TW200610070A - Process for packaging a flip chip on a leadframe - Google Patents

Process for packaging a flip chip on a leadframe

Info

Publication number
TW200610070A
TW200610070A TW093127345A TW93127345A TW200610070A TW 200610070 A TW200610070 A TW 200610070A TW 093127345 A TW093127345 A TW 093127345A TW 93127345 A TW93127345 A TW 93127345A TW 200610070 A TW200610070 A TW 200610070A
Authority
TW
Taiwan
Prior art keywords
flip chip
leadframe
bumps
leads
packaging
Prior art date
Application number
TW093127345A
Other languages
Chinese (zh)
Other versions
TWI304237B (en
Inventor
Chien Liu
Meng-Jen Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW093127345A priority Critical patent/TWI304237B/en
Publication of TW200610070A publication Critical patent/TW200610070A/en
Application granted granted Critical
Publication of TWI304237B publication Critical patent/TWI304237B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Wire Bonding (AREA)

Abstract

A process for packaging a flip chip on a leadframe is disclosed. At first an adhesive material is formed on a die pad of a leadframe. Active surface of a flip chip is mounted to the die pad by the adhesive material, so that a plurality of bumps of the flip chip are aligned with a plurality of leads of the leadframe and contact the leads or solder paste on the leads. The adhesive material is cured to fix the flip chip on the die pad. Then a molding compound is formed to seal the bumps of the flip chip and to define the soldering area of the leads for reflowing. Then, a reflow process is performed to connect the bumps and the leads. The bumps are limited by the molding compound so as to prevent collapse of the bumps.
TW093127345A 2004-09-09 2004-09-09 Process for packaging a flip chip on a leadframe TWI304237B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093127345A TWI304237B (en) 2004-09-09 2004-09-09 Process for packaging a flip chip on a leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093127345A TWI304237B (en) 2004-09-09 2004-09-09 Process for packaging a flip chip on a leadframe

Publications (2)

Publication Number Publication Date
TW200610070A true TW200610070A (en) 2006-03-16
TWI304237B TWI304237B (en) 2008-12-11

Family

ID=45070892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093127345A TWI304237B (en) 2004-09-09 2004-09-09 Process for packaging a flip chip on a leadframe

Country Status (1)

Country Link
TW (1) TWI304237B (en)

Also Published As

Publication number Publication date
TWI304237B (en) 2008-12-11

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