200538301 (1) 九、發明說明 【發明所屬之技術領域】 本發明是有關感熱印刷頭及其製造方法。 【先前技術】 圖30及圖31是表示以往的感熱印刷頭。圖30所示 的感熱印刷頭XI是依次積層絕緣基板90，釉面層（glaze φ layer) 91，電阻體92，電極93 a· 93b，及保護層94來形 成（例如參照專利文獻1 )。電阻體92中，位於電極 93a，93b間的部份是形成發熱部92a。藉由此發熱部92a 的發熱作用，可對感熱記録媒體印字。 但，在製造感熱印刷頭XI時，是在電阻體92的形成 後，形成電極93a，93b。電極93a’ 93b的形成是例如將 樹脂酸鹽（resinates)金糊料（paste)印刷於電阻體92 上之後燒成。因此燒成用的加熱，電阻體92恐會有氧 φ 化，變質之虞。 相對的，在圖3 1所示的感熱印刷頭X2中’電阻體 92與電極93a，93b的積層順序是與圖30所示的感熱印刷 頭XI形成相反。若利用如此的構成，則在形成電極93 a， 93b的階段中，電阻體92尙未被形成。藉此’可解除因爲 電極93a，93b的燒成，而造成電阻體92氧化等不良情 況。 但，在圖3 1所示的感熱印刷頭X2中’如以下所述’ 尙有應改善的點。 -4- 200538301 (2) 第1點，電極93a，93b會對釉面層91的表面產生相 當於電極93a，93b的厚度之階差Η。電阻體92會在產生 階差Η的部份中以急劇的角度彎曲。以急劇的角度彎曲之 方式來適切地形成電阻體92是件困難的事。並且，電阻 體92在上述彎曲部份中容易發生斷線。200538301 (1) IX. Description of the invention [Technical field to which the invention belongs] The present invention relates to a thermal print head and a manufacturing method thereof. [Prior Art] FIG. 30 and FIG. 31 show a conventional thermal print head. The thermal print head XI shown in FIG. 30 is formed by stacking an insulating substrate 90, a glaze layer 91, a resistor 92, electrodes 93a and 93b, and a protective layer 94 in this order (see, for example, Patent Document 1). In the resistor 92, a portion between the electrodes 93a and 93b forms a heat generating portion 92a. Due to the heat generating effect of the heat generating portion 92a, a thermal recording medium can be printed. However, in manufacturing the thermal print head XI, the electrodes 93a and 93b are formed after the resistor 92 is formed. The electrodes 93a 'and 93b are formed by, for example, printing a resinate gold paste on the resistor 92 and then firing. Therefore, the heating for firing may cause the resistor 92 to be oxygenated and deteriorate. In contrast, in the thermal print head X2 shown in FIG. 31, the order of lamination of the 'resistor 92 and the electrodes 93a, 93b is opposite to that of the thermal print head XI shown in FIG. 30. With such a configuration, in the stage where the electrodes 93 a and 93 b are formed, the resistor 92 ′ is not formed. By this, it is possible to eliminate the troubles such as the oxidation of the resistor 92 caused by the firing of the electrodes 93a and 93b. However, in the thermal print head X2 shown in FIG. 31, there is a point to be improved as described below. -5- 200538301 (2) In the first point, the electrodes 93a and 93b generate a step difference on the surface of the glaze layer 91 which is equivalent to the thickness of the electrodes 93a and 93b. The resistor 92 is bent at a sharp angle in a portion where the step difference 产生 is generated. It is difficult to appropriately form the resistor 92 by bending it at a sharp angle. In addition, the resistor 92 is liable to be disconnected in the bent portion.
I 第2點，電阻體92的發熱部92a會沈下於電極93a， 93b間。因此，在使感熱記録媒體配置於保護層94上來進 φ 行印字時，此感熱記録媒體與發熱部92a之間的距離會形 成較大。藉此，從發熱部92 a到感熱記録媒體的熱傳達效 率會變低。如此一來，印字濃度會變低，高畫質印字會變 得困難。並且，不適於高速印字。 第3點，在保護層94的表面上會產生對應於電極 93a，93b及電阻體92的階差。在此階差部份，感熱記録 用的色帶（ink ribbon)的墨水成份或感熱紙的紙粉成份 等容易堆積。並且，一邊使感熱記録媒體接觸於保護層94 • 的表面，一邊搬送時的順暢度也會降低。 〔專利文獻1〕 特開2001 -246770號公報 【發明內容】 (發明所欲解決的課題） 本發明是基於考量如此的情事而硏發者，其課題是在 於提供一種可減少在電阻體發生斷線之虞，且可提高從電 200538301 (3) 阻體的發熱部到感熱記録媒體的熱傳達效率，順暢地搬送 感熱紙之感熱印刷頭，及其製造方法。 (用以解決課題的手段） 本發明之感熱印刷頭的特徵係具備： 基板； 釉面層，其係形成於上述基板上； φ 複數個電極，其係於上述釉面層上互相取間隔設置； 及 電阻體，其係以能夠橫跨上述複數個電極之方式來重 疊形成於該等複數個電極上及上述釉面層上； 上述各電極中，至少上述電阻體所重疊的部份，係對 上述釉面層形成沈下的構成。 在本發明之理想的實施形態中，上述各電極中，上述 電阻體所重疊的部份，係其表面會沈下與上述釉面層的表 _ 面成一致的深度。 在本發明之理想的實施形態中，更具有覆蓋上述複數 個電極及上述電阻體之保護層。 在本發明之理想的實施形態中，上述複數個電極’係 藉由熔點比上述釉面層的軟化溫度更高，且比重比上述釉 面層更大之金屬所構成。 在本發明之理想的實施形態中，上述電阻體的寬度， 係比上述各電極中上述電阻體所重疊的部份的寬度更小。 在本發明之理想的實施形態中，上述電阻體爲延伸於 -6 - 200538301 (4) 主掃描方向的帶狀， 上述複數個電極，係含複數的個別電極及至少1個以 上的共通電極， 上述共通電極，係具有： 至少1個以上的帶狀部，其係對上述電阻體離間於副 掃描方向，且延伸於主掃描方向；及 複數個枝部，其係從上述帶狀部穿過上述電阻體而延 φ 伸於副掃描方向，且於副掃描方向排列； 又，上述複數的個別電極，係包含分別穿過上述電阻 體而形成於副掃描方向的帶狀部，且與上述共通電極的上 述複數個枝部交互排列於主掃描方向。 在本發明之理想的實施形態中，上述共通電極係具 有：夾著上述電阻體來離間於副掃描方向的1對上述帶狀 部。 在本發明之理想的實施形態中，至少1個以上的上述 • 枝部，係連結上述1對的帶狀部。 在本發明之理想的實施形態中，在上述複數個電極形 成有打線結合（wire bonding)用的結合焊墊（bonding pad)，各結合焊墊係從上述釉面層突出。 在本發明之理想的實施形態中，上述結合焊墊從上述 釉面層突出的高度爲Ιμπι以上。 在本發明之理想的實施形態中，上述結合焊墊，係比 上述各電極中上述結合焊墊以外的部份更厚。 在本發明之理想的實施形態中，上述結合焊墊係包 -7- 200538301 (5) 含： 其表面與上述釉面層的表面成一致的本體層；及 形成於該本體層的追加層。 又，本發明之感熱印刷頭的製造方法，係具有： 在形成於基板上的釉面層上互相取間隔來形成複數個 電極之步驟；及 以能夠橫跨上述複數個電極之方式來使電阻體重疊形 • 成於上述釉面層及上述複數個電極上之步驟； 其特徵係具有： 在形成上述複數個電極之後，形成上述電阻體之前， 加熱上述釉面層的至少一部份而使軟化，使上述各電極的 至少一部份對上述釉面層沈下之電極沈下步驟。 在本發明之理想的實施形態中，形成上述電阻體的步 驟，係於形成電阻體材料的膜之後，對此膜施以乾蝕刻。 在此，所謂的乾蝕刻是指利用離子化後的氣體的物理性能 Φ 量之蝕刻，或倂用離子化且被活性化的反應性氣體的物理 性能量與化學性作用之蝕刻等，例如，濺射蝕刻，離子射 束蝕刻（離子射束濺射），電漿灰化，電漿蝕刻，RIE (反應性離子蝕刻）等。 在本發明之理想的實施形態中，在上述電極沈下步驟 之前，更具有在上述各電極的一部份形成追加層之步驟。 在本發明之理想的實施形態中，在上述電極沈下步驟 之後，更具有形成重疊於上述各電極的至少一部份的追加 層之步驟。 200538301 (6) 本發明的其他優點及特徵，可由以下所進行發明的實 施形態的説明來明確得知。 【實施方式】 以下’參照圖面來具體說明有關本發明的較佳實施形 態。 圖1及圖2是表示本發明之感熱印刷頭的第1實施形 φ 態。本實施形態的感熱印刷頭A1具備：基板1，釉面層 2，複數個電極3a〜3c，複數個電阻體4，及保護層5。在 圖1中省略保護層5。 基板1是延伸於主掃描方向y的平面視長矩形的平板 狀，例如爲陶瓷製的絕緣基板。釉面層2是藉由印刷燒 成例如非晶質玻璃糊料（glass paste)來形成於基板1上 者，可達成使蓄熱性形成較佳，或使形成有複數個電極3a 〜3c的面形成平滑之任務。此釉面層2具有表面會形成凸 # 狀的曲面之隆起部20。此隆起部20有助於提高保護層5 中對應於後述的發熱部40的部份與色帶或感熱紙等的感 熱記録媒體的接觸壓。 複數個電極3 a〜3 c是藉由印刷燒成例如樹脂酸鹽金 糊料來形成者，形成於釉面層2上。各電極3b是具有2 個端部的字狀，位於基板1的一側縁部附近，如圖2所 示，釉面層2的隆起部20上。 電極3 a，3 c，如圖1所示，延伸於副掃描方向x。電 極3 a的一端部對電極3 b的一端部取一間隔。在電極3 a -9 - 200538301 (7) 的另一*端部連接通電控制用的驅動1C (圖示略）。電極 3c的一端部會分歧成分叉狀，與電極3b的另一端部取一 間隔。電極3 c的另一端部會被連接至公用線（圖示 略）。一旦上述驅動1C被開啓，則電流會從上述公用線 經由電極3c來流動於電阻體4及電極3b，3a。 如圖2所示，複數個電極3a〜3c會沈下於釉面層2 内。藉由此沈下，複數個電極3a〜3c的表面與釉面層2 Φ 的表面會形成大略面一致。亦即，複數個電極3a〜3c的 表面與釉面層2的表面之階差會形成零或幾乎接近零。 複數個電阻體4是使能夠分別橫跨電極3b的兩端部 與電極3a，3c的一端部，重疊於釉面層2與電極3a〜3c 而形成，排列於主掃描方向y。電阻體4的材質，例如爲 TaSi02。各電阻體4是其寬度W4形成比電極3a〜3c中與 各電阻體4重疊的部份的寬度W3更小。在本實施形態 中，W3爲形成25μπι程度，W4爲形成23μιη程度。 鲁 保護層5是以能夠覆蓋釉面層2，電極3a〜3c，及電 阻體4之方式來形成。保護層5是例如與釉面層2同樣 的，藉由印刷燒成玻璃糊料（glass paste )來形成。保 護層5是用以保護電極3a〜3c及電阻體4等直接接觸爲 上述感熱記録媒體，或被化學性或電性侵蝕。並且，保護 層5亦是供以提高表面平滑性者。一旦表面平滑性提高， 則保護層5與上述感熱記録媒體的印刷時之摩擦會減輕， 所以可進行順暢的印刷。 其次，說明有關感熱印刷頭A1的作用。 -10- 200538301 (8) 本實施形態的感熱印刷頭A1是釉面層2的表面與電 極3a〜3c的表面之階差爲零或幾乎接近零的狀態，在電 阻體4不會形成以急劇的角度呈大彎曲的部份。因此，難 以在電阻體4發生斷線。又，由於電阻體4的發熱部40 不會形成大幅度沈入電極3a，3c與電極3b之間的狀態， 因此發熱部.40與上述感熱記録媒體之間的距離與圖30及 圖3 1所以往的感熱印刷頭XI，X2相較之下形成較小。因 φ 此，從發熱部40往上述感熱記録媒體的熱傳達效率會變 高，印字濃度會變濃。藉此，可高畫質印字及高速印字。 此外，覆蓋釉面層2或電極3a〜3c的保護層5的表面的 階差也會變小。因此，可抑止在保護層5的表面的階差部 份，例如堆積色帶的墨水成份。並且，可使作爲上述感熱 記録媒體的感熱紙，一邊接觸於保護層5的表面，一邊順 暢地搬送。 另外，在感熱印刷頭A1的製造步驟中，有時電阻體4 φ 及電極3a〜3c會以在該等的寬度方向上偏離的狀態來形 成。與本實施形態相異，在電阻體4與電極3a〜3c形成 相同寬度的構成中，僅上述寬度方向位置偏離的量，電阻 體4與電極3a〜3c重疊的部份的寬度會變小。如此一 來，電阻體4中電流流動而發熱的區域大小會不形成一 致，印字點的大小會產生不均。在本實施形態中，電阻體 4的寬度W4要比電極3a〜3c中與電阻體4重疊的部份的 寬度W3更小。因此，在電阻體4或電極3a〜3c形成時， 即使在該等的寬度方向位置產生偏離，照樣可以制止電阻 •11 - 200538301 (9) 體4從電極3a〜3c不當突出。因此，可使電阻體4與電 極3 a〜3 c重疊的部份的寬度形成一定，進而能夠防止印 字點的不均。 其次，參照圖3〜圖1 1來説明有關感熱印刷頭A1的 製造方法之一例。圖3〜圖11是表示本實施形態的感熱印 刷頭A1的製造方法之一連串的步驟的要部平面圖及要部 剖面圖。 φ 首先，如圖3及圖4所示，準備基板1，在此基板1 上形成釉面層2。此形成是藉由非晶質玻璃糊料的印刷 燒成來進行。就非晶質玻璃糊料的玻璃成份而言’例如可 使用玻璃轉移點爲68 0°C，玻璃軟化點爲865 °C者。 其次，如圖5及圖6所示，在釉面層2的圖中上面形 成電極3a〜3c。此形成是在印刷燒成樹脂酸鹽金糊料之 後，實施圖案化。 在形成電極3a〜3c之後，如圖7所示，使電極3a〜 φ 3c沈下於釉面層2。此處理是將釉面層2例如從其玻璃成 份的玻璃軟化點加熱至玻璃轉移點的範圍，而使釉面層2 軟化。一旦釉面層2軟化，則電極3a〜3c會因爲自重而 沈下於釉面層2内。此沈下量可藉由調整上述加熱的温度 或時間來控制，只要在電極3a〜3c的表面與釉面層2的 表面形成一致的時間點或之前解除釉面層2的軟化狀態即 可 ° 在形成電極3 a〜3 c之後，形成電阻體4。此電阻體4 的形成時，首先，如圖8及圖9所示’以能夠覆蓋電極3a -12 - 200538301 (10) 〜3c之方式來形成電阻體膜4A。此電阻體膜4A是例如由 TaSi02所形成，可爲厚膜或薄膜。其次，對此電阻體膜 4 A實施乾蝕刻，如圖1 〇及圖1 1所示，以能夠橫跨電極 3b的2個端部與電極3a，3c的一端部之間的方式來形成 複數個電阻體4。此刻，如上述，以寬度W4比電極3a〜 3c中與電阻體4重疊的部份的寬度W3還要小的方式來形 成電阻體4。 φ 然後，藉由使用玻璃糊料之厚膜印刷及燒成，以能夠 覆蓋電極3a〜3c及電阻體4之方式來形成保護層5。或 者，亦可藉由使用Si02，SiAlON等之濺射法來形成保護 層5。經由如此的步驟，製造出圖1及圖2所示的感熱印 刷頭A1。 在本實施形態之感熱印刷頭A1的製造方法中，使複 數個電極3a〜3c對釉面層2沈下的手段，是採用藉由加 熱來使釉面層2軟化的狀態下，使電極3a〜3c藉由其自 • 重而沈下之手段。因此，與例如削去釉面層2的一部份， 在該削去處形成電極3a〜3c的方法相較之下，其處理容 易。並且，可以藉由控制釉面層2的加熱温度及加熱時間 來控制電極3a〜3c對釉面層2的沈下量，且能夠迴避在 釉面層2與電極3a〜3c之間產生不當的間隙。 在上述製造方法中，電極3a〜3c的材料爲使用金。 金較爲熔點高，例如與鋁相較下，耐蝕性佳優。並且，金 的比重要比構成釉面層2的材料的比重更大。因此，在藉 由加熱來使釉面層2軟化時，可不使發生氧化等，利用重 -13- 200538301 (11) 力來迅速地使沈下於釉面層2内。 又，可利用乾蝕刻來進行電阻體4的形成’藉此可正 確地加工電阻體4的大小。因此，在使電阻體4的寬度 W4形成比電極3a〜3c中與電阻體4重疊的部份的寬度 W3更小的尺寸時，不必過度擴大該等的寬度差。例如， 在使電極3a〜3c沈下的步驟中，隨著電極3a〜3c沈下而 於寬度方向產生相對性的偏離時’可事先使寬度W3.W4 φ 的差形成與該偏離量同等或適度大。因此’可適當地防止 因爲如此的偏離而造成印字點不均。 圖12〜圖29是表示本發明之感熱印刷頭的其他實施 形態及其製造方法。並且，在該等的圖中’對於與上述第 1實施形態所已經敘述的要件同一或類似的要件賦予同一 符號，且適當地省略其説明。 圖12〜圖14是表示本發明之感熱印刷頭的第2實施 形態。本實施形態的感熱印刷頭A2是複數個電極的構 φ 成，及電阻體4的形狀與上述第1實施形態相異。並且’ 在圖12中省略保護層5。 如圖1 2所示’複數的個別電極3d是排列配置於主掃 描方向y。個別電極3d具有帶狀部31與結合焊墊32。 帶狀部31是延伸於副掃描方向X，穿過電阻體4與釉 面層2之間。結合焊墊32是供以結合導線W的部份’如 圖13所示’具有積層本體層32&與追加層321)的構造。 本體層3 2a是與帶狀部31接連，例如藉由使用樹脂酸鹽 金糊料的印刷·燒成來形成。帶狀部31及本體層32a的厚 -14 - 200538301 (12) 度爲形成0.6 μηι，該圖中上面會與釉面層2的表面大略一 致。追加層32b是由釉面層2來突出於圖中上方，爲直接 結合導線W的部份。 追加層3 2b是例如藉由使用金糊料的印刷燒成來形 成，其厚度爲形成1 μηι程度。在此所謂的金糊料是與樹脂 酸鹽金糊料有所不同，例如在黏結劑（binder )混入金的 粒子之糊料。使用樹脂酸鹽金糊料的成膜，其厚度較薄， φ 適於形成平滑的膜，相對的，使用金糊料的成膜，適於形 成厚度較厚的膜。此外，亦可取代使用金糊料的印刷燒 成，例如藉由使用金的濺射來形成追加層32b。 如圖12所示，共通電極3e具有1對的帶狀部35，36 及複數個枝部37。1對的帶狀部35, 36爲延伸於主掃描 方向y的帶狀，夾著電阻體4在副掃描方向X上互相離 間。複數個枝部37爲延伸於副掃描方向X的帶狀，在主 掃描方向y上與複數的個別電極3d交替配列。1對的帶狀 • 部35，36是藉由複數個枝部37來連結。 帶狀部3 5是其一部份會作爲供以結合導線W的結合 焊墊使用。如圖13所示，帶狀部35具有積層本體層35a 與追加層35b的構造。本體層35a是與複數個枝部37及 帶狀部3 6連結，例如藉由使用樹脂酸鹽金糊料的印刷 燒成來形成。本體層35a，複數個枝部37，及帶狀部36 的厚度爲形成〇.6μηι，該圖中上面會與釉面層2的表面大 略一致。追加層35b是與追加層32同樣的，例如藉由使 用金糊料的印刷燒成來形成，其厚度爲形成1 μηι程度。 -15- 200538301 (13) 如圖1 2所示，電阻體4爲沿著主掃描方向y的帶 狀，如圖1 3所示，配置於釉面層2的隆起部20的圖中上 方。如圖1 2及圖1 4所示，電阻體4是與複數的個別電極 3d的帶狀部31及共通電極3e的枝部37重疊。電阻體4 中，夾持於帶狀部31與枝部37的部份會形成發熱部40。 如圖14所示，帶狀部31及枝部37與釉面層2爲面一 致，藉此電阻體4在主掃描方向y上幾乎不會有階差，形 φ 成平滑的形狀。 在感熱印刷頭A2的印字中，是藉由圖外的驅動1C， 經由導線W來選擇任意的個別電極3d。在所被選擇的個 別電極3d與夾著該個別電極3d的枝部37之間通電。藉 此，發熱部40會發熱。此熱會被傳達至感熱記録媒體， 對該感熱記録媒體進行印刷。 其次，說明有關感熱印刷頭A2的作用。 若利用本實施形態，則如圖14所示，因爲電阻體4 φ 在主掃描方向y上爲平滑的形狀，所以保護層5中覆蓋電 阻體4的部份也會在主掃描方向y上形成平滑的形狀。藉 此，保護層5中覆蓋電阻體4的部份是適於與感熱記録媒 體密著。特別是即使感熱記録媒體藉由塑膠等較硬質的材 質來形成，照樣能夠使保護層5與感熱記録媒體適切地密 著。如此一來，來自電阻體4的發熱部40的熱會容易傳 達至感熱記録媒體。因此，若利用感熱印刷頭A2，則可 鮮明的印字。特別是在謀求高精細化時，適於將小型的各 印字點予以鮮明地印字。 -16- 200538301 (14) 往發熱部4 0的通電是由1對的帶狀部3 5，3 6來形 成。由於集合1對的帶狀部3 5，3 6之面積比較大，所以 適於抑止1對的帶狀部3 5，3 6之電壓降低。又，可使帶 狀部3 6形成較細寬度。若帶狀部3 6爲細寬，則可使電阻 體4接近基板1的圖中右端。因此，有利於使感熱印刷頭 A2構成所謂的近端型，亦即電阻體4會被配置於基板1 的圖中右端附近。 φ 此外，結合導線w的結合焊墊32及帶狀部35會從 釉面層2突出。因此，即使供以結合導線w的結合工具 的前端，例如比結合焊墊32還要大時，還是能夠迴避此 結合工具會與釉面層2不當干擾。因此，可適當地進行導 線W的結合作業。又，結合焊墊32及帶狀部35，其厚度 合計1.6 μηι程度，爲較厚。藉此，可提高導線W的接合 強度。 其次，參照圖15〜圖23來說明感熱印刷頭Α2的製 # 造方法之一例。圖1 5〜圖23是表示本實施形態之感熱印 刷頭Α2的製造方法之一連串的步驟的要部平面圖及要部 剖面圖。 首先，如圖15所示，準備基板1，在基板1上形成釉 面層2。釉面層2的形成是藉由使用非晶質玻璃糊料的厚 膜印刷及燒成來進行。 其次，如圖16所示，形成金的薄膜3Α。金的薄膜 3Α的形成，是例如藉由使用樹脂酸鹽金糊料的印刷燒成 來進行。此刻，金的薄膜3A的厚度爲形成0.6μηι程度。 -17- 200538301 (15) 接著，如圖1 7及圖1 8所示，在金的薄膜3 A上形成 金的薄膜3 B。此刻，金的薄膜3 B的厚度爲形成1 μηι程 度。並且，金的薄膜3 Α中使圖中右側部份從金的薄膜3 Β 露出。金的薄膜3 B的形成是例如藉由使用金糊料的印刷 燒成來進行。又，亦可與本實施形態不同，藉由重複數 次使用樹脂酸鹽金糊料的印刷燒成來形成金的薄膜3B。 或者，亦可藉由使用金的濺射來形成金的薄膜3B。I Second point, the heating portion 92a of the resistor 92 will sink between the electrodes 93a and 93b. Therefore, when the thermal recording medium is arranged on the protective layer 94 for printing, the distance between the thermal recording medium and the heat generating portion 92a becomes large. Thereby, the heat transfer efficiency from the heat generating portion 92a to the thermal recording medium becomes low. As a result, the print density becomes low, and high-quality print becomes difficult. Also, it is not suitable for high-speed printing. At the third point, a step difference occurs on the surface of the protective layer 94 corresponding to the electrodes 93a, 93b and the resistor 92. In this step, the ink component of the ink ribbon for thermal recording or the paper powder component of thermal paper is easy to accumulate. In addition, the smoothness of the thermal recording medium while being brought into contact with the surface of the protective layer 94 will decrease. [Patent Document 1] Japanese Unexamined Patent Publication No. 2001-246770 [Summary of the Invention] (Problems to be Solved by the Invention) The present invention has been developed based on consideration of such a situation, and an object of the present invention is to provide a method capable of reducing the occurrence of interruptions in a resistor. It can improve the heat transfer efficiency from the heating part of the electric 200538301 (3) resistor to the thermal recording medium, smoothly transfer the thermal print head of thermal paper, and its manufacturing method. (Means for Solving the Problems) The thermal print head of the present invention is characterized by having: a substrate; a glaze layer formed on the substrate; φ a plurality of electrodes arranged on the glaze layer at intervals from each other. ; And a resistor body, which is formed on the plurality of electrodes and the glaze layer so as to be able to cross the plurality of electrodes; at least a portion of the electrodes overlapping the resistor body is A sunken structure is formed on the glaze layer. In a preferred embodiment of the present invention, the overlapping portion of the resistor in each of the electrodes is such that the surface thereof sinks to a depth consistent with the surface of the glaze layer. In a preferred embodiment of the present invention, it further includes a protective layer covering the plurality of electrodes and the resistor. In a preferred embodiment of the present invention, the plurality of electrodes' are made of a metal having a melting point higher than the softening temperature of the glaze layer and a specific gravity greater than that of the glaze layer. In a preferred embodiment of the present invention, the width of the resistor is smaller than the width of a portion where the resistor overlaps among the electrodes. In a preferred embodiment of the present invention, the resistor is a strip extending from -6-200538301 (4) in the main scanning direction, and the plurality of electrodes are a plurality of individual electrodes and at least one common electrode. The common electrode includes: at least one or more strip-shaped portions that are spaced apart from the resistor body in the sub-scanning direction and extend in the main scanning direction; and a plurality of branch portions that pass through the strip-shaped portion The resistors extend φ in the sub-scanning direction and are arranged in the sub-scanning direction. The plurality of individual electrodes include strip-shaped portions formed in the sub-scanning direction through the resistors, and are common to the above. The plurality of branches of the electrode are alternately arranged in the main scanning direction. In a preferred embodiment of the present invention, the common electrode includes a pair of the strip-shaped portions separated from each other in the sub-scanning direction by sandwiching the resistor. In a preferred embodiment of the present invention, at least one of the above-mentioned branch portions is a band-shaped portion connecting the above-mentioned one pair. In a preferred embodiment of the present invention, bonding pads for wire bonding are formed on the plurality of electrodes, and each bonding pad protrudes from the glaze layer. In a preferred embodiment of the present invention, the height of the bonding pad protruding from the glaze layer is 1 μm or more. In a preferred embodiment of the present invention, the bonding pad is thicker than portions of the electrodes other than the bonding pad. In a preferred embodiment of the present invention, the above-mentioned bonding pad package includes: -7-200538301 (5) including: a body layer whose surface is consistent with the surface of the glaze layer; and an additional layer formed on the body layer. The method of manufacturing a thermal print head of the present invention includes: a step of forming a plurality of electrodes at intervals on the glaze layer formed on the substrate; and making a resistor capable of straddling the plurality of electrodes. A step of forming the body on the glaze layer and the plurality of electrodes; characterized in that: after forming the plurality of electrodes and before forming the resistor body, heating at least a part of the glaze layer so that Softening, so that at least a part of each of the electrodes sinks to the electrode sinking step of sinking the glaze layer. In a preferred embodiment of the present invention, the step of forming the resistor is performed after forming a film of the resistor material, and then performing dry etching on the film. Here, the dry etching refers to etching using the physical property Φ of the ionized gas, or etching using the physical property and chemical action of the ionized and activated reactive gas, for example, Sputter etching, ion beam etching (ion beam sputtering), plasma ashing, plasma etching, RIE (reactive ion etching), etc. In a preferred embodiment of the present invention, before the electrode sinking step, the method further includes a step of forming an additional layer on a part of each of the electrodes. In a preferred embodiment of the present invention, after the electrode sinking step, a step of forming an additional layer overlapping at least a part of each of the electrodes is further provided. 200538301 (6) Other advantages and features of the present invention can be clearly understood from the following description of the embodiments of the invention. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be specifically described with reference to the drawings. Fig. 1 and Fig. 2 show a first embodiment of the thermal print head of the present invention in a φ state. The thermal print head A1 of this embodiment includes a substrate 1, a glaze layer 2, a plurality of electrodes 3a to 3c, a plurality of resistors 4, and a protective layer 5. The protective layer 5 is omitted in FIG. 1. The substrate 1 has a flat rectangular shape in plan view extending in the main scanning direction y, and is, for example, a ceramic insulating substrate. The glaze layer 2 is formed on the substrate 1 by printing and firing, for example, an amorphous glass paste, and can achieve a better heat storage property or a surface having a plurality of electrodes 3a to 3c. Form a smooth task. This glaze layer 2 has a raised portion 20 whose surface is convexly curved. This raised portion 20 contributes to increase the contact pressure of the portion of the protective layer 5 corresponding to the heat-generating portion 40 described later and a thermal recording medium such as a ribbon or a thermal paper. The plurality of electrodes 3 a to 3 c are formed by printing and firing, for example, a resinate gold paste, and are formed on the glaze layer 2. Each electrode 3b has a character shape with two end portions, and is located near a side ridge portion of the substrate 1, as shown in FIG. 2, on the raised portion 20 of the glaze layer 2. The electrodes 3 a and 3 c, as shown in FIG. 1, extend in the sub-scanning direction x. One end of the electrode 3a is spaced from one end of the electrode 3b. A drive 1C (not shown) for current control is connected to the other * end of electrode 3 a -9-200538301 (7). One end of the electrode 3c is bifurcated into a branch shape, and is spaced from the other end of the electrode 3b. The other end of the electrode 3 c is connected to a common line (not shown). Once the drive 1C is turned on, a current flows from the common line to the resistor 4 and the electrodes 3b, 3a through the electrode 3c. As shown in FIG. 2, the plurality of electrodes 3 a to 3 c will sink into the glaze layer 2. As a result of this sinking, the surfaces of the plurality of electrodes 3a to 3c and the surface of the glaze layer 2 Φ are formed to be approximately the same. That is, the step difference between the surface of the plurality of electrodes 3a to 3c and the surface of the glaze layer 2 will be zero or nearly zero. The plurality of resistors 4 are formed so as to be able to straddle both end portions of the electrode 3b and one end portions of the electrodes 3a, 3c, and overlap the glaze layer 2 and the electrodes 3a to 3c, and are arranged in the main scanning direction y. The material of the resistor 4 is, for example, TaSi02. Each resistor 4 has a width W4 that is smaller than a width W3 of a portion of the electrodes 3a to 3c that overlaps with each resistor 4. In this embodiment, W3 is formed to approximately 25 μm, and W4 is formed to approximately 23 μm. The protective layer 5 is formed so as to cover the glaze layer 2, the electrodes 3a to 3c, and the resistor 4. The protective layer 5 is, for example, the same as the glaze layer 2, and is formed by printing and firing a glass paste. The protective layer 5 is used to protect the electrodes 3a to 3c, the resistor 4 and the like from direct contact as the above-mentioned thermal recording medium, or is chemically or electrically corroded. In addition, the protective layer 5 is also used for improving the surface smoothness. When the surface smoothness is improved, the friction between the protective layer 5 and the thermal recording medium during printing is reduced, so that smooth printing can be performed. Next, the effect of the thermal print head A1 will be described. -10- 200538301 (8) The thermal print head A1 of this embodiment is in a state where the step difference between the surface of the glaze layer 2 and the surfaces of the electrodes 3a to 3c is zero or almost zero, and the resistor 4 is not formed with a sharp The angle is a large curved part. Therefore, it is difficult for the resistor 4 to be disconnected. In addition, since the heating portion 40 of the resistor 4 does not substantially sink into the state between the electrodes 3a, 3c and the electrode 3b, the distance between the heating portion .40 and the above-mentioned thermal recording medium is similar to that shown in FIG. 30 and FIG. 31. Therefore, the thermal print heads XI and X2 are smaller in comparison. Therefore, the heat transfer efficiency from the heat generating portion 40 to the thermal recording medium becomes higher, and the print density becomes higher. This enables high-quality printing and high-speed printing. In addition, the step of the surface of the protective layer 5 covering the glaze layer 2 or the electrodes 3a to 3c also becomes small. Therefore, a stepped portion on the surface of the protective layer 5 can be suppressed, for example, the ink component of a stacked ink ribbon. In addition, the thermal paper as the thermal recording medium can be smoothly conveyed while being in contact with the surface of the protective layer 5. In the manufacturing process of the thermal print head A1, the resistors 4? And the electrodes 3a to 3c may be formed in a state deviated in the width direction. Different from this embodiment, in the configuration in which the resistor body 4 and the electrodes 3a to 3c have the same width, the width of the portion where the resistor body 4 and the electrodes 3a to 3c overlap is reduced only by the above-mentioned positional deviation. In this way, the size of the area in the resistor 4 where the current flows and generates heat will not be uniform, and the size of the printed dots will be uneven. In this embodiment, the width W4 of the resistor 4 is smaller than the width W3 of the portions of the electrodes 3a to 3c that overlap the resistor 4. Therefore, when the resistor body 4 or the electrodes 3a to 3c are formed, the resistor can still be stopped even if the position in the width direction is deviated. • 11-200538301 (9) The body 4 projects from the electrodes 3a to 3c improperly. Therefore, the width of the portion where the resistor 4 and the electrodes 3a to 3c overlap can be made constant, and the unevenness of the printed dots can be prevented. Next, an example of a method for manufacturing the thermal print head A1 will be described with reference to Figs. 3 to 11. 3 to 11 are a plan view and a cross-sectional view of a main part showing a series of steps in a method of manufacturing the thermal print head A1 according to the present embodiment. φ First, as shown in FIGS. 3 and 4, a substrate 1 is prepared, and a glaze layer 2 is formed on the substrate 1. This formation is performed by printing and firing of an amorphous glass paste. As for the glass component of the amorphous glass paste, for example, a glass transition point of 680 ° C and a glass softening point of 865 ° C can be used. Next, as shown in Figs. 5 and 6, electrodes 3a to 3c are formed on the upper surface of the glaze layer 2 in the figure. This formation is performed after printing and firing the resinate gold paste. After the electrodes 3a to 3c are formed, as shown in FIG. 7, the electrodes 3a to φ3c are sunk in the glaze layer 2. This treatment is to soften the glaze layer 2 by heating the glaze layer 2 from the glass softening point of the glass component to the glass transition point, for example. Once the glaze layer 2 is softened, the electrodes 3a to 3c will sink into the glaze layer 2 due to their own weight. This sinking amount can be controlled by adjusting the above-mentioned heating temperature or time, as long as the surface of the electrodes 3a to 3c and the surface of the glaze layer 2 form a consistent point in time or before the softened state of the glaze layer 2 is released After the electrodes 3 a to 3 c are formed, the resistor 4 is formed. To form this resistor body 4, first, as shown in FIGS. 8 and 9 ', the resistor body film 4A is formed so as to cover the electrodes 3a-12-200538301 (10) to 3c. The resistor film 4A is formed of, for example, TaSi02, and may be a thick film or a thin film. Next, as shown in FIG. 10 and FIG. 11, a dry etching process is performed on this resistor film 4 A, and a plurality is formed so as to span between the two end portions of the electrode 3 b and one end portions of the electrodes 3 a and 3 c. Person resistor 4. At this time, as described above, the resistor 4 is formed so that the width W4 is smaller than the width W3 of the portion of the electrodes 3a to 3c that overlaps the resistor 4. φ Then, the protective layer 5 is formed so as to cover the electrodes 3a to 3c and the resistor 4 by printing and firing using a thick film of a glass paste. Alternatively, the protective layer 5 may be formed by a sputtering method using Si02, SiAlON, or the like. Through such steps, the thermal print head A1 shown in Figs. 1 and 2 is manufactured. In the method for manufacturing a thermal print head A1 of this embodiment, the means for sinking the plurality of electrodes 3a to 3c to the glaze layer 2 is to use the electrodes 3a to 3a to soften the glaze layer 2 by heating. 3c sinks by its weight. Therefore, compared with the method of forming a part of the glaze layer 2 and forming the electrodes 3a to 3c at the cutout, the processing is easier. In addition, by controlling the heating temperature and heating time of the glaze layer 2, the amount of sinking of the electrodes 3a to 3c to the glaze layer 2 can be controlled, and an improper gap between the glaze layer 2 and the electrodes 3a to 3c can be avoided. . In the above manufacturing method, the material of the electrodes 3a to 3c is gold. Gold has a higher melting point, for example, it has better corrosion resistance compared to aluminum. Moreover, the specific gravity of gold is greater than the specific gravity of the material constituting the glaze layer 2. Therefore, when the glaze layer 2 is softened by heating, it is possible to quickly sink the glaze layer 2 by using a force of -13-200538301 (11) without causing oxidation or the like. Further, the formation of the resistor 4 can be performed by dry etching, and the size of the resistor 4 can be accurately processed. Therefore, when the width W4 of the resistor 4 is formed to be smaller than the width W3 of the portions overlapping the resistor 4 among the electrodes 3a to 3c, it is not necessary to excessively widen the width difference. For example, in the step of sinking the electrodes 3a to 3c, when a relative deviation occurs in the width direction as the electrodes 3a to 3c sink, 'the difference in width W3.W4 φ may be made equal to the deviation amount or a moderately large amount in advance. . Therefore, it is possible to appropriately prevent uneven printing dots due to such deviation. Fig. 12 to Fig. 29 show another embodiment of the thermal print head of the present invention and a method for manufacturing the same. In these drawings, the same reference numerals are given to the same or similar elements as those already described in the first embodiment, and descriptions thereof are appropriately omitted. 12 to 14 show a second embodiment of the thermal printhead of the present invention. The thermal print head A2 of this embodiment has a structure φ of a plurality of electrodes, and the shape of the resistor 4 is different from that of the first embodiment. In addition, the protective layer 5 is omitted in FIG. 12. As shown in Fig. 12, the plurality of individual electrodes 3d are arranged in the main scanning direction y. The individual electrode 3 d includes a strip-shaped portion 31 and a bonding pad 32. The strip-shaped portion 31 extends in the sub-scanning direction X and passes between the resistor 4 and the glaze layer 2. The bonding pad 32 has a structure where a bonding wire W is provided as shown in FIG. 13 and has a laminated body layer 32 & and an additional layer 321). The main body layer 32a is connected to the strip-shaped portion 31, and is formed by, for example, printing and firing using a resinate gold paste. The thickness of the band-shaped portion 31 and the body layer 32a is -14-200538301 (12) degrees to form 0.6 μm, and the upper surface in this figure is approximately the same as the surface of the glaze layer 2. The additional layer 32b is a part which is protruded from the upper part of the figure by the glaze layer 2 and is directly connected to the wire W. The additional layer 3 2b is formed by, for example, printing and firing using a gold paste, and has a thickness of about 1 μm. The so-called gold paste is different from a resinate gold paste, for example, a paste in which gold particles are mixed in a binder. The film formation using a resinate gold paste has a thin thickness, and φ is suitable for forming a smooth film, while the film formation using a gold paste is suitable for forming a thicker film. Alternatively, instead of printing and firing using a gold paste, for example, the additional layer 32b may be formed by sputtering using gold. As shown in FIG. 12, the common electrode 3e has a pair of strip-shaped portions 35, 36 and a plurality of branch portions 37. The pair of strip-shaped portions 35, 36 is a strip shape extending in the main scanning direction y, sandwiching a resistor 4 are separated from each other in the sub-scanning direction X. The plurality of branch portions 37 are band-shaped extending in the sub-scanning direction X, and are alternately aligned with the plurality of individual electrodes 3d in the main scanning direction y. A pair of band-shaped portions 35 and 36 are connected by a plurality of branch portions 37. The strip portion 35 is a part of which is used as a bonding pad for bonding the lead wire W. As shown in FIG. 13, the strip-shaped portion 35 has a structure in which a main body layer 35 a and an additional layer 35 b are laminated. The main body layer 35a is connected to the plurality of branch portions 37 and the band-shaped portions 36, and is formed by, for example, printing and firing using a resinate gold paste. The thickness of the body layer 35a, the plurality of branch portions 37, and the strip-shaped portion 36 is 0.6 μm, and the upper surface in this figure will be approximately the same as the surface of the glaze layer 2. The additional layer 35b is the same as the additional layer 32, and is formed, for example, by printing and firing using a gold paste, and has a thickness of about 1 μm. -15- 200538301 (13) As shown in FIG. 12, the resistor 4 has a strip shape along the main scanning direction y. As shown in FIG. 13, it is arranged above the figure on the raised portion 20 of the glaze layer 2. As shown in FIGS. 12 and 14, the resistor 4 overlaps the strip-shaped portion 31 of the plurality of individual electrodes 3d and the branch portion 37 of the common electrode 3e. In the resistor 4, a portion sandwiched between the strip-shaped portion 31 and the branch portion 37 forms a heat generating portion 40. As shown in FIG. 14, the strip-shaped portion 31 and the branch portion 37 are aligned with the glaze layer 2, whereby the resistor 4 has almost no step in the main scanning direction y, and the shape φ is smooth. In the printing of the thermal print head A2, an arbitrary individual electrode 3d is selected via a wire W by a drive 1C (not shown). Current is applied between the selected individual electrode 3d and the branch portion 37 sandwiching the individual electrode 3d. As a result, the heat generating portion 40 generates heat. This heat is transmitted to the thermal recording medium, and the thermal recording medium is printed. Next, the effect of the thermal print head A2 will be described. According to this embodiment, as shown in FIG. 14, since the resistor 4 φ has a smooth shape in the main scanning direction y, a portion of the protective layer 5 that covers the resistor 4 is also formed in the main scanning direction y. Smooth shape. Accordingly, the portion of the protective layer 5 that covers the resistor 4 is adapted to be in close contact with the thermal recording medium. In particular, even if the thermal recording medium is formed of a harder material such as plastic, the protective layer 5 and the thermal recording medium can still be properly adhered. In this way, the heat from the heat generating portion 40 of the resistor 4 is easily transmitted to the thermal recording medium. Therefore, if the thermal print head A2 is used, sharp printing can be achieved. In particular, when high definition is sought, it is suitable to clearly print small printed dots. -16- 200538301 (14) The current to the heating part 40 is formed by a pair of strip parts 35, 36. Since the area of the band-shaped portions 3 5, 3, 6 that gathers one pair is relatively large, it is suitable to suppress the voltage drop of the band-shaped portions 3, 5, 3, 1 of a pair. Further, the strip-shaped portion 36 can be formed to have a relatively narrow width. If the strip-shaped portion 36 is thin and wide, the resistor 4 can be brought closer to the right end of the substrate 1 in the figure. Therefore, it is advantageous to make the thermal print head A2 into a so-called near-end type, that is, the resistor 4 is arranged near the right end in the figure of the substrate 1. φ In addition, the bonding pad 32 and the strip-shaped portion 35 of the bonding wire w protrude from the glaze layer 2. Therefore, even if the front end of the bonding tool provided with the bonding wire w is larger than the bonding pad 32, for example, the bonding tool can be prevented from undue interference with the glaze layer 2. Therefore, the joining operation of the wires W can be appropriately performed. In addition, the thickness of the bonding pad 32 and the strip-shaped portion 35 is approximately 1.6 μm in total, which is relatively thick. Thereby, the bonding strength of the lead wire W can be improved. Next, an example of a manufacturing method of the thermal print head A2 will be described with reference to Figs. 15 to 23. 15 to 23 are a plan view and a cross-sectional view of a main part showing a series of steps in a method of manufacturing the thermal print head A2 according to this embodiment. First, as shown in FIG. 15, a substrate 1 is prepared, and a glaze layer 2 is formed on the substrate 1. The glaze layer 2 is formed by thick film printing and firing using an amorphous glass paste. Next, as shown in FIG. 16, a thin film 3A of gold is formed. The gold thin film 3A is formed, for example, by printing and firing using a resinate gold paste. At this moment, the thickness of the gold thin film 3A is about 0.6 μm. -17- 200538301 (15) Next, as shown in FIG. 17 and FIG. 18, a thin film 3 B of gold is formed on the thin film 3 A of gold. At this moment, the thickness of the thin film 3 B of gold is 1 μm. In the gold thin film 3 A, the right part in the figure is exposed from the gold thin film 3 Β. The gold thin film 3 B is formed, for example, by printing and firing using a gold paste. Also, unlike the present embodiment, a thin film 3B of gold may be formed by repeating printing and firing using a resinate gold paste several times. Alternatively, the gold thin film 3B may be formed by sputtering using gold.
Φ 在形成金的薄膜3A，3B之後，對金的薄膜3A，3B 施以圖案化，藉此來形成圖19及圖20所示之複數的個別 電極3 d及共通電極3 e。此圖案化是例如藉由溼蝕刻來進 行。 其次，如圖21所示，使複數的個別電極3d及共通電 極3e對釉面層2沈下。此電極沈下步驟是與參照圖7所 述的手法同樣進行。藉此，使帶狀部3 1，枝部3 7及帶狀 部36的圖中上面與釉面層2的表面形成面一致。另一方 # 面，結合焊墊32及帶狀部35是分別使以追加層32b，35b 的厚度量來從釉面層2突出。 電極沈下步驟之後，如圖22所示，形成電阻體膜 4A。對此電阻體膜4A實施圖案化，藉此來形成圖23所 示的電阻體4。而且，以能夠覆蓋電阻體4，帶狀部36， 帶狀部31的一部份，及枝部37的一部份之方式來形成保 護層5。然後，經由在結合焊墊32及帶狀部35結合導線 W之步驟等，取得圖12〜圖14所示的感熱印刷頭A2。 若利用如此的製造方法，則可形成複數的個別電極3 d -18- 200538301 (16) 及共通電極3e中僅結合焊墊32及帶狀部35從釉面層2 只突出所望的高度。藉此，可容易進行導線W的結合作 圖24及圖25是表示本發明之感熱印刷頭的第3實施 形態。本實施形態的感熱印刷頭A3，主要結合焊墊32的 積層構造，及共通電極3e的形狀會與上述第2實施形態 不同。在圖24中，省略保護層5。 φ 如圖25所示，結合焊墊32是形成本體層32a與追加 層32b的一部份會重疊的構成。本體層32a的圖中上面會 與釉面層2的表面形成面一致，及追加層32b會從釉面層 2突出的點是與上述第2實施形態同樣。並且，在共通電 極3e中形成有1個帶狀部36。 藉由如此的構成，同樣可適當結合導線W，可期待提 高導線W與結合焊墊32的接合強度之效果。並且，藉由 本體層32a的縮小化，可削減金的使用量。 φ 其次，參照圖26〜圖29來說明有關感熱印刷頭A3 的製造方法之一例。圖26〜圖29是表示本實施形態之感 熱印刷頭A3的製造方法之一連串的步驟的要部剖面圖。 在本實施形態的製造方法中，事先如參照圖1 6所述 那樣在基板1上形成釉面層2及金的薄膜3A。其次對金 的薄膜3A實施圖案化，藉此形成圖26所示的電極3 Ad 及共通電極3e。 其次，如圖27所示，使電極3Ad及共通電極3e對釉 面層2沈下。藉由使電極3Ad沈下，使電極3Ad的表面 -19- (17) * 200538301 與釉面層2的表面形成面一致之後，如圖2 8所示，形成 金的薄膜3 B。金的薄膜3 B的形成是例如藉由使用金糊料 的印刷燒成來進行。此刻，金的薄膜3 B的厚度爲形成 】μιη程度。並且，事先使金的薄膜3B的圖中右端重疊於 本體層32a。對此金的薄膜3Β實施圖案化，藉此來形成 圖29所示的追加層32b。藉此，個別電極3d會被形成。 然後，經由與上述第2實施形態同樣的步驟，取得感熱印 φ 刷頭A3。 若利用如此的製造方法，則在將追加層32b形成於本 體層32a及釉面層2上之後，不進行電極沈下步驟。因 此，可使結合焊墊32僅以金的薄膜3B或追加層3 2b的厚 度量來確實地從釉面層2突出。所以，可適切地進行打線 結合作業。 以上，爲說明有關本發明的具體實施形態，但本發明 並非限於此，只要不脫離本發明的技術思想範圍，亦可實 • 施各種的變更。 例如，在第1實施形態中，雖是使電極3 a〜3 c的表 面與釉面層2的表面大略形成面一致爲止，令電極3a〜3c 沈下於釉面層2，但並非限於此。例如，僅靠近電極3 a〜 3c的底部的一部份會埋入釉面層2内，其他的部份會突出 於釉面層2上。同樣的，在如此的構成中，電極3a〜3c 的表面與釉面層2的表面之階差會變小，與以往技術相較 之下，可取得良好的效果。 又，第1實施形態中，雖是使電極3 a〜3 c的全體沈 -20- 200538301 (18) 下於釉面層2，但並非限於此。電極3 a〜3 c的各部中，只 要至少電阻體4所重疊而形成的部份沈下即可。 使電極3a〜3c形成沈下於釉面層2的狀態之方法， 並非限於本實施形態的方法，例如亦可爲使釉面層的電極 形成部位對應於電極的厚度來削成凹狀，而於此削去的凹 狀部份，藉由厚膜印刷等來形成電極之方法。 在第2實施形態的製造方法中，雖是使金的薄膜 φ 3A，3B積層，但例如亦可使金的薄膜3A形成1·6μιη程度 的厚度，對此薄膜3Α實施複數次的蝕刻，藉此來形成結 合焊墊32的厚度比其他部份更厚的個別電極3d。又，亦 可藉由同樣的手法來形成共通電極3e。 【圖式簡單說明】 圖1是表示本發明之感熱印刷頭的第1實施形態的要 部平面圖。 圖2是表示沿著圖1的II-II線的要部剖面圖。 圖3是表示在圖1及圖2所示之感熱印刷頭的製造方 法之一例中，形成釉面層的步驟之要部平面圖。 圖4是表示沿著圖3的IV-IV線的要部剖面圖。 圖5是表示在圖1及圖2所示之感熱印刷頭的製造方 法之一例中，形成電極的步驟之要部平面圖。 圖6是表示沿著圖5的VI-VI線的要部剖面圖。 圖7是表示圖1及圖2所示之感熱印刷頭的製造方法 之一例的電極沈下步驟的要部剖面圖。 -21 - 200538301 (19) 圖8是表示在圖1及圖2所示之感熱印刷頭的製造方法之 一例中，形成電阻體材料的膜的步驟之要部平面圖。 圖9是表示沿著圖8的IX-IX線的要部剖面圖。 圖10是表示在圖1及圖2所示之感熱印刷頭的製造 方法之一例中，形成電阻體的步驟之要部平面圖。 圖1 1是表示沿著圖10的XI-XI線的要部剖面圖。 圖1 2是表示本發明之感熱印刷頭的第2實施形態的 φ 要部平面圖。 圖13是表示沿著圖12的XIII-XIII線的要部剖面 圖14是表示沿著圖12的XIV-XIV線的要部剖面圖。 圖15是表示在圖12〜圖14所示之感熱印刷頭的製造 方法之一例中，形成釉面層的步驟之要部剖面圖。 圖16是表示在圖12〜圖14所示之感熱印刷頭的製造 方法之一例中，形成金的薄膜的步驟之要部剖面圖。 鲁 圖17是表示在圖12〜圖14所示之感熱印刷頭的製造 方法之一例中，形成金的薄膜的步驟之要部平面圖。 圖1 8是表示沿著圖1 7的XVIII-XVIII線的要部剖面 圖。 圖19是表示在圖12〜圖14所示之感熱印刷頭的製造 方法之一例中，形成電極的步驟之要部平面圖。 圖20是表示沿著圖19的XX-XX線的要部剖面圖。 圖21是表示圖12〜圖14所示之感熱印刷頭的製造方 法之一例的電極沈下步驟的要部剖面圖。 -22- 200538301 (20) 圖22是表示在圖12〜圖14所示之感熱印刷頭的製造 方法之一例中，形成電阻體材料的薄膜的步驟之要部剖面 圖。 圖23是表示在圖12〜圖14所示之感熱印刷頭的製造 方法之一例中，形成電阻體及保護層的步驟之要部剖面 圖。 圖24是表示本發明之感熱印刷頭的第3實施形態的 φ 要部平面圖。 圖25是表示沿著圖24的XXV-XXV線的要部剖面 圖。 圖26是表示在圖24及圖25所示之感熱印刷頭的製 造方法之一例中，形成電極的步驟之要部剖面圖。 圖27是表示圖24及圖25所示之感熱印刷頭的製造 方法之一例的電極沈下步驟的要部剖面圖。 圖28是表示在圖24及圖25所示之感熱印刷頭的製 φ 造方法之一例中，形成金的薄膜的步驟之要部剖面圖。 圖29是表示在圖24及圖25所示之感熱印刷頭的製 造方法之一例中，形成電極的步驟之要部剖面圖。 圖3 0是表示以往的感熱印刷頭之一例的要部剖面 圖。 圖3 1是表示以往的感熱印刷頭的其他例的要部剖面 圖0 【主要元件符號說明】 -23- 200538301 (21) XI，X2 :感熱印刷頭 90 :絶縁基板 91 :釉面層 92 :電阻體 93a.93b:電極 94 :保護層Φ After forming the gold thin films 3A, 3B, the gold thin films 3A, 3B are patterned to form a plurality of individual electrodes 3d and common electrodes 3e as shown in Figs. 19 and 20. This patterning is performed, for example, by wet etching. Next, as shown in Fig. 21, a plurality of individual electrodes 3d and a common electrode 3e are caused to sink to the glaze layer 2. This electrode sinking step is performed in the same manner as described with reference to Fig. 7. Thereby, the upper surface in the figure of the strip-shaped portion 31, the branch portion 37, and the strip-shaped portion 36 is made to coincide with the surface forming surface of the glaze layer 2. On the other side, the bonding pad 32 and the strip-shaped portion 35 are protruded from the glaze layer 2 by the thickness of the additional layers 32b and 35b, respectively. After the electrode sinking step, as shown in FIG. 22, a resistor body film 4A is formed. This resistor body film 4A is patterned to form the resistor body 4 shown in Fig. 23. Further, the protective layer 5 is formed so as to cover the resistor 4, the strip-shaped portion 36, a portion of the strip-shaped portion 31, and a portion of the branch portion 37. Then, the thermal print head A2 shown in Figs. 12 to 14 is obtained through a step or the like of connecting the lead W to the bonding pad 32 and the strip-shaped portion 35. By using such a manufacturing method, a plurality of individual electrodes 3 d -18-200538301 (16) and the common electrode 3e can be formed by bonding only the pads 32 and the strip-shaped portions 35 to the desired height from the glaze layer 2. This makes it easy to bond the wires W. Figs. 24 and 25 show a third embodiment of the thermal print head of the present invention. The thermal print head A3 of this embodiment is different from the second embodiment described above mainly in combination with the laminated structure of the bonding pad 32 and the shape of the common electrode 3e. In FIG. 24, the protective layer 5 is omitted. φ As shown in Fig. 25, the bonding pad 32 has a structure in which a part of the body layer 32a and the additional layer 32b are overlapped. The upper surface of the body layer 32a in the figure corresponds to the surface forming surface of the glazed layer 2, and the point where the additional layer 32b protrudes from the glazed layer 2 is the same as the second embodiment described above. A single strip-shaped portion 36 is formed in the common electrode 3e. With this configuration, the lead wire W can be appropriately bonded in the same manner, and the effect of increasing the bonding strength between the lead wire W and the bonding pad 32 can be expected. In addition, by reducing the size of the body layer 32a, the amount of gold used can be reduced. φ Next, an example of a method for manufacturing the thermal print head A3 will be described with reference to FIGS. 26 to 29. 26 to 29 are cross-sectional views of main parts showing a series of steps in a method of manufacturing the thermal print head A3 according to the present embodiment. In the manufacturing method of this embodiment, the glaze layer 2 and a thin film 3A of gold are formed on the substrate 1 in advance as described with reference to Fig. 16. Next, the gold thin film 3A is patterned, thereby forming the electrode 3 Ad and the common electrode 3 e shown in FIG. 26. Next, as shown in FIG. 27, the electrode 3Ad and the common electrode 3e are caused to sink to the glaze layer 2. After the electrode 3Ad is sunk, the surface of the electrode 3Ad is made -19- (17) * 200538301 to coincide with the surface forming surface of the glaze layer 2, and as shown in Fig. 28, a thin film 3B of gold is formed. The gold thin film 3 B is formed, for example, by printing and firing using a gold paste. At this moment, the thickness of the thin film 3 B of gold is about 1 μm. Then, the right end of the gold thin film 3B in the figure is overlapped with the body layer 32a in advance. This gold thin film 3B is patterned to form an additional layer 32b shown in Fig. 29. Thereby, an individual electrode 3d is formed. Then, the thermal print φ brush head A3 is obtained through the same procedure as in the second embodiment. According to such a manufacturing method, after the additional layer 32b is formed on the body layer 32a and the glaze layer 2, the electrode sinking step is not performed. Therefore, the bonding pad 32 can be reliably projected from the glaze layer 2 only by the thickness of the gold thin film 3B or the additional layer 3 2b. Therefore, the wire bonding operation can be performed appropriately. The foregoing is a description of specific embodiments of the present invention, but the present invention is not limited thereto, and various changes can be made without departing from the scope of the technical idea of the present invention. For example, in the first embodiment, the electrodes 3a to 3c are sunk in the glaze layer 2 until the surfaces of the electrodes 3a to 3c substantially coincide with the surface of the glaze layer 2. The electrodes 3a to 3c are not limited to this. For example, only a part near the bottom of the electrodes 3a to 3c will be buried in the glaze layer 2, and the other part will protrude on the glaze layer 2. Similarly, in such a configuration, the step difference between the surfaces of the electrodes 3a to 3c and the surface of the glaze layer 2 becomes smaller, and a good effect can be obtained compared with the conventional technology. In addition, in the first embodiment, the whole of the electrodes 3 a to 3 c is lowered -20- 200538301 (18) under the glaze layer 2, but it is not limited to this. Of the portions of the electrodes 3a to 3c, it is only necessary that at least the portion formed by the overlapping of the resistor 4 is sunk. The method of forming the electrodes 3a to 3c in a state of being sunk in the glaze layer 2 is not limited to the method of this embodiment. For example, the electrode formation site of the glaze layer may be cut into a concave shape corresponding to the thickness of the electrode, and This cut out concave portion is a method for forming an electrode by thick film printing or the like. In the manufacturing method of the second embodiment, although the gold thin film φ 3A, 3B is laminated, for example, the gold thin film 3A can be formed to a thickness of about 1.6 μm, and this thin film 3A is etched a plurality of times. As a result, the individual electrodes 3d having the thickness of the bonding pads 32 thicker than those of other portions are formed. The common electrode 3e can also be formed by the same method. [Brief Description of the Drawings] Fig. 1 is a plan view of a principal part showing a first embodiment of a thermal print head according to the present invention. FIG. 2 is a sectional view of a main part taken along a line II-II in FIG. 1. Fig. 3 is a plan view of a principal part showing a step of forming a glaze layer in an example of a method of manufacturing the thermal print head shown in Figs. 1 and 2; FIG. 4 is a cross-sectional view of a main part taken along a line IV-IV in FIG. 3. Fig. 5 is a plan view of a principal part showing a step of forming an electrode in an example of a method of manufacturing the thermal print head shown in Figs. 1 and 2; FIG. 6 is a cross-sectional view of a main part taken along a line VI-VI in FIG. 5. Fig. 7 is a sectional view of a principal part showing an electrode sinking step as an example of a method of manufacturing the thermal print head shown in Figs. 1 and 2. -21-200538301 (19) Fig. 8 is a plan view of a principal part showing a step of forming a film of a resistor material in an example of a method of manufacturing the thermal print head shown in Figs. 1 and 2. Fig. 9 is a cross-sectional view of a main part taken along a line IX-IX in Fig. 8. Fig. 10 is a plan view of a principal part showing a step of forming a resistor in an example of a method of manufacturing the thermal print head shown in Figs. 1 and 2; FIG. 11 is a sectional view of a main part taken along a line XI-XI in FIG. 10. Fig. 12 is a plan view of a main part φ showing a second embodiment of the thermal printhead of the present invention. Fig. 13 is a cross-sectional view of a main part taken along a line XIII-XIII in Fig. 12 Fig. 14 is a cross-sectional view of a main part taken along a line XIV-XIV in Fig. 12. Fig. 15 is a cross-sectional view of a principal part showing a step of forming a glaze layer in an example of a method of manufacturing the thermal print head shown in Figs. 12 to 14. Fig. 16 is a sectional view of a principal part showing a step of forming a thin film of gold in an example of a method of manufacturing the thermal print head shown in Figs. 12 to 14. Fig. 17 is a plan view of a principal part showing a step of forming a thin film of gold in an example of a method of manufacturing the thermal print head shown in Figs. 12 to 14. FIG. 18 is a cross-sectional view of a main part taken along the line XVIII-XVIII in FIG. 17. Fig. 19 is a plan view of a principal part showing a step of forming an electrode in an example of a method of manufacturing the thermal print head shown in Figs. 12 to 14; FIG. 20 is a sectional view of a main part taken along a line XX-XX in FIG. 19. Fig. 21 is a sectional view of a principal part showing an electrode sinking step as an example of a method of manufacturing the thermal print head shown in Figs. 12 to 14; -22- 200538301 (20) Fig. 22 is a cross-sectional view of a principal part showing a step of forming a thin film of a resistor material in an example of a method of manufacturing a thermal print head shown in Figs. 12 to 14. Fig. 23 is a cross-sectional view of a principal part showing a step of forming a resistor and a protective layer in an example of a method of manufacturing the thermal print head shown in Figs. 12 to 14. Fig. 24 is a plan view of a main portion of φ showing a third embodiment of the thermal printhead of the present invention. Fig. 25 is a cross-sectional view of a main part taken along a line XXV-XXV in Fig. 24. Fig. 26 is a sectional view of a principal part showing a step of forming an electrode in an example of a method of manufacturing the thermal print head shown in Figs. 24 and 25; Fig. 27 is a sectional view of a principal part showing an electrode sinking step as an example of a method of manufacturing the thermal print head shown in Figs. 24 and 25; Fig. 28 is a cross-sectional view of a principal part showing a step of forming a thin film of gold in an example of a method for manufacturing a thermal print head shown in Figs. 24 and 25; Fig. 29 is a sectional view of a principal part showing a step of forming an electrode in an example of a method of manufacturing the thermal print head shown in Figs. 24 and 25; Fig. 30 is a sectional view of a main part showing an example of a conventional thermal print head. FIG. 31 is a cross-sectional view of main parts showing another example of a conventional thermal print head. [Description of main component symbols] -23- 200538301 (21) XI, X2: Thermal print head 90: Substrate 91: Glazed layer 92: Resistor 93a.93b: electrode 94: protective layer
Al，A2 :感熱印刷頭Al, A2: Thermal print head
1 :基板 2 :釉面層 3a〜3c :電極 3 d :個別電極 3e :共通電極 3A，3B:金的薄膜 4 :電阻體 5 :保護層 20 :隆起部 3 1 :帶狀部 3 2 :結合焊墊 32a :本體層 3 2 b :追加層 3 5.3 6 :帶狀部 3 7 :枝部 40 :發熱部 -24-1: substrate 2: glaze layer 3a to 3c: electrode 3 d: individual electrode 3e: common electrode 3A, 3B: thin film of gold 4: resistor 5: protective layer 20: raised portion 3 1: band portion 3 2: Bonding pad 32a: body layer 3 2 b: additional layer 3 5.3 6: band portion 37: branch portion 40: heating portion -24-