TW200623387A - A static discharge prevention device for flip-chip semiconductor of encapsulating compound and method of its formation - Google Patents

A static discharge prevention device for flip-chip semiconductor of encapsulating compound and method of its formation

Info

Publication number
TW200623387A
TW200623387A TW093139294A TW93139294A TW200623387A TW 200623387 A TW200623387 A TW 200623387A TW 093139294 A TW093139294 A TW 093139294A TW 93139294 A TW93139294 A TW 93139294A TW 200623387 A TW200623387 A TW 200623387A
Authority
TW
Taiwan
Prior art keywords
flip
chip semiconductor
formation
static discharge
prevention device
Prior art date
Application number
TW093139294A
Other languages
English (en)
Chinese (zh)
Other versions
TWI353050B (enExample
Inventor
Guo-Enn Chang
Original Assignee
Guo-Enn Chang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guo-Enn Chang filed Critical Guo-Enn Chang
Priority to TW093139294A priority Critical patent/TW200623387A/zh
Publication of TW200623387A publication Critical patent/TW200623387A/zh
Application granted granted Critical
Publication of TWI353050B publication Critical patent/TWI353050B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW093139294A 2004-12-16 2004-12-16 A static discharge prevention device for flip-chip semiconductor of encapsulating compound and method of its formation TW200623387A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093139294A TW200623387A (en) 2004-12-16 2004-12-16 A static discharge prevention device for flip-chip semiconductor of encapsulating compound and method of its formation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093139294A TW200623387A (en) 2004-12-16 2004-12-16 A static discharge prevention device for flip-chip semiconductor of encapsulating compound and method of its formation

Publications (2)

Publication Number Publication Date
TW200623387A true TW200623387A (en) 2006-07-01
TWI353050B TWI353050B (enExample) 2011-11-21

Family

ID=46728060

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139294A TW200623387A (en) 2004-12-16 2004-12-16 A static discharge prevention device for flip-chip semiconductor of encapsulating compound and method of its formation

Country Status (1)

Country Link
TW (1) TW200623387A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI594467B (zh) * 2012-08-07 2017-08-01 皇家飛利浦有限公司 發光二極體封裝及製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI594467B (zh) * 2012-08-07 2017-08-01 皇家飛利浦有限公司 發光二極體封裝及製造方法

Also Published As

Publication number Publication date
TWI353050B (enExample) 2011-11-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees