TW200612531A - Semiconductor device package with a heat spreader - Google Patents
Semiconductor device package with a heat spreaderInfo
- Publication number
- TW200612531A TW200612531A TW093130244A TW93130244A TW200612531A TW 200612531 A TW200612531 A TW 200612531A TW 093130244 A TW093130244 A TW 093130244A TW 93130244 A TW93130244 A TW 93130244A TW 200612531 A TW200612531 A TW 200612531A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat spreader
- semiconductor device
- device package
- die
- substrate
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a semiconductor device package with a heat spreader. The semiconductor device package comprises a substrate, a die, a heat spreader, a molding compound and a plurality of solder balls. The die is adhered to the upper side surface of the substrate. The heat spreader comprises a heat spreader body and a supporting portion, wherein the heat spreader body has a concavity that is lowed gradually from the outermost edge to the central portion, and the supporting portion extends outwardly and downwardly from the outermost edge to form a space to accommodate the die. The molding compound encapsulates the substrate, the die and the heat spreader, but the upper side of the heat spreader body is exposed to the air. The solder balls are formed on the bottom side surface of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093130244A TW200612531A (en) | 2004-10-06 | 2004-10-06 | Semiconductor device package with a heat spreader |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093130244A TW200612531A (en) | 2004-10-06 | 2004-10-06 | Semiconductor device package with a heat spreader |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200612531A true TW200612531A (en) | 2006-04-16 |
Family
ID=57807779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093130244A TW200612531A (en) | 2004-10-06 | 2004-10-06 | Semiconductor device package with a heat spreader |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200612531A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111192858A (en) * | 2018-10-28 | 2020-05-22 | 台湾积体电路制造股份有限公司 | Semiconductor package and method of manufacturing the same |
-
2004
- 2004-10-06 TW TW093130244A patent/TW200612531A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111192858A (en) * | 2018-10-28 | 2020-05-22 | 台湾积体电路制造股份有限公司 | Semiconductor package and method of manufacturing the same |
CN111192858B (en) * | 2018-10-28 | 2023-05-16 | 台湾积体电路制造股份有限公司 | Semiconductor package and method for manufacturing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200518298A (en) | Semiconductor device package with a heat spreader | |
TW200620602A (en) | Heat stud for stacked chip package | |
WO2007067954A3 (en) | Thermal enhanced upper and dual heat sink exposed molded leadless package | |
EP2278615A3 (en) | Semiconductor package with a stiffening member supporting a thermal heat spreader | |
TW200636957A (en) | Package for gallium nitride semiconductor devices | |
WO2007007239A3 (en) | Semiconductor device | |
TW200742033A (en) | Stackable semiconductor package | |
WO2008130541A3 (en) | Semiconductor light emitting device packages and methods | |
TW200608540A (en) | Stacked packaging methods and structures | |
TW200744190A (en) | Stackable semiconductor package | |
TW200503209A (en) | Semiconductor package | |
TW200744191A (en) | Stackable semiconductor package | |
WO2009142391A3 (en) | Light-emitting device package and method of manufacturing the same | |
TW200707676A (en) | Thin IC package for improving heat dissipation from chip backside | |
EP2104142A3 (en) | Semiconductor chip package | |
WO2010090820A3 (en) | Ic package with capacitors disposed on an interposal layer | |
TW200729444A (en) | Semiconductor package structure and fabrication method thereof | |
SG125168A1 (en) | Multi-leadframe semiconductor package and method of manufacture | |
TW200737437A (en) | Chip package and package process thereof | |
WO2013019534A3 (en) | Light emitting die (led) lamps, heat sinks and related methods | |
GB0713791D0 (en) | Semiconductor chip package | |
SG132620A1 (en) | Method of making semiconductor package having exposed heat spreader | |
TW200601519A (en) | Semiconductor package having exposed heat sink and heat sink therein | |
TW200802741A (en) | Covered devices in a semiconductor package | |
TW200644205A (en) | An integrated circuit package device with improved bond pad connections, a leadframe and an electronic device |