TW200618082A - Cleaning member and cleaning method of substrate processing equipment - Google Patents

Cleaning member and cleaning method of substrate processing equipment

Info

Publication number
TW200618082A
TW200618082A TW094123130A TW94123130A TW200618082A TW 200618082 A TW200618082 A TW 200618082A TW 094123130 A TW094123130 A TW 094123130A TW 94123130 A TW94123130 A TW 94123130A TW 200618082 A TW200618082 A TW 200618082A
Authority
TW
Taiwan
Prior art keywords
cleaning
substrate processing
processing equipment
cleaning member
cleaning method
Prior art date
Application number
TW094123130A
Other languages
Chinese (zh)
Inventor
Yoshio Terada
Nobuaki Maruoka
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200618082A publication Critical patent/TW200618082A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)

Abstract

A cleaning member comprising a cleaning layer which is non-adhesive at the temperature range of 25 to 200 DEG C and has a tensile elastic modulus (Young's modulus) of 3,000 MPa or less, particularly preferably 100 MPa or less, a cleaning sheet having the above cleaning layer as such a cleaning member, or a carrying member with a cleaning function having the above cleaning layer on the carrying member.
TW094123130A 2004-07-08 2005-07-08 Cleaning member and cleaning method of substrate processing equipment TW200618082A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004201260 2004-07-08
JP2005146522A JP2006049827A (en) 2004-07-08 2005-05-19 Cleaning member and method of cleaning substrate processor

Publications (1)

Publication Number Publication Date
TW200618082A true TW200618082A (en) 2006-06-01

Family

ID=35539748

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123130A TW200618082A (en) 2004-07-08 2005-07-08 Cleaning member and cleaning method of substrate processing equipment

Country Status (4)

Country Link
US (1) US20060005337A1 (en)
JP (1) JP2006049827A (en)
KR (1) KR20060049928A (en)
TW (1) TW200618082A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110108061A1 (en) * 2009-11-12 2011-05-12 John Squeri Cleaning Article
JP7165065B2 (en) * 2019-01-30 2022-11-02 日東電工株式会社 Cleaning sheet and conveying member with cleaning function

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315377B2 (en) * 1973-03-09 1978-05-24
GB8507944D0 (en) * 1985-03-27 1985-05-01 Automation Facilities Ltd Microfloppy disc drive head cleaner
JP2962843B2 (en) * 1990-06-07 1999-10-12 キヤノン株式会社 Cleaning blade and device using the same
US5363182A (en) * 1992-05-21 1994-11-08 Canon Kabushiki Kaisha Blade device and image forming apparatus
US5438400A (en) * 1992-09-30 1995-08-01 Canon Kabushiki Kaisha Image forming apparatus having cleaning blade with surface coated layer at a tip end thereof
JPH08310080A (en) * 1995-03-10 1996-11-26 Seiko Epson Corp Cleaning sheet and recording medium sheet including cleaning sheet
US5671119A (en) * 1996-03-22 1997-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Process for cleaning an electrostatic chuck of a plasma etching apparatus
US5896157A (en) * 1998-01-27 1999-04-20 Eastman Kodak Company Cleaning disc and method for cleaning a feed roller belonging to an imaging device
US6420032B1 (en) * 1999-03-17 2002-07-16 General Electric Company Adhesion layer for metal oxide UV filters
AU4840300A (en) * 1999-05-11 2000-11-21 Audrey Muhr-Sweeney Universal cleaning apparatus
JP3943797B2 (en) * 2000-03-31 2007-07-11 キヤノン株式会社 Image forming apparatus
US7793668B2 (en) * 2000-06-06 2010-09-14 Nitto Denko Corporation Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
KR100691075B1 (en) * 2000-07-14 2007-03-09 닛토덴코 가부시키가이샤 Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
US20030044569A1 (en) * 2001-06-25 2003-03-06 The Proctor & Gamble Company Disposable cleaning sheets comprising a plurality of protrusions for removing debris from surfaces
US6776171B2 (en) * 2001-06-27 2004-08-17 International Business Machines Corporation Cleaning of semiconductor wafers by contaminate encapsulation
US20050118414A1 (en) * 2002-06-19 2005-06-02 Nitto Denko Corporation Cleaning sheets, transfer member having cleaning function, and method of cleaning substrate-processing apparatus with these
US20040111817A1 (en) * 2002-12-17 2004-06-17 Kimberly-Clark Worldwide, Inc. Disposable scrubbing product
US7655316B2 (en) * 2004-07-09 2010-02-02 Applied Materials, Inc. Cleaning of a substrate support

Also Published As

Publication number Publication date
KR20060049928A (en) 2006-05-19
US20060005337A1 (en) 2006-01-12
JP2006049827A (en) 2006-02-16

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