TW200612489A - Method & apparatus to improve plasma etch uniformity - Google Patents

Method & apparatus to improve plasma etch uniformity

Info

Publication number
TW200612489A
TW200612489A TW094132966A TW94132966A TW200612489A TW 200612489 A TW200612489 A TW 200612489A TW 094132966 A TW094132966 A TW 094132966A TW 94132966 A TW94132966 A TW 94132966A TW 200612489 A TW200612489 A TW 200612489A
Authority
TW
Taiwan
Prior art keywords
vacuum chamber
plasma etch
plasma
uniformity
helical inductor
Prior art date
Application number
TW094132966A
Other languages
Chinese (zh)
Other versions
TWI370490B (en
Inventor
David J Johnson
Russell Westerman
Original Assignee
Unaxis Usa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unaxis Usa Inc filed Critical Unaxis Usa Inc
Publication of TW200612489A publication Critical patent/TW200612489A/en
Application granted granted Critical
Publication of TWI370490B publication Critical patent/TWI370490B/en

Links

Abstract

The present invention provides a method and an apparatus for improving the etch uniformity across a substrate during a plasma etch process that employs the use of an inductively coupled plasma helical inductor. The plasma apparatus comprising a vacuum chamber, a support member in the vacuum chamber for holding the substrate, an etchant gas supply for providing an etchant gas to the vacuum chamber, an exhaust in fluid communication with the vacuum chamber, an RF power source and a helical inductor disposed around or near a portion of the vacuum chamber. A sensor is provided for measuring a process attribute to generate a signal to a controller that then controls a mechanism that varies the position of the helical inductor so that the uniformity of the plasma etch is improved.
TW094132966A 2004-10-04 2005-09-23 Method & apparatus to improve plasma etch uniformity TWI370490B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61586004P 2004-10-04 2004-10-04

Publications (2)

Publication Number Publication Date
TW200612489A true TW200612489A (en) 2006-04-16
TWI370490B TWI370490B (en) 2012-08-11

Family

ID=38772263

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132966A TWI370490B (en) 2004-10-04 2005-09-23 Method & apparatus to improve plasma etch uniformity

Country Status (2)

Country Link
CN (1) CN101048842A (en)
TW (1) TWI370490B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI498054B (en) * 2011-05-31 2015-08-21 Semes Co Ltd Antenna units, substrate treating apparatuses including the same, and substrate treating methods using the apparatuses
TWI692795B (en) * 2013-10-15 2020-05-01 英商Ｓｐｔｓ科技公司 Plasma etching apparatus, kit for retrofitting an existing plasma etching apparatus, and method of plasma etching a substrate

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492671B (en) * 2007-12-13 2015-07-11 Lam Res Corp Plasma unconfinement sensor and methods thereof
CN102315123B (en) * 2010-07-07 2013-05-01 中国科学院微电子研究所 Method for improving etching repeatability of gallium nitride (GaN) high electron mobility transistor (HEMT) grid trench
KR101479143B1 (en) * 2010-11-30 2015-01-05 캐논 아네르바 가부시키가이샤 Plasma Treatment Apparatus
US20180286643A1 (en) * 2017-03-29 2018-10-04 Tokyo Electron Limited Advanced optical sensor, system, and methodologies for etch processing monitoring
KR102190794B1 (en) * 2018-07-02 2020-12-15 주식회사 기가레인 A substrate processing apparatus for mechanically controlling plasma density

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI498054B (en) * 2011-05-31 2015-08-21 Semes Co Ltd Antenna units, substrate treating apparatuses including the same, and substrate treating methods using the apparatuses
US9496121B2 (en) 2011-05-31 2016-11-15 Semes Co., Ltd. Antenna units, substrate treating apparatuses including the same, and substrate treating methods using the apparatuses
TWI692795B (en) * 2013-10-15 2020-05-01 英商Ｓｐｔｓ科技公司 Plasma etching apparatus, kit for retrofitting an existing plasma etching apparatus, and method of plasma etching a substrate

Also Published As

Publication number Publication date
TWI370490B (en) 2012-08-11
CN101048842A (en) 2007-10-03

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