TW200538581A - Preparation method of film-coating target - Google Patents

Preparation method of film-coating target Download PDF

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TW200538581A
TW200538581A TW093114685A TW93114685A TW200538581A TW 200538581 A TW200538581 A TW 200538581A TW 093114685 A TW093114685 A TW 093114685A TW 93114685 A TW93114685 A TW 93114685A TW 200538581 A TW200538581 A TW 200538581A
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film
boron
patent application
scope
target
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TW093114685A
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TWI319443B (en
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zheng-gong Du
Fang-Bin Wu
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Nat Univ Tsing Hua
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Abstract

This invention utilizes a method of electroplating or electroless plating to prepare a composite target wherein a phosphorous or boron containing film is formed on a substrate. The ratio of phosphorous or boron atoms of the phosphorous or boron containing film can be controlled by utilizing the solution or process parameters variation during the electroplating or electroless plating. By means of addition of the necessary amounts of phosphorous or boron atoms in the process of film coating, a multiple functional film coating can be used under a high temperature and better heat circulation properties and mechanical properties can be obtained.

Description

200538581 五、發明說明(1) 【發明所屬之技術領域】 本發明係有關一種鑛膜乾姑 、硼等原子添加於鍍膜合金靶材f方法’尤指-種將磷 之磷、W材製備,使鍍膜製程中所需 嶙硼等原子之添加量可精確控制。 【先前技術】 濺鑛(Sputtering DeDosWi·^ 、 (glow discharge) ^ ^ ^CAr) ^ ^ ,靶材的原子被彈出而堆積在基板表面形 a^\et 膜的性質、均勻度都比蒸鍍薄膜來的女子;型的濺铲:備 γ都:用強力磁鐵將電子成螺旋狀運動以加速::周又; =:Γ,造成把與氯氣離子間的撞擊機率增加,提 一般金屬鍍膜大都採用直流濺鍍,而不導 料則使用RF交流濺鍍,基本的原理是在真空中利用輝光放 電(glow discharge)將氬氣(Ar)離子撞擊靶材(u 面’電漿中的陽離子會加速沖向作為被濺鍍材的負電極 面’這個衝擊將使靶材的物質飛出而沈積在基板上形成薄 膜。 * 一般來說,利用濺鍍製程進行薄膜彼覆有幾項特點: (1 )金屬、合金或絕緣物均可做成薄膜材料。(2 再適♦: 設定條件下可將多元複雜的靶材製作出同一組成的薄^的 (3 )利用放電氣氛中加入氧或其他的活性氣體, / ' J Μ製作 靶材物質與氣體分子的混合物或化合物。(4)把材輪入 流及濺射時間可以控制,容易得到高精度的膜厚。Υ 1200538581 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method for adding an atom of a mineral film, boron and other atoms to a coated alloy target, especially a method for preparing phosphorus, phosphorus, and W materials. The addition amount of ytterbium and boron atoms required in the coating process can be accurately controlled. [Prior technology] Sputtering DeDosWi · ^, (glow discharge) ^ ^ ^ CAr) ^ ^, the atoms of the target are ejected and deposited on the substrate surface shape a ^ \ et The properties and uniformity of the film are better than those of evaporation Woman with thin film; Type of shovel: Prepared by γ Capital: Use powerful magnets to spiral electrons to accelerate :: Zhou You; =: Γ, which increases the probability of collision with chlorine ions, and most of the metal coatings DC sputtering is used instead of RF sputtering. The basic principle is to use a glow discharge in a vacuum to strike argon (Ar) ions into the target (cations in the u-side plasma). Accelerate the impact to the negative electrode surface as the material to be sputtered. This impact will cause the target material to fly out and be deposited on the substrate to form a thin film. * Generally, there are several characteristics of thin film coating using the sputtering process: ( 1) Metals, alloys or insulators can be made into thin film materials. (2 Re-suitability ♦: Under the set conditions, multiple and complex targets can be made into thin films of the same composition. (3) Adding oxygen or other to the discharge atmosphere Reactive gas, / 'J Μ production Mixtures or compounds of target materials and gas molecules. (4) The inflow and sputtering time of the material can be controlled, and it is easy to obtain high-precision film thickness. Υ 1

Η 第5頁 200538581 五、發明說明(2) 其他制程利於生?大面積的均一薄膜。(6 )濺射粒子幾不受 · 重力影響’乾材與基板位置可自由安排。(7)基板與膜的 附著強度是一般蒸鍵膜的1〇倍以上,且由於濺射粒子帶有 南能量’在成膜面會繼續表面擴散而得到硬且緻密的薄 膜’同時此高能量使基板只要較低的溫度即可得到結晶 膜。(8)溥膜形成初期成核密度高,可生產i〇nm&下的極 薄連續膜。(9)乾材的壽命長,可長時間自動化連續生產 ° (1 〇 ) 材可製作成各種形狀,配合機台的特殊設計做更 好的控制及最有效率的生產。 多元鍵膜由於可提供高硬度及勃性,且其耐腐姓與熱j 循環性佳等優點,一般廣泛地應用於工業上所謂硬質鍍膜 及表面處理工程上,提供功能性鍍膜之效用。 現今製作多元合金的方法有許多,而在多元鍍膜的方 面,以真空物理或化學氣相鍍製方法居多。其中,真空物 理氣相錄製方法製作多元鍍膜則需使用一至多個靶材,此 一至多個乾材包含多元鍍膜中所有元素。 而利用單靶鍍製多元鍍膜時,單一靶材便需具備所有 ,需之多元元素。但,當靶材之成分固定,則所鍍製出之 $疋膜之成分亦隨之固定,沒有成分調變之空間,,所以在 單靶鍍膜之靶材設計上亦較具困難度。 、 又’利用多靶真空鍍膜方式,可以改善單靶鍍膜在成 分控制上的缺點。多靶系統中,每個靶材所需包含的元素 : 年主一兀甚至一元,即可調配鍍膜膜層之元素,而 調配之方式可依各靶材之參數來作調變,因此,可以精準5 Page 5 200538581 V. Description of the invention (2) Are other processes beneficial? Large area of uniform film. (6) The sputtered particles are almost unaffected by gravity. The position of the dry material and the substrate can be freely arranged. (7) The adhesion strength between the substrate and the film is more than 10 times that of the ordinary steam-bonded film, and because the sputtered particles have south energy 'the surface will continue to diffuse on the film-forming surface to obtain a hard and dense film' and this high energy A crystal film can be obtained by lowering the temperature of the substrate. (8) The nucleation density is high at the initial stage of the osmium film formation, and it is possible to produce an extremely thin continuous film at 100 nm. (9) The dry material has a long life and can be continuously and automatically produced for a long time. (10) The material can be made into various shapes, and the special design of the machine can be used for better control and most efficient production. Multi-component bond films are widely used in the so-called hard coating and surface treatment projects in the industry because they provide high hardness and robustness, and have good corrosion resistance and thermal cycling. They also provide functional coatings. There are many methods for making multicomponent alloys today, and in terms of multicomponent coatings, vacuum physical or chemical vapor deposition methods are mostly used. Among them, the vacuum physical vapor phase recording method for the multi-layer coating requires the use of one or more target materials, and the one or more dry materials contain all the elements in the multi-layer coating. When using a single target to plate multiple coatings, a single target must have all the required multielements. However, when the composition of the target material is fixed, the composition of the plated $ 疋 film is also fixed, and there is no room for composition adjustment. Therefore, it is more difficult to design the target material for single-target coating. The use of a multi-target vacuum coating method can improve the shortcomings of single target coatings in terms of component control. In a multi-target system, the elements required for each target are: one year or even one yuan, the elements of the coating film layer can be adjusted, and the adjustment method can be adjusted according to the parameters of each target. Therefore, you can Precise

200538581200538581

五、發明說明(3) 控制各元素於多元鍍膜中之添加量。 又,研究資料顯示利用磷、硼等原子之添加,可使多 元功能性鍍膜在高溫使用下,因第二相的析出而獲得更佳 的熱循環性及機械性質等優點。 但天然純磷之熔沸點極低,一般真空鍍膜中乾材會受 電衆森擊,致使溫度會高達百度以上,故純嶙無法廣用在 真空鍍膜製程中,造成多元鍍膜製程上無法加入璘或爛等 原子之缺點。 【發明内容】 本發明之主要目的在提供一種含磷或硼之多元鑛膜革巴翁| 材製備方法,藉由單一靶材含有磷或硼等原子,如是使多 元功能性鍍膜在高溫使用下,因第二相的析出而獲得更佳 的熱循環性及機械性質等優點。 本發明之另一目的係在當使用多靶鍍膜系統(包含兩 支把以上之系統),將所需之元素鑛於基材上,可控制調 變磷或硼等原子之含量。V. Description of the invention (3) Control the amount of each element in the multi-layer coating. In addition, research data show that the use of phosphorus, boron, and other atoms can enable the multifunctional functional coating to obtain better thermal cycling and mechanical properties due to the precipitation of the second phase at high temperatures. However, the melting point of natural pure phosphorus is extremely low. Generally, dry materials in vacuum coating will be attacked by electricity, causing the temperature to reach more than Baidu. Therefore, pure osmium cannot be widely used in the vacuum coating process, which makes it impossible to add 璘 or The disadvantages of rotten atoms. [Summary of the Invention] The main object of the present invention is to provide a multi-mineral mineral film Gebaong containing phosphorus or boron. A method for preparing a multi-functional functional coating under high temperature by using a single target material containing phosphorus or boron and other atoms Due to the precipitation of the second phase, better thermal cycling and mechanical properties are obtained. Another object of the present invention is to use a multi-target coating system (including two or more systems) to deposit the required elements on the substrate and control the content of atoms such as phosphorus or boron.

本發明係利用電鍵(Electroplating)或無電錄( Electroless plating)方法,於一基材上製作一含麟或哪 膜層,而成為一複合靶材,又此一含磷或硼膜層i中磷或硼 之比例,可利用電鍍或無電鍍時溶液或製程參數變化控制 。藉此鍵膜製程中將可含所需之磷、硼等原子之添加量, 可使多元功能性鍵膜在南溫使用下’獲得更佳的熱循環性 及機械性質等優點。 【實施方式】In the present invention, an electro-plating or electroless plating method is used to fabricate a film containing lin or which on a substrate to become a composite target, and the phosphorus or boron film i Or the proportion of boron can be controlled by the change of solution or process parameters during electroplating or electroless plating. In this way, the required amount of phosphorus, boron and other atoms can be added in the bonding film manufacturing process, so that the multifunctional functional bonding film can obtain better thermal cycling and mechanical properties under the use of South temperature. [Embodiment]

200538581 五、發明說明(4) 有關本發明的詳細技術内容及其較佳實施例,兹配合 圖式說明如次。 請參閱「第1圖」所示,為本發明之複合鍍膜靶材示 意圖。因為天然純構、刪之炼彿點極低,一般真空鍛膜中 把材會受電聚轟擊,致使溫度會高達百度以上璘( 棚)無法應用在真空鍍膜製程中,造成多元鍍膜製程上無 法加入磷或硼等原子之缺點。 因此,必須以合金之方式存在,爰是本發明提出一種 錄膜把材製備方法,係利用電鍍(£1^1^〇1)131:丨1^)或無電 鍍(Electroless plating)方法,於一基材1〇上製作一膜 ❶ 層20,其該膜層20含磷或硼等原子,而成為一複合靶材', 又此一含磷或硼之膜層20中填或硼之比例,可利用電錢( 或無電鍍)時溶液或製程參數變化控制,如此可精準控制 該膜層20中碌或硼之含量,由〇·5〜25%(原子比)於該膜 層20厚膜’做為多靶鍍膜製程中一含磷或硼之靶材。藉此 鑛膜製程中將含磷、硼等原子加入鍍膜製程,如是可使多 元功能性鍍膜在高溫使用下,獲得更佳的熱循環性及機械 性質等優點。 其中’該基材係選自含銅、鐵、姑、>6夕、鈦、錯、銳 、鉬、釕、鍺、鈀、铪、鈕、鎢、銖、餓、銥、鉻、錳、《I 錯、始、銀和金組合中其中之一所製成,而該膜層係可為 錄、紹、鉻、鎢及其組合之一其中者。 現就其製作流程說明之,請參閱「第2圖」所示,為本 發明之電鑛法靶材製作流程。首先針對基材1 0,先將基材200538581 V. Description of the invention (4) The detailed technical content of the present invention and its preferred embodiments are described below with reference to the drawings. Please refer to "Figure 1" for the schematic view of the composite coating target of the present invention. Because the natural pure structure and the point of refining the Buddha are extremely low, the material in the vacuum forging film will be bombarded with electricity, which will cause the temperature to reach Baidu or more. Disadvantages of atoms such as phosphorus or boron. Therefore, it must exist in the form of an alloy. This is a method for preparing a film recording material proposed by the present invention, which uses electroplating (£ 1 ^ 1 ^ 〇1) 131: 丨 1 ^) or electroless plating. A film 20 is formed on a substrate 10, and the film layer 20 contains atoms such as phosphorus or boron to form a composite target, and the ratio of the filling or boron in the film layer 20 containing phosphorus or boron It can use the change of solution or process parameters when using electricity (or electroless plating), so that the content of boron or boron in the film layer 20 can be accurately controlled, from 0.5 to 25% (atomic ratio) in the film layer 20 thick. The film is used as a target containing phosphorus or boron in a multi-target coating process. In this way, atoms containing phosphorus and boron are added to the coating process during the process of the mineral film. If the multifunctional functional coating is used at high temperature, it can obtain better thermal cycling and mechanical properties. Where 'the substrate is selected from the group consisting of copper, iron, copper, > 6th, titanium, copper, iron, molybdenum, ruthenium, germanium, palladium, thorium, button, tungsten, baht, hungry, iridium, chromium, manganese, "I W, made of silver, gold and one of the combinations, and the film system can be one of Shao, Shao, chromium, tungsten and their combinations. For the description of the manufacturing process, please refer to "Figure 2", which is the manufacturing process of the target of the electric ore method of the present invention. First for substrate 10, first

200538581 五、發明說明(5) 裁切31、基材表面研磨32及基材表面拋光33等步驟,同時 將電鑛液34準備好,其中該電鍍液34中包括Nis% · 6仏〇 ( 150克/升)、]\^〇12*6[120 (45克/升)、]\^(]〇3.1〇{|2〇(40 克/升)、Η3Ρ04 ( 5 0 克/ 升)及H3P〇3 (50 克/升)。2 將最後拋光過之基材1〇於電鍍液34中進行電鍍施行35 ,其中該電鍍施行35之調變參數為溫度5〇°c、pn13、電 流密度10〇11^/(:1112及鍍膜時間1至5小時;最後將鑛覆完成 之把材置於清水中洗滌36兩分鐘,如是可完成一X含填^或硼 之膜層20,而成為一複合靶材。 請再參閱「第3圖」所示,為本發明之無電鍍法靶材 4 製作流程。首先針對基材10,先將基材裁切41、基材表面 研磨42及基材表面拋光43等步驟,同時將無電鑛液44準備 好,其中該電鍍液44中包括NiS〇4 · 6H20 ( 2 0克/升)、200538581 V. Description of the invention (5) Cutting 31, polishing of the substrate surface 32 and polishing of the substrate surface 33, etc. At the same time, the electro-mineral fluid 34 is prepared, and the plating solution 34 includes Nis% · 6 仏 〇 (150 G / L),] \ ^ 〇12 * 6 [120 (45 g / L),] \ ^ (] 〇3.1〇 {| 2〇 (40 g / L), 3P04 (50 g / L), and H3P 〇3 (50 g / L). 2 The last polished substrate 10 is subjected to electroplating process 35 in a plating solution 34, wherein the modulation parameters of the electroplating process 35 are temperature 50 ° c, pn13, and current density 10 〇11 ^ / (: 1112 and coating time of 1 to 5 hours; finally, the finished material is washed in clean water for 36 minutes, if it can complete an X layer containing ^ or boron film 20, and become a Composite target material. Please refer to "Figure 3" again for the production process of the electroless target material 4 of the present invention. First of all, for substrate 10, substrate cutting 41, substrate surface grinding 42 and substrate Surface polishing 43 and other steps, and at the same time, an electroless mineral liquid 44 is prepared. The electroplating liquid 44 includes NiS04 · 6H20 (20 g / L),

NaC4H4 04 ·6Η20 (16 克/ 升)及NaH2P〇2 ·Η20 ( 27 克/ 升)。 將最後拋光過之基材10於無電鑛液44中進行無電鑛施 行45,其中該無電鍍施行45之調變參數為容積面積比 20cm3/cm2、溫度70〜90 C、ρΗ4·〇〜5.8、鑛膜時間1至2小NaC4H4 04 · 6Η20 (16 g / L) and NaH2P〇2 · Η20 (27 g / L). The final polished substrate 10 is subjected to an electroless ore application 45 in an electroless ore solution 44. The adjustment parameters of the electroless plating application 45 are a volume area ratio of 20 cm3 / cm2, a temperature of 70 to 90 C, ρΗ4.0 to 5.8, Mineral film time 1 to 2 hours

時及鍍膜批次1〜20次;最後將鍍覆完成之靶材置於清水 中洗滌36兩分鐘,如是可完成一含磷或硼之膜層2〇,而成 為一複合把材。 U 綜上所述,經由電鍵或無電鍍技術,可以製作成分精 準控制之含磷或·之膜層20靶材,同時可配合多元鍍膜製 程中所需之其它純元素或合金靶材,置入多靶鍍膜系統中 可配合多靶之真空鍍膜系統,利用各靶材之參數調變,可Time and coating batch 1 to 20 times; finally, the target after plating is washed in clean water for 36 two minutes. If it can complete a film layer 20 containing phosphorus or boron, it becomes a composite handle. U In summary, through electrical keying or electroless plating technology, it is possible to produce 20-layer target materials containing phosphorus or · with precisely controlled composition, and it can be combined with other pure element or alloy target materials required in the multi-layer coating process. The multi-target coating system can be combined with a multi-target vacuum coating system. By using the parameter adjustment of each target,

200538581200538581

以精準控制多元錄膜 添加,可使多元功能性鍍膜在二、」=$磷、硼等原子之 出而獲得更佳的熱循環性及機械:質等:點因第二相的析 上述僅為本發明之較佳實施例而已,並非用來 =明實施之範圍,即凡依本發明申請專利範圍所做的均等 變化與修飾,皆為本發明專利範圍所涵蓋。With the precise control of the addition of the multi-component recording film, the multi-functional coating can obtain better thermal cycling and mechanical properties in the presence of atoms such as phosphorus and boron. Quality: Quality, etc. This is only a preferred embodiment of the present invention, and is not intended to indicate the scope of implementation, that is, all equivalent changes and modifications made in accordance with the scope of the patent application for the present invention are covered by the scope of the invention patent.

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200538581 ίο :基材 20 :膜層 31、 41 :基材裁切 32、 42 :基材表面研磨 33、 43 :基材表面拋光 34 :電鍵液 3 5 :電鍵施行 3 6、4 6 :洗條 4 4 :無電鑛液 4 5 :無電鍍施行200538581 ί: Base material 20: Film layer 31, 41: Base material cutting 32, 42: Base material surface polishing 33, 43: Base material surface polishing 34: Electric key liquid 3 5: Electric key application 3 6, 4 6: Washing strip 4 4: electroless mineral fluid 4 5: electroless plating

第11頁Page 11

Claims (1)

200538581 六、申請專利範圍 1 · 一種鍍膜靶材製備方法,係於 ’其特徵在於,200538581 VI. Scope of patent application 1 · A method for preparing coated targets, which is characterized by, 層 一基材上製作〜 該膜層係利用電鑛(Electroplating)方法,於上 含磷或硼等原子,而成為一複合把材。 ;膜 2 ·如申請專利範圍第1項所述之鍍膜靶材製備方去 其中’該基材係選自含銅、鐵、钻、碎、欽、錯、妒 、釕、铑、鈀、姶、鈕、鎢、銖、鐵、銥、鉻、錳、鍺 鉑、銀和金組合中其中之一所製成。 3.如申請專利範圍第1項所述之鑛膜乾材製備方法,The layer is made on a substrate ~ This film layer is made of a compound, such as phosphorus or boron, by using the electroplating method. Film 2 · The coating target preparation method described in item 1 of the scope of the patent application, where the substrate is selected from the group consisting of copper, iron, diamond, crushed, chin, jealous, ruthenium, rhodium, palladium, rhenium , Button, tungsten, baht, iron, iridium, chromium, manganese, germanium platinum, silver and gold. 3. The method for preparing the mineral film dry material as described in item 1 of the scope of patent application, 鉬 其中,該膜層係可為鎳、鋁、鉻、鎢及其組合之一其中者Molybdenum Wherein, the film layer may be one of nickel, aluminum, chromium, tungsten and combinations thereof 4·如申請專利範圍第1項所述之鍍膜靶材製備方法, 其中,該膜層20中磷或硼之含量係由電鍍時溶液或製程參 數變化控制。 5 ·如申請專利範圍第3項所述之鍍膜靶材製備方法, 其中,該磷或硼之含量為〇. 5〜25%(原子比)於該膜層。 6 ·如申請專利範圍第3項所述之鍍膜靶材製備方法, 其中,該電鍍(£4(:1:1'〇?1&1;丨1^)方法尚可使用無電鍍( Electroless plating)取代。4. The method for preparing a coating target as described in item 1 of the scope of patent application, wherein the content of phosphorus or boron in the film layer 20 is controlled by changes in the solution or process parameters during electroplating. 5 · The method for preparing a coating target according to item 3 of the scope of the patent application, wherein the content of the phosphorus or boron is 0.5 to 25% (atomic ratio) in the film layer. 6 · The method for preparing a coating target as described in item 3 of the scope of the patent application, wherein the electroless plating (£ 4 (: 1: 1: 00-1 &1; 丨 1 ^) method can still use electroless plating ) Instead. 第12頁Page 12
TW093114685A 2004-05-25 2004-05-25 Preparation method of film-coating target TW200538581A (en)

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