TW200604741A - Positive photoresist composition for none-spin coating method and formation method of resist pattern - Google Patents

Positive photoresist composition for none-spin coating method and formation method of resist pattern

Info

Publication number
TW200604741A
TW200604741A TW094106840A TW94106840A TW200604741A TW 200604741 A TW200604741 A TW 200604741A TW 094106840 A TW094106840 A TW 094106840A TW 94106840 A TW94106840 A TW 94106840A TW 200604741 A TW200604741 A TW 200604741A
Authority
TW
Taiwan
Prior art keywords
none
photoresist composition
spin coating
positive photoresist
resist pattern
Prior art date
Application number
TW094106840A
Other languages
Chinese (zh)
Other versions
TWI299434B (en
Inventor
Tomosaburo Aoki
Kimitaka Morio
Tetsuya Kato
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200604741A publication Critical patent/TW200604741A/en
Application granted granted Critical
Publication of TWI299434B publication Critical patent/TWI299434B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C45/7312—Construction of heating or cooling fluid flow channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2681—Moulds with rotatable mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3044—Bumpers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Robotics (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A positive photoresist composition is provided which is suitable for use in a none-spin coating method. The photoresist composition is one which is used for none-spin coating of a positive photoresist composition on the total surface to be coated of a substrate by relatively moving discharge nozzles and the substrate, which composition contains (A) an alkali soluble resin, (B) a naphthoquinonediazido esterified compound, and (D) an organic solvent, the viscosity of the composition being 1 to 10 cp.
TW094106840A 2004-03-12 2005-03-07 Positive photoresist composition for none-spin coating method and formation method of resist pattern TWI299434B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004070956 2004-03-12
JP2004320100A JP4545553B2 (en) 2004-03-12 2004-11-04 Non-spin coating positive photoresist composition and resist pattern forming method

Publications (2)

Publication Number Publication Date
TW200604741A true TW200604741A (en) 2006-02-01
TWI299434B TWI299434B (en) 2008-08-01

Family

ID=35038654

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106840A TWI299434B (en) 2004-03-12 2005-03-07 Positive photoresist composition for none-spin coating method and formation method of resist pattern

Country Status (4)

Country Link
JP (1) JP4545553B2 (en)
KR (1) KR100685200B1 (en)
CN (1) CN1667511A (en)
TW (1) TWI299434B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4655864B2 (en) * 2004-10-14 2011-03-23 住友化学株式会社 Radiation sensitive resin composition
JP4586703B2 (en) * 2004-10-14 2010-11-24 住友化学株式会社 Radiation sensitive resin composition
JP4717612B2 (en) * 2005-11-28 2011-07-06 東京応化工業株式会社 Photoresist composition for spray coating and laminate
JP4813193B2 (en) * 2006-01-31 2011-11-09 Ａｚエレクトロニックマテリアルズ株式会社 Photosensitive resin composition suitable for spinless and slit coating
JP2009151266A (en) * 2007-11-29 2009-07-09 Jsr Corp Positive radiation-sensitive resin composition
CN101555766B (en) * 2009-04-10 2012-01-11 常熟中信建材有限公司 Floor rail type sliding door structure
CN102346372A (en) * 2010-07-30 2012-02-08 奇美实业股份有限公司 Positive photosensitive resin composition and method for forming patterns by using same
CN102386084B (en) * 2010-09-01 2014-01-08 中芯国际集成电路制造(上海)有限公司 Method for planarizing surface of wafer
JP5778568B2 (en) * 2011-12-16 2015-09-16 東京応化工業株式会社 Chemical amplification type positive photoresist composition for thick film, thick film photoresist laminate, method for producing thick film photoresist pattern, and method for producing connection terminal
TWI490653B (en) 2013-09-10 2015-07-01 Chi Mei Corp Positive photosensitive resin composition and method for forming patterns by using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1069069A (en) * 1996-08-26 1998-03-10 Konica Corp Production of photosensitive planographic printing plate
JP3945556B2 (en) * 1998-12-17 2007-07-18 東京応化工業株式会社 Positive photoresist coating liquid for liquid crystal device manufacturing and substrate using the same
JP2000258901A (en) 1999-03-11 2000-09-22 Jsr Corp Radiation sensitive resin composition
KR100363273B1 (en) * 2000-07-29 2002-12-05 주식회사 동진쎄미켐 Photoresist composition for liquid crystal display circuit board
JP3710717B2 (en) * 2001-03-06 2005-10-26 東京応化工業株式会社 Positive photoresist composition for thick film, photoresist film, and bump forming method using the same
TW594397B (en) * 2003-01-30 2004-06-21 Chi Mei Corp Positive photosensitive resin
KR20050022494A (en) * 2003-09-02 2005-03-08 삼성전자주식회사 Photoresist Composition of Liquid Crystal Display Device for Spinless Coater and Method of Forming A Photoresist Pattern Using the Same

Also Published As

Publication number Publication date
KR20060043817A (en) 2006-05-15
JP4545553B2 (en) 2010-09-15
CN1667511A (en) 2005-09-14
JP2005292776A (en) 2005-10-20
TWI299434B (en) 2008-08-01
KR100685200B1 (en) 2007-02-22

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