TW200616775A - Method and apparatus for recovering substrate material from compact disk - Google Patents

Method and apparatus for recovering substrate material from compact disk

Info

Publication number
TW200616775A
TW200616775A TW094132524A TW94132524A TW200616775A TW 200616775 A TW200616775 A TW 200616775A TW 094132524 A TW094132524 A TW 094132524A TW 94132524 A TW94132524 A TW 94132524A TW 200616775 A TW200616775 A TW 200616775A
Authority
TW
Taiwan
Prior art keywords
data layer
compact disk
substrate material
disk
separated
Prior art date
Application number
TW094132524A
Other languages
Chinese (zh)
Other versions
TWI294339B (en
Inventor
Michiaki Motoshima
Kazunori Satou
Ryouko Yanagihara
Kazushige Koyama
Original Assignee
Taiyo Yuden Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Kk filed Critical Taiyo Yuden Kk
Publication of TW200616775A publication Critical patent/TW200616775A/en
Application granted granted Critical
Publication of TWI294339B publication Critical patent/TWI294339B/zh

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Landscapes

  • Manufacturing Optical Record Carriers (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

To provide a method which can exactly recover a substrate material from a lamination type compact disk. Bending stress M is applied to the compact disk 1-1 in which a data layer 1b is formed between upper and lower substrate layers 1a and 1d from its peripheral edge toward the center to break the data layer 1b. A data layer breaking disk 1-2 is separated into two with the broken data layer 1b made a boundary, and unnecessary materials including the ruin of the data layer 1b are removed by cutting from each separated disk 1-3 or 1-4 including the substrate layers.
TW094132524A 2004-09-29 2005-09-20 Method and apparatus for recovering substrate material from compact disk TW200616775A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004283350A JP2006095799A (en) 2004-09-29 2004-09-29 Method and apparatus for recovering substrate material from optical disk

Publications (2)

Publication Number Publication Date
TW200616775A true TW200616775A (en) 2006-06-01
TWI294339B TWI294339B (en) 2008-03-11

Family

ID=36236078

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132524A TW200616775A (en) 2004-09-29 2005-09-20 Method and apparatus for recovering substrate material from compact disk

Country Status (4)

Country Link
JP (1) JP2006095799A (en)
CN (1) CN100575030C (en)
HK (1) HK1086789A1 (en)
TW (1) TW200616775A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101837307B (en) * 2009-03-18 2012-10-03 北京京东方光电科技有限公司 Device and method for crushing basal plates
CN102553883A (en) * 2010-12-31 2012-07-11 兆强科技股份有限公司 Method for recycling multi-layer plastic rubber sheet of waste optical disc
TW201236775A (en) * 2011-03-04 2012-09-16 shu-lang Huang Film peeling method and equipment thereof

Also Published As

Publication number Publication date
TWI294339B (en) 2008-03-11
HK1086789A1 (en) 2006-09-29
CN100575030C (en) 2009-12-30
JP2006095799A (en) 2006-04-13
CN1760007A (en) 2006-04-19

Similar Documents

Publication Publication Date Title
TWI609790B (en) A mobile electronic device comprising an ultrathin sapphire cover plate
HK1099925A1 (en) Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel
WO2010149945A3 (en) A method of manufacturing a flexible, impact-resistant material
WO2011041173A3 (en) Production of reduced catalyst pdc via gradient driven reactivity
WO2007136864A3 (en) Superabrasive tools having improved caustic resistance
TW200616773A (en) Cutting process of laminated material, cutting mechanism and cutting board of laminated material
ITTO20040095A1 (en) SUPERABRASIVE CUTTING EDGES ON THE EDGE WITH GEOMETRY FOR A BETTER DURATION, PROCEDURE FOR THEIR PRODUCTION AND DRILL BITS PROVIDED WITH SUCH ELEMENTS.
WO2006128430A3 (en) Method for production of a curved screen arrangement for a vehicle
HK1123774A1 (en) A method of producing perforated retroreflective trim
WO2005098746A3 (en) Identification document having intrusion resistance
AU2003221112A1 (en) Parting method for fragile material substrate and parting device using the method
WO2008024432A3 (en) Laser separation of thin laminated glass substrates for flexible display applications
SG134324A1 (en) Method and device for separating a reinforcing-plate fixed to a reinforced semiconductor wafer
CN102416674B (en) The dividing method of attached resin brittle material substrate
WO2009078137A1 (en) Surface wave device and method of manufacturing the same
WO2012012774A3 (en) Polycrystalline diamond cutting element and method of using same
TW200602453A (en) Adhesive sheet and method for production thereof (1)
WO2005077667A3 (en) Identification document comprising a transponder and method for the production thereof
DE502005006727D1 (en) DEVICE FOR RECORDING PLATE MATERIALS FOR AT LEAST ONE DISCONNECTION
TW201503801A (en) A mobile electronic device cover plate comprising a thin sapphire layer
TW200633846A (en) Method of separating a mold from a solidified layer disposed on a substrate
TW200616775A (en) Method and apparatus for recovering substrate material from compact disk
CN105754513A (en) Double-sided glue, production equipment and process
CN103286809A (en) Production sample making method of flexible display panel
WO2005002308A3 (en) Pieces for passive electronic components and method for production thereof