TW200600244A - Laser cut technology in fine pitch substrate - Google Patents

Laser cut technology in fine pitch substrate

Info

Publication number
TW200600244A
TW200600244A TW093119140A TW93119140A TW200600244A TW 200600244 A TW200600244 A TW 200600244A TW 093119140 A TW093119140 A TW 093119140A TW 93119140 A TW93119140 A TW 93119140A TW 200600244 A TW200600244 A TW 200600244A
Authority
TW
Taiwan
Prior art keywords
laser cut
fine pitch
cut technology
metal layer
substrate
Prior art date
Application number
TW093119140A
Other languages
Chinese (zh)
Other versions
TWI259791B (en
Inventor
Chih-Pin Hung
Chi-Tsung Chiu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW93119140A priority Critical patent/TWI259791B/en
Publication of TW200600244A publication Critical patent/TW200600244A/en
Application granted granted Critical
Publication of TWI259791B publication Critical patent/TWI259791B/en

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  • Thermistors And Varistors (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A laser cut technology, suitable in fine pitch substrate, is disclosed in the present invention. The laser cut technology comprises the following steps. First, a metal layer is coated on the part that is being cut on a substrate. Then, one end of the metal layer is connected to a meter. The metal layer is cut to the width and pitch by a laser, and at least a trace will then be obtained on the metal layer, wherein one end of the trace is connected to the meter. Finally, measure the impedance of the trace and see if it meets the requirement.
TW93119140A 2004-06-29 2004-06-29 Laser cut technology in fine pitch substrate TWI259791B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93119140A TWI259791B (en) 2004-06-29 2004-06-29 Laser cut technology in fine pitch substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93119140A TWI259791B (en) 2004-06-29 2004-06-29 Laser cut technology in fine pitch substrate

Publications (2)

Publication Number Publication Date
TW200600244A true TW200600244A (en) 2006-01-01
TWI259791B TWI259791B (en) 2006-08-11

Family

ID=37872517

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93119140A TWI259791B (en) 2004-06-29 2004-06-29 Laser cut technology in fine pitch substrate

Country Status (1)

Country Link
TW (1) TWI259791B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557623B (en) * 2013-07-22 2016-11-11 Gunze Kk A transparent planar substrate with a contact and a touch panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557623B (en) * 2013-07-22 2016-11-11 Gunze Kk A transparent planar substrate with a contact and a touch panel

Also Published As

Publication number Publication date
TWI259791B (en) 2006-08-11

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