TW200620444A - Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups - Google Patents

Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups

Info

Publication number
TW200620444A
TW200620444A TW094129296A TW94129296A TW200620444A TW 200620444 A TW200620444 A TW 200620444A TW 094129296 A TW094129296 A TW 094129296A TW 94129296 A TW94129296 A TW 94129296A TW 200620444 A TW200620444 A TW 200620444A
Authority
TW
Taiwan
Prior art keywords
semiconductor wafers
unload cups
pivotable load
polishing semiconductor
objects
Prior art date
Application number
TW094129296A
Other languages
English (en)
Inventor
In-Kwon Jeong
Original Assignee
In-Kwon Jeong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by In-Kwon Jeong filed Critical In-Kwon Jeong
Publication of TW200620444A publication Critical patent/TW200620444A/zh

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW094129296A 2004-08-30 2005-08-26 Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups TW200620444A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60569804P 2004-08-30 2004-08-30

Publications (1)

Publication Number Publication Date
TW200620444A true TW200620444A (en) 2006-06-16

Family

ID=38880883

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129296A TW200620444A (en) 2004-08-30 2005-08-26 Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups

Country Status (2)

Country Link
CN (1) CN101068657A (zh)
TW (1) TW200620444A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10513006B2 (en) * 2013-02-04 2019-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. High throughput CMP platform
KR102546838B1 (ko) * 2018-03-26 2023-06-23 주식회사 케이씨텍 기판 처리 장치
CN110103119A (zh) * 2018-09-20 2019-08-09 杭州众硅电子科技有限公司 一种抛光装卸部件模块

Also Published As

Publication number Publication date
CN101068657A (zh) 2007-11-07

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