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Application filed by Phoenix Prec Technology CorpfiledCriticalPhoenix Prec Technology Corp
Priority to TW93122011ApriorityCriticalpatent/TWI267973B/en
Publication of TW200605309ApublicationCriticalpatent/TW200605309A/en
Application grantedgrantedCritical
Publication of TWI267973BpublicationCriticalpatent/TWI267973B/en
Container, Conveyance, Adherence, Positioning, Of Wafer
(AREA)
Abstract
A method for embedding a chip in a core substrate and a jig used therein are proposed, wherein a core substrate formed with at least an opening is provided. The core substrate is positioned on a jig formed with flat plane, and an adhesive is disposed on the side wall of the opening of the core substrate. Then, a chip is set in the opening of the core substrate. After a baking process, the chip is fixed in the opening of the core substrate. Thereafter, the core substrate embedded with a chip can be divided from the jig.
TW93122011A2004-07-232004-07-23Method for embedding chip in core substrate and jig used therein
TWI267973B
(en)