TW200600249A - A welding or soldering filler material with melting-aiding material containing titanium additions - Google Patents

A welding or soldering filler material with melting-aiding material containing titanium additions

Info

Publication number
TW200600249A
TW200600249A TW093119142A TW93119142A TW200600249A TW 200600249 A TW200600249 A TW 200600249A TW 093119142 A TW093119142 A TW 093119142A TW 93119142 A TW93119142 A TW 93119142A TW 200600249 A TW200600249 A TW 200600249A
Authority
TW
Taiwan
Prior art keywords
melting
aiding
welding
containing titanium
filler
Prior art date
Application number
TW093119142A
Other languages
Chinese (zh)
Other versions
TWI248844B (en
Inventor
Yi-Lin Cheng
Original Assignee
Mesophase Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mesophase Technologies Inc filed Critical Mesophase Technologies Inc
Priority to TW93119142A priority Critical patent/TWI248844B/en
Publication of TW200600249A publication Critical patent/TW200600249A/en
Application granted granted Critical
Publication of TWI248844B publication Critical patent/TWI248844B/en

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

This invention discloses a composition of welding or soldering filler with melting-aiding material containing titanium additions, which includes: (A) a filler material, and (B) titanium based melting-aiding material; where, the melting-aiding material (B) includes titanium and a metal M which can undergo a chemical reaction with titanium at temperature below the fusion point of the filler material (A), and to release thermal energy to melt the filler (A) and melting-aiding material (B).
TW93119142A 2004-06-29 2004-06-29 Solder composition containing titanium group flux TWI248844B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93119142A TWI248844B (en) 2004-06-29 2004-06-29 Solder composition containing titanium group flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93119142A TWI248844B (en) 2004-06-29 2004-06-29 Solder composition containing titanium group flux

Publications (2)

Publication Number Publication Date
TW200600249A true TW200600249A (en) 2006-01-01
TWI248844B TWI248844B (en) 2006-02-11

Family

ID=37429355

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93119142A TWI248844B (en) 2004-06-29 2004-06-29 Solder composition containing titanium group flux

Country Status (1)

Country Link
TW (1) TWI248844B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5627935B2 (en) * 2009-07-24 2014-11-19 山陽特殊製鋼株式会社 Ti brazing filler metal

Also Published As

Publication number Publication date
TWI248844B (en) 2006-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees