TW200622565A - Structure of heat dissipation layout for interface card - Google Patents

Structure of heat dissipation layout for interface card

Info

Publication number
TW200622565A
TW200622565A TW093141702A TW93141702A TW200622565A TW 200622565 A TW200622565 A TW 200622565A TW 093141702 A TW093141702 A TW 093141702A TW 93141702 A TW93141702 A TW 93141702A TW 200622565 A TW200622565 A TW 200622565A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
interface card
fan
heat
electronic device
Prior art date
Application number
TW093141702A
Other languages
Chinese (zh)
Other versions
TWI273381B (en
Inventor
Spring Liu
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW93141702A priority Critical patent/TWI273381B/en
Publication of TW200622565A publication Critical patent/TW200622565A/en
Application granted granted Critical
Publication of TWI273381B publication Critical patent/TWI273381B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A structure of heat dissipation layout applicable to an electronic device is disclosed, which comprises: a heat dissipation device deposed on the circuit board of the electronic device, wherein the heat dissipation device comprises a heat sink and a fan, and the heat sink has a room to contain the fan; and an interface card electrically coupled to the circuit board of the electronic device via a connector, wherein at least one surface of the interface card is deposed with a semiconductor device and the surface with the semiconductor devices is placed against the heat dissipation device in an upside-down manner, so as to dissipate the heat produced by the operation of the semiconductor device by the heat sink and the fan.
TW93141702A 2004-12-31 2004-12-31 Structure of heat dissipation layout for interface card TWI273381B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93141702A TWI273381B (en) 2004-12-31 2004-12-31 Structure of heat dissipation layout for interface card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93141702A TWI273381B (en) 2004-12-31 2004-12-31 Structure of heat dissipation layout for interface card

Publications (2)

Publication Number Publication Date
TW200622565A true TW200622565A (en) 2006-07-01
TWI273381B TWI273381B (en) 2007-02-11

Family

ID=38621495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93141702A TWI273381B (en) 2004-12-31 2004-12-31 Structure of heat dissipation layout for interface card

Country Status (1)

Country Link
TW (1) TWI273381B (en)

Also Published As

Publication number Publication date
TWI273381B (en) 2007-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees