200537761 九、發明說明： 【發明所屬之技術領域】 本發明係關於將卡片用連接器裝置安裝於電路基板時所 使用之變形防止構件，及使用該變形防止構件之卡片用連 接器裝置之安裝方法。 【先前技術】 現有的卡片用連接器裝置的一例，已知的構造為具備形 成有使則端面及上下端面開放的卡片收容用凹部的合成樹 脂製框架、及設在該框架左右前端部及後端部的多個端子 組，在上述凹部的沿前後方向的相對面上設置將卡的兩側 部向插入拔出方向引導的引導槽（例如，參照專利文獻”。 如此構成的卡片用連接器裝置，將各端子利用回流焊接 連接在電路基板的焊盤上，藉此被安裝在電路基板的被安 裝面上，並以該狀態被裝入攜帶型電話機和數位相機等電 子。又備中而使用。使用日夺’操作者將卡插人卡片用連接器 裝置，則該卡其兩側部由框架的引導槽引導而向後端部推 在卡的引鸲。卩到達框架最後端時，卡的端子接觸部與 排列配置在框架後端部的端子組接觸，而能與外部進行電 信號的接收及發送。 專利文獻1:特開20〇1-1則5號公報（第3_6頁，圖υ 發明所欲解決之問題 上述現有的卡片用連接器裝置，由於其形成在框架上的 卡片收容用凹部為上下壁不被覆蓋而呈開放的構成，因 此具有抑制棍架厚度的增加而謀求薄型化的優點。但是， 98569.doc 200537761 框木因具有卡片收容用凹 1 π — 成為别知部形成缺口的俯視 匚子形的外觀，因此，伴隨差 現着卡片的薄型化而使框架的 子度變4 ’則難以提高隔差 ㈣看凹部的框架左右兩側部的强 度。結果，利用回流焊接將卡 肝卞片用連接器裝置安裝在電路 基板上時，可能會發生由 、口机爐的熱而使框架左右兩側 =向上下方向發生扭曲而變形，而有在安裝後使用時，不 此將卡者框㈣引導槽滑順地進行引導的問題。特別是200537761 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a deformation preventing member used when a card connector device is mounted on a circuit board, and a method for installing a card connector device using the same. . [Prior Art] An example of a conventional card connector device has a known structure including a synthetic resin frame formed with card accommodation recesses for opening an end surface and an upper and lower end surface, and left and right front and rear end portions of the frame. A plurality of terminal groups at the ends are provided with guide grooves for guiding both sides of the card in the insertion / removal direction on opposite sides of the recessed portion in the front-rear direction (for example, refer to Patent Documents). The card connector thus configured The device connects each terminal to a pad of a circuit board by reflow soldering, thereby being mounted on a surface to be mounted on the circuit board, and in this state is incorporated into electronics such as a portable telephone and a digital camera. It is also used in preparation. When the card is inserted into the card connector device by the operator, the two sides of the card are guided by the guide grooves of the frame and pushed to the rear end of the card. When the card reaches the end of the frame, the card's terminals The contact portion is in contact with a terminal group arranged at the rear end portion of the frame, and can receive and transmit electrical signals with the outside. Patent Document 1: Japanese Unexamined Patent Publication No. 20-01, No. 5 (Page 3_6, Figure υ Problem to be solved by the invention The above-mentioned conventional card connector device has a structure in which the card receiving recess formed on the frame is open without the upper and lower walls being covered, and therefore has a stick holder. The thickness has been increased to achieve the advantage of thinness. However, 98569.doc 200537761 frame wood has a recess 1 π for card storage, which is a top-down zigzag-shaped appearance with a gap formed in the unknown part. Therefore, the thinness of the card is accompanied by the thinness. If the frame size is changed to 4 ', it will be difficult to increase the strength of the left and right sides of the frame by looking at the recess. As a result, it may occur when the connector device for cardan sepals is mounted on a circuit board by reflow soldering. Due to the heat of the furnace, the left and right sides of the frame are twisted and deformed in the up and down direction, and there is a problem that the card holder frame guide groove should not be smoothly guided when it is used after installation. Especially
在由於回流爐的熱而使框架發生較大變形時，隨之設置在 框架左右前端部的端子會從電路基板上浮起，因此，存在 有會發生卡片用連接器裝置的端子與電路基板的焊盤之間 的焊接不良的問題。 【發明内容】 本發明即是蓉於此種現有技術的實情而產生的，其目的 在於提供在安裝卡片用連接器裝置時能防止框架變形的變 形防止構件及使用其之卡片用連接器裝置的安裝方法。 爲了實現上述目#，本發明的變形防止構件，立係可拆 裝地設在卡片用連接器裝置中，該卡片料接器裝置具備 框架’該框架形成有至少開放前端面的卡片收容部，在上 述卡片收容部的沿前後方向的相對面上設有於插入或拔出 方向引導卡片兩側部的引導部，其中：在安裝時，藉由上 述變形防止構件的兩端部與上述引導部卡合，而將其架設 在上述引導部之間。 ^如此構成的變形防止構件中，該變形防止構件是架在隔 著卡片收容部的框架間而被安裝，藉此，能提高隔著卡片 98569.doc 200537761 收容部的框架左右兩側部的強度。因此，將該卡片用連接 器裝置利用回流焊接安裝在電路基板上時，能防止由於回 流爐的熱而造成的框架左右兩側部的變形。 上述構成中，較佳為··上述引導部具有正交的2個面，在 上述變形防止構件的兩端部形成有可以與該2個面卡合的 限制面，則能更加確實地防止框架的左右兩側部的扭曲變 形0When the frame is greatly deformed due to the heat of the reflow furnace, the terminals provided on the left and right front ends of the frame will float from the circuit board. Therefore, soldering of the terminals of the card connector device and the circuit board may occur. The problem of poor welding between the discs. [Summary of the Invention] The present invention is based on the facts of such a prior art, and an object thereof is to provide a deformation preventing member capable of preventing a frame from being deformed when a card connector device is installed, and a card connector device using the same. installation method. In order to achieve the above-mentioned objective, the deformation preventing member of the present invention is detachably provided in a card connector device. The card connector device includes a frame. The frame is formed with a card receiving portion having at least an open front end surface. A guide portion for guiding both sides of the card in the insertion or extraction direction is provided on the opposite surface of the card receiving portion in the front-rear direction, wherein, at the time of installation, both ends of the deformation preventing member and the guide portion are used. It engages and bridges it between the said guide parts. ^ In the deformation prevention member thus configured, the deformation prevention member is mounted between the frames across the card accommodation portion, thereby increasing the strength of the left and right sides of the frame across the card 98569.doc 200537761 . Therefore, when the card connector device is mounted on a circuit board by reflow soldering, deformation of the left and right sides of the frame due to the heat of the reflow furnace can be prevented. In the above configuration, it is preferable that the guide portion has two orthogonal surfaces, and restricting surfaces that can be engaged with the two surfaces are formed at both end portions of the deformation preventing member, so that the frame can be prevented more reliably. Distortion of the left and right sides of the 0
另外上述構成中，較佳為：在上述引導部間的安裝完 成後，形成有從上述卡片收容部突出的突出部，如此，作 業者將變形防止構件與卡片用連接器裝置進行拆裝時，可 經由突出部簡單地安裝在框架上或簡單地從框架中去除。 另外、，較佳為：上述卡片收容部的上面的至少一部分被開 放，並且上述框架上設有覆蓋上述卡片收容部上面的蓋， 向上述引導部間安裝時，藉由上述突出部由該蓋的前端部 所卡住’而限制上述變形防止構件向上述卡片收容部内後 端側移動。藉此’將變形防止構件安裝在框架上時，只要 -後方推人㈣防止構件就能限制其過度（超過蓋）地推 入因此’能簡單地進行變形防止構件的定位，同時，去 除變形防止構件日年+ 苒仵寻也使在框架上安裝的位置爲一定，因In addition, in the above configuration, it is preferable that, after the mounting between the guide portions is completed, a protruding portion protruding from the card receiving portion is formed. In this way, when the operator detaches the deformation preventing member from the card connector device, It can be simply mounted on or removed from the frame via the protrusion. In addition, it is preferable that at least a part of the upper surface of the card storage portion is opened, and a cover covering the upper surface of the card storage portion is provided on the frame, and when the space is mounted between the guide portions, the cover is used by the cover through the projection portion. The front end portion of the card is blocked, and the deformation preventing member is restricted from moving toward the inner rear end side of the card storage portion. Thereby, when the deformation preventing member is mounted on the frame, the pushing member can be prevented from being pushed in excessively (over the cover) by simply pushing the person backward. Therefore, the positioning of the deformation preventing member can be easily performed and the deformation preventing member can be removed. The component day and year + search also make the installation position on the frame constant, because
此’月&間車地去除變开< P 云除π防止構件，且能進一步提高作業性。 另外，上述構成中，較 接絝Μ “ 早乂1 至為·在上述框架上直接或經由 々籌件間接地設置外部連 連接用^子，如此，能確實地防 、子的知接不良的發生。 另外’根據本發明的+ Η田、垂 。 ㈣卡片用連接器裝置之安裝方法，係 98569.doc 200537761 將卡片用連接器裝置安裝在電路基板上的安裝方法， 片用連接器裝置具備框架，該框架形成有至少開Μ心 的卡片收容部，在上述卡片收容部的沿前後方向的相對面 上設有於插入或拔出方向引導卡片兩側部的引導部；上述 卡片用連接器裝置之安裝方法包括：在上述卡片用連接琴 裝置上安裝如上述的變形防止構件的工序；在安裝了該變 形防止構件的狀態下，將上述卡片用連接器裝置的端子焊 接在上述電路基板的被安裝面上的工序；及將上述卡 連接器裝置谭接在上述被安裝面上後，將上述變形防止構 件從上述卡片用連接器裝置中去除的工序。 如此構成的卡片用連接器裝置的安裝方法中，藉由將變 形防止構件安裝在卡片用連接器裝置上，藉此能提高隔著 卡片收容部的框架左右兩側部的強度，因此，在將該卡片 用連接器裝置利用回流焊接安裝在電路基板上時，能抑制 由於回流爐的熱而造成的框架左右兩侧部的變形。並且， 如此將卡片用連接器裝置安裝在電路基板上之冑，若從卡 片用連接器裝置中去除變形防止構件，則能在該卡片 接器裝置中插入卡片。 發明之效果 本發明的變形防止構件，架在隔著卡片收容部的框架間 來安裝變形防止構件，藉此能提高框架左右兩侧部的強 度，因此，將卡片用連接器裝置用回流焊接安裝在電路基 板上時’能防止由於回流爐的熱而造成的框架左右兩 的變形。 98569.doc 200537761 另外’本發明的卡片用連接器裝置的安裝方法，藉由將 上述變形防止構件安裝在卡片用連接器裝置上，藉此能提 鬲隔著卡片收容部的框架左右兩側部的強度，因此，在將 該卡片用連接器裝置用回流焊接安裝在電路基板上時，能 防止由於回流爐的熱而造成的框架左右兩側部的變形。並 且，如此將卡片用連接器裝置安裝在電路基板上之後，若 從卡片用連接器裝置中去除變形防止構件，則能在該卡片 用連接器裝置中插入卡片。 【實施方式】 以下，參照圖式，對發明的實施方式進行說明，圖〗係本 發明的實施方式的卡片用連接器裝置和變形防止構件的斜 視圖，圖2係該變形防止構件的俯視圖，圖3係該變形防止 構件的主視圖，圖4係該卡片用連接器裝置所具備的框架的 俯視圖，圖5係圖4的沿V-V線的剖視圖，圖6係圖4的沿VI-VI 線的剖視圖，圖7係表示變形防止構件的安裝中途狀態的卡 片用連接器裝置的俯視圖，圖8係表示變形防止構件的安裝 狀態的卡片用連接器裝置的主視圖，圖9係表示變形防止構 件的安裝狀態的卡片用連接器裝置的左視圖。 如圖1所示，本實施方式的變形防止構件由合成樹脂製的 樑狀構件1構成，該樑狀構件1相對於卡片用連接器裝置可 以拆裝。如圖2和圖3所示，樑狀構件丨俯視呈以左右方向爲 長邊的矩形外觀，在該樑狀構件丨的上面中央部的前端側 (俯視爲下側），突出設置向長邊方向延伸的凸狀把手部la。 另外，在樑狀構件1的兩端部，設置階梯差面、形成比中央 98569.doc 200537761 邛厚度薄的插入部lb、lb。另一方面，卡片用連接器裝置， =備合成樹脂製的框架2和設置在該框架2上的金屬板製的 蓋3並且，由這些框架2和蓋3構成殼體4。 如圖4和圖5所v，在框架2上形成有使前端面及上下兩面 開放的凹部2a，才匡架2的外觀呈左右一對側部^、^隔著凹 p 2a而相對的俯視”〔"字$。在該框架顶端部的左右側部 b 2b的相對面上形成沿前後方向的一對引導槽a。、2c，This " monthly & intermittent removal < P > cloud removal of π prevents members and further improves workability. In addition, in the above configuration, it is better to connect to the MEMS as early as possible. The external connection connection is provided directly or indirectly on the above-mentioned frame. In this way, it is possible to prevent the connection failure. Occurrence. In addition, according to the present invention's + Putian, vertical. 安装 The method of mounting the card connector device is 98569.doc 200537761 The method of mounting the card connector device on a circuit board, the chip connector device is provided with A frame formed with a card receiving portion at least at the center of the card, and a guide portion for guiding both sides of the card in the insertion or extraction direction is provided on the opposite surface of the card receiving portion in the front-rear direction; the card connector The device mounting method includes the steps of mounting the deformation preventing member as described above on the card connector piano device, and soldering the terminals of the card connector device to the circuit board in a state where the deformation preventing member is mounted. The step of mounting the surface; and after connecting the card connector device to the mounting surface, removing the deformation preventing member from the card The process of removing the connector device. In the method of mounting the card connector device thus constituted, the deformation preventing member is mounted on the card connector device, so that the left and right sides of the frame across the card accommodation portion can be improved. The strength of the side portion can prevent deformation of the left and right sides of the frame due to the heat of the reflow oven when the card connector device is mounted on a circuit board by reflow soldering. In addition, the card is connected in this manner. The device is mounted on a circuit board, and if the deformation preventing member is removed from the card connector device, a card can be inserted into the card connector device. ADVANTAGE OF THE INVENTION The deformation preventing member of the present invention is placed between the cards. Deformation preventing members are installed between the frames of the accommodating part, thereby increasing the strength of the left and right sides of the frame. Therefore, when the card connector device is reflow-mounted on the circuit board, it can prevent heat from being generated by the reflow furnace. Deformation of the left and right of the frame. 98569.doc 200537761 In addition, the method of installing the card connector device of the present invention, By attaching the deformation preventing member to the card connector device, the strength of the left and right sides of the frame across the card receiving portion can be improved. Therefore, the card connector device is mounted on the circuit by reflow soldering. When the substrate is on the substrate, it is possible to prevent deformation of the left and right sides of the frame due to the heat of the reflow furnace. After the card connector device is mounted on the circuit board in this manner, the deformation preventing member is removed from the card connector device. Then, a card can be inserted into the card connector device. [Embodiment] Hereinafter, embodiments of the invention will be described with reference to the drawings, which are card connector devices and deformation preventing members according to the embodiments of the present invention. 2 is a plan view of the deformation preventing member, FIG. 3 is a front view of the deformation preventing member, FIG. 4 is a plan view of a frame provided in the card connector device, and FIG. 5 is a line VV of FIG. 4 6 is a cross-sectional view taken along the line VI-VI of FIG. 4, and FIG. 7 is a view of a card connector device showing a state in the middle of the installation of the deformation preventing member. View, FIG. 8 shows a modification of the card system to prevent a mounted state of the member with a front view of the connector device, a left side view of FIG. 9 based deformation preventing member in a mounted state of the card connector device. As shown in Fig. 1, the deformation preventing member of the present embodiment is composed of a beam-shaped member 1 made of synthetic resin, and the beam-shaped member 1 is detachable from the card connector device. As shown in FIG. 2 and FIG. 3, the beam-shaped member 丨 has a rectangular appearance with a long side in the left-right direction when viewed from the top. The convex handle portion la extending in the direction. In addition, stepped surfaces are provided at both end portions of the beam-like member 1 to form insertion portions 1 b and 1 b which are thinner than the center 98569.doc 200537761 邛. On the other hand, the card connector device includes a frame 2 made of synthetic resin and a cover 3 made of a metal plate provided on the frame 2 and the frame 2 and the cover 3 constitute a case 4. As shown in FIG. 4 and FIG. 5, a recess 2 a is formed on the frame 2 to open the front end surface and the upper and lower surfaces. The outer appearance of the Kuang frame 2 is a pair of left and right side portions ^, ^ facing each other across the recess p 2a. "[&Quot; $. A pair of guide grooves a in the front-rear direction is formed on the opposite sides of the left and right side portions b 2b of the top end portion of the frame. 2c,
在框架2的凹部2a内排列配置多個第㈣子構件5。如圖㈣ 不，這些第1端子構件5，具有被固定在框架2後端部的固定 從4固定部5a上端呈直角彎折且向凹部以内突出的 賴端子5b、和㈣定部5aT端部呈折形成的焊接 而子 另外，在框架2的左右側部的前端部配置一對第2 ‘子構件6，這些第2端子構件6具有被固定在框架2左右側 部m的前端部的外壁部、同時從下端部呈L字形f折形 成的知接端子6a。 盍具有大致覆蓋框架2上部的頂板部3a，在頂板部⑽ 前端部形成缺口部3b。該蓋3與框架2的左右側部2卜_ 外壁部藉由鉚合而呈一體化，由這些框架2和蓋3構成殼體 4 〇 如此構成的卡片料接器裝置，經由後述工序被安裳在 電路基板上後，與該電路基板—起被裝人攜帶型電 數Γ機料子設備中制。在使科，操作者將具有資 訊存儲功能的卡（未圖示）插人卡片用連接器裝置中，將該卡 的兩側部沿著—對引導槽2c、2c向凹部_推入， 98569.doc 200537761 的前端部到達框架2内的規定位置時，卡片之未圖示的端子 接觸部與排列配置在框架2後端部的第1端子部5的連接端 子5b接觸，因此，能與外部進行電信號的接收發送。另外， 在如此將卡插入卡片用連接器裝置中的狀態下，作業者拔 出從蓋3的缺口部3b内露出的卡的後端部，藉此，卡從設置 在殼體4前端部的卡插入口 4a排出。A plurality of first sub-members 5 are arranged in the recess 2 a of the frame 2. As shown in Fig. ㈣, these first terminal members 5 are fixed to the rear end portion of the frame 2 and fixed at the rear end portion of the fixing portion 5a. The terminal portion 5b is bent at a right angle and protrudes into the recessed portion, and the end portion of the fixing portion 5aT. In addition, a pair of second sub-members 6 are disposed at the front end portions of the left and right side portions of the frame 2, and these second terminal members 6 have outer walls fixed to the front end portions of the left and right side portions m of the frame 2. The known connection terminal 6a is formed by folding in an L-shape f from the lower end portion.盍 has a top plate portion 3a substantially covering the upper portion of the frame 2, and a notch portion 3b is formed at the front end portion of the top plate portion ⑽. The cover 3 is integrated with the left and right side portions 2 of the frame 2. The outer wall portion is integrated by riveting. The frame 2 and the cover 3 constitute a housing 4. The card connector device configured as described above is installed through a process described later. After the skirt is on the circuit substrate, it is made together with the circuit substrate. In the application department, the operator inserts a card (not shown) with an information storage function into the card connector device, and pushes both sides of the card along the pair of guide grooves 2c and 2c toward the recess _, 98569 .doc 200537761 When the front end portion of the frame 2 reaches a predetermined position in the frame 2, the terminal contact portion (not shown) of the card contacts the connection terminal 5b of the first terminal portion 5 arranged at the rear end portion of the frame 2. Receive and transmit electrical signals. In addition, in a state where the card is inserted into the card connector device as described above, the operator pulls out the rear end portion of the card exposed from the notch portion 3b of the cover 3, whereby the card is removed from the front end portion provided in the case 4. The card insertion port 4a is ejected.
以下，參照圖7-圖9對將卡片用連接器裝置安裝在電路基 板上的工序進行說明。 首先，作爲將卡片用連接器裝置安裝在電路基板上的前 工序，如圖7所示，將作爲變形防止構件的樑狀構件丨向箭 頭方向插入而安裝在卡片用連接器裝置上。即，將樑狀構 件1的插入部lb、lb插入框架2的一對引導槽2c、以中，藉 此，該樑狀構件1架在框架2的左右側部2b、2b的前端部間 而2安裝。此時，樑狀構件丨的把手部13與蓋3的缺口部补 的前端面抵接，藉此，可限制樑狀構件丨過量插入，因此， 樑狀構件1被定位在如圖7的單點劃線所示的規定位置。 如此將樑狀構件1安裝在框架2的左右側部2b、2b的前端 部間之後’如圖8和@ 9所示’將卡片用連接器裝置搭載在 電路基板7的規定位置。圖示省略，不過，在該電路基板7 的被安裝Φ上形成有與第i及第2端子構件5、6的各谭接端 子5c、6a相對應的多個焊盤，各桿接端子6以爲與塗 布在這些焊盤上的糊狀焊料接觸的狀態。在該狀態下將電 ^基板7送人未圖示的回流爐中，利用該回流爐的熱使糊狀 知料熔化’藉此各焊接料5e、6a被焊接在電路基板7的相 98569.doc 200537761 應的焊盤上，因此卡片用連接器裝置利用回流谭接被安裝 在電路基板7上。在該回流焊接時，樑狀構件【被安裝在框 架2的左右侧部2b、2b的前端部間，在俯視字形的框芊 2的左右側部2b、2b間構成樑構造，因此，應對框苹之左^ 側部2b、2b的扭曲的強度顯著提高。其結果是，能抑制由 於回流爐的熱而造成的框架2的變形、特別是左右側部2b、 2b在上下方向的扭曲變形，因此’能將各焊接端子5。、^ 確實地焊接在電路基板7的對應的焊盤上’能防止卡片用連 接器裝置的焊接不良的發生。並且，如此將卡片用連接零 裝置湘喊焊接安裝在電路基板7上之後，若從卡片用連 接器裝置_去除樑狀構件卜則成爲能在該卡片用連接器裝 置中插入卡片的狀態。 如以上說明，本實施方式中，藉由將由襟狀構件i構成的 變形防止構件安裝在卡片用連接器裝置上，藉此能提高隔 著卡片收容用凹部2a的框架2左右側部孔、^的強度，因 _ 此，在將該卡片用連接器裝置利用回流谭接安裝在=路基 板上夺此抑制由於回流爐的熱而造成的框架2左右兩側 邛2b 2b的變形’能確實地防止卡片用連接器聚置的焊接 不良的土生。另外，在該樑狀構件丨的上面設置凸狀把手部 U ’因此，作業者可以從卡片用連接器裝置上方經由把手 部1a將樑狀構件1安裝在框架2上或從框架2上去除’提高將 樑狀構件1與卡片用連接器裝置進行拆裝的作業性。再有， =用連接器裝置具備覆蓋框架2上部的蓋3，把手部⑷皮 該蓋3的前端面卡住，因而樑狀構件1向後方的移動被限 98569.doc 12 200537761 制’因此，將樑狀構件！安裝在框架2上時，能將襟狀構… 簡單地定位在規定位置’同時從框架2上去除樑狀構们時 也能簡單地去除樑狀構件丨而提高作業性。 【圖式簡單說明】 圖1係本發明的實施方式的卡U連接器裝置和變形防 止構件的斜視圖。 圖2係該變形防止構件的俯視圖。 圖3係該變形防止構件的主視圖。 圖4係該卡片用連接5| |署 安為裒置所具備的框架的俯視圖。 圖5係圖4的沿V_V線的剖視圖。 圖ό係圖4的沿VI_VI線的剖視圖。 圖7係表示變形防止；^ 籌件的安震中途狀態的卡片用連接 裔裝置的俯視圖。 圖8係表示變形防止構侔 — 件的文裝狀態的卡片用連接器裝 置的主視圖。 圖9係表示變形防止構 ^ ^ ^ 傅件的安裝狀態的卡片用連接器裝 置的左視圖。 【主要元件符號說明】 1 樑狀構件 1 a 把手部（突出部） lb 插入部 2 框架 2a 凹部（卡片收容部） 2b 側部 98569.doc 200537761Hereinafter, a process of mounting the card connector device on a circuit board will be described with reference to FIGS. 7 to 9. First, as a pre-process of mounting the card connector device on a circuit board, as shown in FIG. 7, a beam-shaped member as a deformation preventing member is inserted in the direction of the arrow and mounted on the card connector device. That is, the insertion portions lb and lb of the beam-like member 1 are inserted into the pair of guide grooves 2c and 2c of the frame 2, whereby the beam-like member 1 is bridged between the front end portions of the left and right side portions 2b and 2b of the frame 2. 2 Install. At this time, the handle portion 13 of the beam-shaped member 丨 comes into contact with the front end surface of the cut-out portion of the cover 3, thereby restricting excessive insertion of the beam-shaped member 丨. Therefore, the beam-shaped member 1 is positioned as shown in FIG. A predetermined position shown by a chain line. After mounting the beam-like member 1 between the front end portions of the left and right side portions 2b, 2b of the frame 2 in this manner, the card connector device is mounted at a predetermined position on the circuit board 7 as shown in FIGS. 8 and 9. Although the illustration is omitted, a plurality of pads corresponding to the respective tan terminals 5c and 6a of the i-th and second terminal members 5 and 6 are formed on the mounted Φ of the circuit board 7, and each of the rod terminals 6 It is assumed that they are in contact with the paste-like solder applied on these pads. In this state, the electric ^ substrate 7 is sent to a reflow furnace (not shown), and the paste material is melted by using the heat of the reflow furnace, whereby each solder 5e, 6a is soldered to the phase 98569 of the circuit substrate 7. doc 200537761 should be mounted on the circuit board 7 using the reflow connector. During this reflow soldering, the beam-like member [is installed between the front end portions of the left and right side portions 2b, 2b of the frame 2, and constitutes a beam structure between the left and right side portions 2b, 2b of the frame 芊 2 in a plan view. The intensity of the distortion of the left side 2b, 2b of Pingzhi was significantly increased. As a result, it is possible to suppress deformation of the frame 2 due to heat of the reflow furnace, in particular, torsional deformation of the left and right side portions 2b, 2b in the vertical direction, so that each solder terminal 5 can be used. It is possible to prevent the soldering failure of the card connector device from being reliably soldered to the corresponding pads of the circuit board 7 '. In addition, after the card connection zero device is mounted on the circuit board 7 in this manner, if the beam-like member is removed from the card connector device, the card can be inserted into the card connector device. As described above, in this embodiment, by mounting the deformation preventing member composed of the lapel-shaped member i on the card connector device, the holes 2 on the left and right sides of the frame 2 through the card receiving recess 2a can be increased. Therefore, the card connector device is installed on the circuit board using a reflow adapter, so that the deformation of the left and right sides 2b and 2b of the frame 2 due to the heat of the reflow furnace can be reliably suppressed. Prevents poor soldering of card connectors. In addition, since a convex handle portion U is provided on the upper surface of the beam-shaped member 丨, the operator can attach or remove the beam-shaped member 1 to the frame 2 through the handle portion 1a from above the card connector device. The workability of attaching and detaching the beam-like member 1 and the card connector device is improved. In addition, the connector device is provided with a cover 3 covering the upper part of the frame 2 and the front end surface of the cover 3 is caught by the handle portion. Therefore, the rearward movement of the beam-shaped member 1 is limited to 98569.doc 12 200537761. Beam-like members! When mounted on the frame 2, the placket structure can be easily positioned at a predetermined position 'and the beam-shaped members can be easily removed when the frame 2 is removed from the frame 2 to improve workability. [Brief description of the drawings] Fig. 1 is a perspective view of a card U connector device and a deformation preventing member according to an embodiment of the present invention. FIG. 2 is a plan view of the deformation preventing member. Fig. 3 is a front view of the deformation preventing member. Fig. 4 is a plan view of a frame provided by the card connection 5 | | FIG. 5 is a cross-sectional view taken along line V_V of FIG. 4. Figure 6 is a sectional view taken along line VI_VI of Figure 4. Fig. 7 is a plan view showing a card connection device in a state where the chip is in a state of being shaken in the middle of the shock. Fig. 8 is a front view of the card connector device showing the state of the deformation prevention structure. Fig. 9 is a left side view of the card connector device showing the mounting state of the deformation preventing structure ^ ^ ^. [Description of main component symbols] 1 Beam-like member 1 a Handle (protrusion) lb Insertion 2 Frame 2a Recess (card storage) 2b Side 98569.doc 200537761
2c 3 3a 3b 4 5 5c 6 6a 7 引導槽（引導部） 蓋 頂板部 缺口部 殼體 第1端子構件 焊接端子 第2端子構件 焊接端子 電路基板2c 3 3a 3b 4 5 5c 6 6a 7 Guide groove (guide portion) Cover Top plate portion Notch portion Housing First terminal member Solder terminal Second terminal member Solder terminal Circuit board
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