4909070A (en) * | 1987-10-12 | 1990-03-20 | Smith Jeffery B | Moisture sensor |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US5334804A (en) * | 1992-11-17 | 1994-08-02 | Fujitsu Limited | Wire interconnect structures for connecting an integrated circuit to a substrate |
US5810607A (en) * | 1995-09-13 | 1998-09-22 | International Business Machines Corporation | Interconnector with contact pads having enhanced durability |
US5441690A (en) * | 1993-07-06 | 1995-08-15 | International Business Machines Corporation | Process of making pinless connector |
US6246247B1 (en) * | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6336269B1 (en) * | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
JPH0886810A (ja) * | 1994-09-16 | 1996-04-02 | Denki Kagaku Kogyo Kk | プローブピン組立体の製造方法 |
US6727579B1 (en) * | 1994-11-16 | 2004-04-27 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US5903161A (en) * | 1995-01-26 | 1999-05-11 | Denki Kagaku Kogyo Kabushiki Kaisha | Electrically conductive rod-shaped single crystal product and assembly for measuring electrical properties employing such product, as well as processes for their production |
US5785538A (en) * | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
US5644249A (en) * | 1996-06-07 | 1997-07-01 | Probe Technology | Method and circuit testing apparatus for equalizing a contact force between probes and pads |
US6307161B1 (en) * | 1996-09-10 | 2001-10-23 | Formfactor, Inc. | Partially-overcoated elongate contact structures |
US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
JP3160583B2 (ja) * | 1999-01-27 | 2001-04-25 | 日本特殊陶業株式会社 | 樹脂製基板 |
US7215131B1 (en) * | 1999-06-07 | 2007-05-08 | Formfactor, Inc. | Segmented contactor |
JP2001174482A (ja) * | 1999-12-21 | 2001-06-29 | Toshiba Corp | 電気的特性評価用接触針、プローブ構造体、プローブカード、および電気的特性評価用接触針の製造方法 |
US6998857B2 (en) * | 2001-09-20 | 2006-02-14 | Yamaha Corporation | Probe unit and its manufacture |
JP4054208B2 (ja) * | 2002-04-01 | 2008-02-27 | 富士通株式会社 | コンタクタの製造方法 |
US6831017B1 (en) * | 2002-04-05 | 2004-12-14 | Integrated Nanosystems, Inc. | Catalyst patterning for nanowire devices |
-
2005
- 2005-07-19 KR KR1020077004112A patent/KR20070083499A/ko not_active Application Discontinuation
- 2005-07-19 EP EP05781460A patent/EP1831703A1/en not_active Withdrawn
- 2005-07-19 WO PCT/US2005/025563 patent/WO2006014635A1/en active Application Filing
- 2005-07-19 US US11/184,581 patent/US20060028220A1/en not_active Abandoned
- 2005-07-21 TW TW094124701A patent/TW200624820A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20070083499A (ko) | 2007-08-24 |
US20060028220A1 (en) | 2006-02-09 |
WO2006014635A1 (en) | 2006-02-09 |
EP1831703A1 (en) | 2007-09-12 |
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