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Application filed by Da-Tong Wen, Da-Ming WenfiledCriticalDa-Tong Wen
Priority to TW093119715ApriorityCriticalpatent/TW200601442A/en
Publication of TW200601442ApublicationCriticalpatent/TW200601442A/en
Processing Of Stones Or Stones Resemblance Materials
(AREA)
Abstract
The present invention provides a wafer dicing method, which employs a cylinder beneath a rolling mechanism to break and separate a wafer into a plurality of small chips or dies along groves thereof by a rolling method such that dicing operation can be more efficient in terms of the values of industry utility.