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Application filed by Au Optronics CorpfiledCriticalAu Optronics Corp
Priority to TW93138714ApriorityCriticalpatent/TWI297364B/en
Publication of TW200619426ApublicationCriticalpatent/TW200619426A/en
Application grantedgrantedCritical
Publication of TWI297364BpublicationCriticalpatent/TWI297364B/en
An etching liquid reclaim system comprises an etch tank, an etch solution supply device, an impurity removal device and a blending and concentration adjusting device. The etch solution supply device supplies an etch solution to the etch tank for etching. An impurity-containing waste is produced by the etching. The impurity removal device receives the waste and removes the impurity thereof to form a reclaim etch solution. The concentration of the reclaim etch solution is adjusted by blending one or more acids thereto by the blending device.
TW93138714A2004-12-142004-12-14Etching liquid reclaim system and method
TWI297364B
(en)
Fabrication of a thin film for transfer from a source substrate to a target substrate by implantation of two chemical species at different depths to form an embrittled zone, notably to form DRAM