TW200612531A - Semiconductor device package with a heat spreader - Google Patents

Semiconductor device package with a heat spreader

Info

Publication number
TW200612531A
TW200612531A TW093130244A TW93130244A TW200612531A TW 200612531 A TW200612531 A TW 200612531A TW 093130244 A TW093130244 A TW 093130244A TW 93130244 A TW93130244 A TW 93130244A TW 200612531 A TW200612531 A TW 200612531A
Authority
TW
Taiwan
Prior art keywords
heat spreader
semiconductor device
device package
die
substrate
Prior art date
Application number
TW093130244A
Other languages
Chinese (zh)
Inventor
Ting-Rung Cheng
Jun-Cheng Liu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW093130244A priority Critical patent/TW200612531A/en
Publication of TW200612531A publication Critical patent/TW200612531A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a semiconductor device package with a heat spreader. The semiconductor device package comprises a substrate, a die, a heat spreader, a molding compound and a plurality of solder balls. The die is adhered to the upper side surface of the substrate. The heat spreader comprises a heat spreader body and a supporting portion, wherein the heat spreader body has a concavity that is lowed gradually from the outermost edge to the central portion, and the supporting portion extends outwardly and downwardly from the outermost edge to form a space to accommodate the die. The molding compound encapsulates the substrate, the die and the heat spreader, but the upper side of the heat spreader body is exposed to the air. The solder balls are formed on the bottom side surface of the substrate.
TW093130244A 2004-10-06 2004-10-06 Semiconductor device package with a heat spreader TW200612531A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093130244A TW200612531A (en) 2004-10-06 2004-10-06 Semiconductor device package with a heat spreader

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093130244A TW200612531A (en) 2004-10-06 2004-10-06 Semiconductor device package with a heat spreader

Publications (1)

Publication Number Publication Date
TW200612531A true TW200612531A (en) 2006-04-16

Family

ID=57807779

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130244A TW200612531A (en) 2004-10-06 2004-10-06 Semiconductor device package with a heat spreader

Country Status (1)

Country Link
TW (1) TW200612531A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111192858A (en) * 2018-10-28 2020-05-22 台湾积体电路制造股份有限公司 Semiconductor package and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111192858A (en) * 2018-10-28 2020-05-22 台湾积体电路制造股份有限公司 Semiconductor package and method of manufacturing the same
CN111192858B (en) * 2018-10-28 2023-05-16 台湾积体电路制造股份有限公司 Semiconductor package and method for manufacturing the same

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