200539737 玫、發明說明： 【發明所屬之技術領域】 本發明是有關於一種發光裝置的製造方法，特別是指 一種有機電激發光裝置的製造方法。 【先前技術】 如圖1所示，一般有機電激發光裝置的製造過程，大 致如下： 一、 先在一由玻璃或透明材質製成的基板u上濺鍍被 復層透明之導電材料，並經由黃光製程與蝕刻等技術將 不必之邛伤去除，而餘留複數縱向間隔排列被覆在該基板 11頂面的條狀陽極12。 二、 接著配合黃光製程與蝕刻技術，在兩兩相鄰陽極 12間皆被覆上一條狀之絕緣區塊15，並讓每一絕緣區塊15 兩側邊緣部分重疊於所對應兩相鄰陽極12頂面。 三、 以物理蒸鍍方式，在每一陽極12頂面間隔被覆複 數長方片狀之有機發光體13。 四、 在各列橫向排列之發光體13頂面皆被覆一條狀陰 極14。 .别述該等陽極12通常是採用透明電極，例如氧化鋼錫 (Indium Tin 0xide，縮略IT〇)，而該等陰極14通常為金屬 鋁膜（Α1)。 前述在兩兩相鄰陽極12間被覆條狀之絕緣區塊15，並 H緣區塊15兩侧邊緣部分重疊於陽極12頂面的作用， 主要疋為避免該等陽極12蝕刻過程所產生的金屬殘留缺陷 200539737 與發光體丨3表面鍍膜過程使用之遮罩（圖未示）所存在的對 位誤差，以及遮罩製造時的誤差等因素，造成蒸鍍在該等 發光體13頂面上的陰極14與下方之陽極12出現短路現象 ’導致有機電激發光裝置的不良率提高。 5 雖然此方法可有效避免因蒸鍍製程使用之遮罩的製造 誤差或基板11與遮罩的對位精準度等因素，所造成有機電 激發光裝置的製造良率降低的問題，但因各陽極12之部分 頂面被相鄰之各絕緣區塊15遮蔽，使得各發光體13與所 對應之陽極12的接觸面積縮減，造成開孔率下降，同時導 10 致相鄰發光體15之有效發光區域間的間距變大，進而造成 該有機電激發光裝置的整體解析度相對下降。 【發明内容】 因此，本發明之目的，即在提供一種可以提高開孔率 與解析度的有機電激發光裝置製造方法。 15 於是，本發明有機電激發光裝置之製造方法包含··（A) 在-基板頂面被覆複數間隔之陽極。⑻在該基板及該等陽 極頂面被覆一絕緣層。（C)磨除位於該等陽極頂面之絕緣層 ，使該絕緣層覆蓋於該等陽極之侧面及該基板頂面。（D )在 每一陽極頂面被覆一發光體。及⑻在每一發光體頂面被 2〇 覆一陰極。此製造方法使每一發光體可與所對應陽極頂面完 全接觸，而提高開孔率及解析度。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一較佳實施例的詳細說明中，將可清 200539737 楚的明白。 本發明有機電激發光裝置之製造方法的較佳實施例如 下： (A)濺鍍（sputter)陽極：如圖2所示，在一透明玻璃 基板2頂面被覆複數縱向間隔平行排列之長條狀透明陽極3 (B )被覆絕緣材料··如圖3所示，利用表面艘膜以絕 緣材料在該等陽極3頂面與該基板2裸露之頂面，被覆形 10 15 成一層厚度均勻的絕緣層4。在本實施例中該絕緣層4所使 用之、、、邑緣材料可為 Sl〇2、si3N4、p〇ly imide 或 。該 、’、邑緣層4之被覆方式在貫施時不以表面鍵膜為限，例如亦 可採用塗佈方式。 (C)磨除絕緣層之局部區域··利用化學機械研磨技術（ Chenucal Machine P〇lishing，縮略為 CMp )，將覆蓋於該等 陽極3頂面之絕緣層4完全去除，形成如圖4所示狀態， 保留絕緣I 4中多數分別覆蓋於各陽極3兩側面之側面部 41及夕數覆蓋於該基板2頂面並連接於兩兩相鄰側面部 41間之頂面部42，使得各陽極3頂面可完全裸露。經由步 ^⑻、（c)的實施結果，如同使絕緣層4所餘留下來之側面 P 4 U面^ 42提供的絕緣作用，獲得自動對準的效果 ’藉由此-自動對準效果使各陽们與基板2所欲絕緣的 部位精準地被絕緣材料覆蓋，完衫會發生偏移。 (D)蒸鍍發光體··如圖5 mask，圖未示）及蒸鍍方式在每一 所示，以遮罩（shadow 陽極3頂面被覆複數間 20 200539737 隔排列之長方片狀有機發光體5，並使全部發光體5的排列 方式呈一矩陣型態。又設計上，更使每一發光體5左右側 犬伸出所對應陽極3頂面而略微重疊於該陽極3兩側之絕 緣層4的側面部41頂面上，此重疊比例可預先設計為相當 於遮罩對位誤差率與遮罩製造時之誤差率絕對值的和，以 確保母一發光體5的左右側在遮罩造成之誤差範圍内都能 夠元王復盍住所在位置之陽極3頂面的左右邊緣。 ίο 15 (E)被覆陰極：如圖6所示，最後再配合遮罩與表面 鍍膜，以鋁膜製作出複數橫向間隔排列之長條狀陰極6，使 每一陰極6跨越各陽極3上同列橫向對應之發光體5。 依據本實施例上述製造步驟所製成之有機電機發光裝 置具有以下之優點： (1)透過步驟（C)對絕緣層4的研磨製程，使每一陽極 3頂面可完全裸露出，而以全部寬度供其相對應之各發光體 5完全接觸，且絕緣層4之側面部41與頂面部㈣保有所 需的絕緣功能’因此本實施例之各發光體5的開孔率能明 (2)每-發光體5之邊緣略重疊於所對應陽極3之絕 緣層4的側面部41頂面，使其在考慮遮罩誤差率之因素下 ’仍能4保每-陽極3與陰極6被所對應發光體5完全隔 離’也就是能確保陰極6不會與陽極.3短路，而確保甚佳 之製造良率。 Q 3)本貫施例中由於每一陽極 4 J頂面是以全部t唐本 露而供發光體5完全接觸，因此 見又不 知尤體5之有效發） 20 200539737 區域間的距離，便明顯比前述習知製造方法的距離縮小， 使本貫施例所製成之有機電激發光裝置的整體解析度相對 提高。 歸納上述，本發明有機電激發光製置之製造方法，除 了可避免陽極3蝕刻過程所產生之缺陷及遮罩對位、製造 的誤差對製程良率的影響，更可提高各發光體5的開孔率 ，並使所製成之有機電激發光裝置的解析度相對提高，故 確實能達到本發明之目的。 惟以上所述者，僅為本發明之一較佳實施例而已，當 不月b以此限疋本發明實施之範圍，即大凡依本發明申請專 利範圍及發明說明書内容所作之簡單的等效變化與修飾， 白應仍屬本發明專利涵蓋之範圍内。 【圓式簡單說明】 圖1是一種習知製造方法所製成之有機電激發光裝置 的正視剖面示意圖； 圖2是一正視剖面示意圖，說明本發明有機電激發光 裝置之製造方法的較佳實施例在步驟（A)的情況； 圖3是類似圖2的視圖，說明該較佳實施例在步驟（B) 的情況； 圖4是類似圖3的視圖，說明該較佳實施例在步驟（c) 的情況； 圖5是類似圖4的視圖說明該較佳實施例在步驟（D)的 情況；及 圖ό是類似圖5的視圖，說明該較佳實施例在步驟（E) 200539737 的情況。 200539737 【圖式之主要元件代表符號說明】 脊 《Φ* ««外 基板 42 * .......頂面部 陽極 5… .......發光體 »*«*»4·*«*^ 絕緣層 6… .......陰極 /| 1 ♦，《 + ，·》 少咩 側面部 11200539737 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a light-emitting device, and more particularly, to a method for manufacturing an organic electro-luminescent device. [Previous technology] As shown in FIG. 1, the manufacturing process of a general organic electroluminescent device is roughly as follows: First, a transparent conductive material is sputtered on a substrate u made of glass or a transparent material, and Unnecessary scratches are removed by yellow light process and etching techniques, and a plurality of strip-shaped anodes 12 covered on the top surface of the substrate 11 are arranged in a longitudinally spaced manner. 2. Next, in conjunction with the yellow light process and etching technology, a strip of insulating blocks 15 is covered between the two adjacent anodes 12 and the edges of each side of each insulating block 15 overlap with the corresponding two adjacent anodes. 12 top faces. 3. The top surface of each anode 12 is covered with a plurality of rectangular plate-shaped organic light-emitting bodies 13 by physical evaporation. 4. The top surfaces of the luminous bodies 13 arranged in each row laterally are covered with a strip of cathodes 14. In other words, the anodes 12 are usually transparent electrodes, such as steel oxide (Indium Tin Oxide, abbreviated IT0), and the cathodes 14 are usually metal aluminum films (A1). The aforementioned function of covering the strip-shaped insulating blocks 15 between two adjacent anodes 12 and overlapping the edges of both sides of the H-edge block 15 on the top surface of the anodes 12 is mainly to prevent the anode 12 from being etched during the etching process. Residual metal defects 200539737 and the misalignment of the mask (not shown) used in the surface coating process of the surface of the luminous body 丨 3, and the error in the manufacture of the mask, etc., cause evaporation on the top surface of these luminous bodies 13 The occurrence of a short circuit between the cathode 14 and the anode 12 below leads to an increase in the defective rate of the organic electro-optic device. 5 Although this method can effectively avoid the manufacturing yield of organic electroluminescent devices due to manufacturing error of the mask used in the evaporation process or the alignment accuracy of the substrate 11 and the mask, etc., Part of the top surface of the anode 12 is shielded by the adjacent insulating blocks 15, so that the contact area of each luminous body 13 and the corresponding anode 12 is reduced, resulting in a decrease in the open porosity, and at the same time, 10 makes the adjacent luminous body 15 effective. The distance between the light-emitting regions becomes larger, which in turn causes the overall resolution of the organic electroluminescent device to be relatively reduced. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing an organic electroluminescent device capable of improving the porosity and resolution. 15 Therefore, the method for manufacturing an organic electro-optical device according to the present invention includes (A) coating a plurality of anodes on the top surface of a substrate. ⑻ Cover the substrate and the top surfaces of the anodes with an insulating layer. (C) Grind off the insulation layers on the top surfaces of the anodes so that the insulation layers cover the sides of the anodes and the top surface of the substrate. (D) A luminous body is covered on the top surface of each anode. And ⑻ is covered with a cathode on the top surface of each luminous body. This manufacturing method allows each luminous body to make full contact with the top surface of the corresponding anode, thereby improving the aperture ratio and resolution. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The preferred embodiment of the manufacturing method of the organic electro-optical excitation device of the present invention is as follows: (A) Sputter anode: As shown in FIG. 2, a transparent glass substrate 2 is covered with a plurality of strips arranged in parallel at longitudinal intervals in parallel. Transparent anode 3 (B) covered with insulating material ... As shown in Fig. 3, the surface of the anode 3 and the exposed top surface of the substrate 2 are covered with insulating material on the top surface of the anode 3, and the covering shape 10 15 is formed into a layer of uniform thickness. Insulation layer 4. In this embodiment, the material used for the insulating layer 4 may be S102, si3N4, poly imide, or. The coating method of the coating layer 4 is not limited to the surface bond film during application, and for example, a coating method may be used. (C) Abrasive the local area of the insulating layer ..... Using chemical mechanical polishing technology (Chenucal Machine Polishing, abbreviated as CMP), the insulating layer 4 covering the top surfaces of the anodes 3 is completely removed to form a layer as shown in Figure 4. In the state shown, most of the remaining insulation I 4 side portions 41 covering both sides of each anode 3 and the number of sides are covered on the top surface of the substrate 2 and connected to the top surface portions 42 between two adjacent side portions 41 so that each anode 3 The top surface can be completely exposed. Through the implementation results of steps ^ ⑻, (c), the insulation effect provided by the side P 4 U face ^ 42 left by the insulating layer 4 is obtained, and the effect of automatic alignment is obtained. The locations where the sun and the substrate 2 want to be insulated are accurately covered with an insulating material, and the finished shirt may be shifted. (D) Evaporation light-emitting body ·· As shown in FIG. 5, mask (not shown) and evaporation method are shown in each case. A mask (shadow anode 3 top surface is covered with a plurality of 20 200539737 spacers arranged in a rectangular shape.) The luminous bodies 5 make the arrangement of all the luminous bodies 5 in a matrix form. Furthermore, the left and right sides of each luminous body 5 are designed to extend the top surface of the corresponding anode 3 and slightly overlap the sides of the anode 3. The overlap ratio of the side surface 41 of the insulating layer 4 can be designed in advance to be equal to the sum of the mask registration error rate and the absolute value of the error rate during the manufacture of the mask, so as to ensure that the left and right sides of the mother-light emitter 5 are at Within the range of error caused by the mask, the left and right edges of the top surface of the anode 3 where Yuan Fu can live. Ίο 15 (E) Covered cathode: as shown in Figure 6, and finally with the mask and surface coating, made of aluminum film A plurality of strip-shaped cathodes 6 arranged laterally and spaced apart are arranged so that each cathode 6 crosses the corresponding row of light-emitting bodies 5 on the anodes 3. The organic motor light-emitting device manufactured according to the above manufacturing steps of this embodiment has the following advantages: (1) Insulating layer through step (C) The grinding process of 4 allows the top surface of each anode 3 to be completely exposed, and the corresponding width of each light emitting body 5 is fully contacted, and the side surface portion 41 of the insulation layer 4 and the top surface portion have the required insulation. Function 'Therefore, the aperture ratio of each luminous body 5 in this embodiment is clear. (2) The edge of each luminous body 5 slightly overlaps the top surface of the side portion 41 of the insulating layer 4 of the corresponding anode 3, so that Under the factor of the mask error rate, 'the anode 3 and the cathode 6 can still be completely isolated by the corresponding illuminant 5', that is, it can ensure that the cathode 6 does not short circuit with the anode .3, and ensure a very good manufacturing yield. Q 3) In the present embodiment, since the top surface of each anode 4J is all t Tang Benlu, and the luminous body 5 is completely contacted, so you do n’t know the effective development of the body 5) 20 200539737 The distance between the regions is obviously longer than the foregoing The distance of the conventional manufacturing method is narrowed, so that the overall resolution of the organic electroluminescent device manufactured in this embodiment is relatively improved. Summarizing the above, the manufacturing method of the organic electro-excitation light manufacturing method of the present invention, in addition to avoiding the defects caused by the etching process of the anode 3 and the mask alignment and manufacturing errors, has an effect on the yield of the process, and it can also improve the light-emitting body The porosity and the resolution of the manufactured organic electro-optical excitation device are relatively improved, so the object of the present invention can be achieved. However, the above is only one of the preferred embodiments of the present invention. When the month b is used to limit the scope of implementation of the present invention, that is, the simple equivalent made according to the scope of the patent application and the content of the invention specification Variations and modifications should still be within the scope of the invention patent. [Circular brief description] FIG. 1 is a schematic front sectional view of an organic electroluminescent device made by a conventional manufacturing method. FIG. 2 is a schematic front sectional view illustrating a preferred method of manufacturing the organic electroluminescent device of the present invention. FIG. 3 is a view similar to FIG. 2 to illustrate the situation of the preferred embodiment in step (B). FIG. 4 is a view similar to FIG. 3 to illustrate the preferred embodiment in step. (C); FIG. 5 is a view similar to FIG. 4 illustrating the preferred embodiment at step (D); and FIG. 5 is a view similar to FIG. 5 illustrating the preferred embodiment at step (E) 200539737 Case. 200539737 [Explanation of the symbols of the main components of the figure] Ridge "Φ *« «Outer substrate 42 * ....... Top surface anode 5 ... ....... Luminous body» * «*» 4 · * «* ^ Insulating layer 6… ....... Cathode / | 1 ♦," +, · "Side face portion 11