TW200601439A - Etching chamber - Google Patents
Etching chamberInfo
- Publication number
- TW200601439A TW200601439A TW093117730A TW93117730A TW200601439A TW 200601439 A TW200601439 A TW 200601439A TW 093117730 A TW093117730 A TW 093117730A TW 93117730 A TW93117730 A TW 93117730A TW 200601439 A TW200601439 A TW 200601439A
- Authority
- TW
- Taiwan
- Prior art keywords
- etching chamber
- etching
- chamber
- chamber includes
- protrusions
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The present invention relates to an etching chamber. The etching chamber includes a reaction chamber, an inlet and an outlet, wherein the base of the etching chamber includes a plurality of protrusions.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093117730A TW200601439A (en) | 2004-06-18 | 2004-06-18 | Etching chamber |
US11/156,275 US20050279452A1 (en) | 2004-06-18 | 2005-06-17 | Etching reaction device with protrusions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093117730A TW200601439A (en) | 2004-06-18 | 2004-06-18 | Etching chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200601439A true TW200601439A (en) | 2006-01-01 |
Family
ID=35479368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093117730A TW200601439A (en) | 2004-06-18 | 2004-06-18 | Etching chamber |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050279452A1 (en) |
TW (1) | TW200601439A (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2733771B2 (en) * | 1988-07-29 | 1998-03-30 | 日本テキサス・インスツルメンツ株式会社 | Liquid processing equipment |
US5212116A (en) * | 1990-06-18 | 1993-05-18 | At&T Bell Laboratories | Method for forming planarized films by preferential etching of the center of a wafer |
US5327921A (en) * | 1992-03-05 | 1994-07-12 | Tokyo Electron Limited | Processing vessel for a wafer washing system |
US5427622A (en) * | 1993-02-12 | 1995-06-27 | International Business Machines Corporation | Method for uniform cleaning of wafers using megasonic energy |
US5794299A (en) * | 1996-08-29 | 1998-08-18 | Ontrak Systems, Inc. | Containment apparatus |
FR2755038B1 (en) * | 1996-10-28 | 1998-12-24 | Forward Technology Ind | METHOD FOR CLEANING METAL PARTS |
US20020166569A1 (en) * | 2001-05-10 | 2002-11-14 | Speedfam-Ipec Corporation | Method and apparatus for semiconductor wafer cleaning |
KR101067972B1 (en) * | 2002-12-31 | 2011-09-26 | 엘지디스플레이 주식회사 | Apparatus for inspecting alignment film of liquid crystal display device |
US7582180B2 (en) * | 2004-08-19 | 2009-09-01 | Micron Technology, Inc. | Systems and methods for processing microfeature workpieces |
-
2004
- 2004-06-18 TW TW093117730A patent/TW200601439A/en unknown
-
2005
- 2005-06-17 US US11/156,275 patent/US20050279452A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20050279452A1 (en) | 2005-12-22 |
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