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Application filed by Shih-Chiang LinfiledCriticalShih-Chiang Lin
Priority to TW093138842ApriorityCriticalpatent/TW200620600A/en
Publication of TW200620600ApublicationCriticalpatent/TW200620600A/en
Cooling Or The Like Of Semiconductors Or Solid State Devices
(AREA)
Abstract
An IC package enwrap by heat sink, it's combine with IC. chips, discrete components, PCB, lead pins, heat sink and expoxy glue. Assembly all electrical parts and lead pins on PCB become a module, then insert this module into a slot of heat sink and envelop expoxy glue between heat sink and module become an IC package with heat sink .
TW093138842A2004-12-152004-12-15An IC package enwrap by heat sink
TW200620600A
(en)