200537456 九、發明說明： 【發明所屬^技術4員域】 發明領域 本發明係有關-圖案轉移裝置及一使用該圖案轉移裝 5置之圖案轉移方法。更詳言之，本發明有關用於轉移一細 微凸凹圖案之-圖案轉移裝置及1案轉移方法。 C先前技術】 發明背景 在一藉由雷射光或類似物來記錄及再生資訊的光碟之 10製程中，採用一壓印方法。壓印方法係利用一轉移模子來 形成-諸如凹坑及引導溝槽等凸凹圖案。更詳言之，首先， 製造轉移模子。轉移模子係包括分別與包括在光碟中的一 樹脂複製物的-表面上所形成之凸凹圖案的凸部及凹部呈 現對應之凹部及凸部。然後，轉移模子係壓入玻璃或樹脂 15上所施加之-層經軟化樹脂内以具有一均句厚度，藉以將 轉移模子上的凸凹圖案轉移至經軟化樹脂層。樹脂層硬化 之後，樹脂複製物自轉移模子移除。然後，進行藉由喷賤 將-記錄膜、-反射膜及類似物形成於樹脂複製物上之程 序。利用此方式來獲得光碟。 2〇 ㈣—f訊記錄媒體的記錄密度增加，樹脂複製物的 凸凹圖案已經以更高的密度形成更加細微。在此例中，相 較於習知資訊記錄媒體的麼抵力，用於將轉移模子壓入一 受圖案轉移的物件内之程序係需要—較大的壓抵力。因 此，需要帶領物件及轉移模子彼此接近及將轉移模子麼入 5 200537456 物件内，同時更嚴袼地保持其平行性。 日本紐公開專利案Ng2GG21_38號係揭露一可移 式治具。可移式治具可在一使轉移模子及物件彼此接近之 方向中移動，同時保持其平行性。更詳言之，轉移模子及 物件(基材)係固定至治具的固持部件，同時利用-CCD攝影 Γ調整其^性。然後，轉移模子及物件與治具一起移 至液壓衝壓口，在其中將一負荷施加至轉移模子。因 =具限制住轉移模子與物件之間的相對平行關係，轉移 子2接近物件而不改變其平行性。利用此方式，轉移模 子係壓入物件内。 、 C發明内容】 發明概要 15 本發明的-圖案轉移襄置係為—用 二圖案轉移至與轉移模子相對之—物件的一表的 固Hi。圖案轉移裝置係包含：―基底構件，其用於 上方形成有物件之基材；一固持構件 使固持構件接近物件之方向中 圖=— =之方式__子心^ 之移動構構件的方向中來移動固持構件 間的-2’ 其用於測量轉移模子與物件之 卿划^量簡的㈣；及控 據剛量得的距離來控制移動構件之一移動量。〃用於根 本發明的另一圖案轉移裝置係為 1移模子的一凸凹图查从± 肝被固持在 凹圖案的-表面中之物件轉移至_ 200537456 移模子相對的基材之圖案轉移裝置。圖案轉移 含：-基底構件，其用於固定住基材；—固持構件，二 夠=持構件接近基材之方向中移動，以固持住轉: 杈子使其與基材呈現相對；移動部件，其包括—用 使固持構件接近基底構件的方向中來移動固持構件之： 構件測量總成’其用於測量轉移模子與基材之門的— 距離並輸出量測得的距離；及控制部件，其用於根據 得的距離來控制移動構件之一移動量。 、里 10 15 本發明的一圖案轉移方法係為一用於將一轉移模 一凸凹圖案轉移至與轉移模子相對之-物件的-表面之圖 案轉移方法。圖案轉移方法係包含以下步驟：將一上方〒 成有物件之基材固定至-基底構件；以使凸凹圖㈣物件 呈現相對之方式來將轉移模子固定至一固持構件；測量轉 ^莫子與物件之間的一距離並輸出測量得的距離，·根據測 置得的距離來決定-與固持構件接觸之移動構件的一移動 量；及使移動構件移動該移動量以帶領轉移模子接近物件。 本《月的# ®案轉移方法係為—用於將—轉移模子 的一凸凹圖案轉移至與轉移模子相對之一物件的一表面之 圖案轉移方法。圖案轉移方法係包含以下步驟：將一上方 形成有物件之基材固定至—基底構件；以使凸凹圖案與物 件呈現相對之方式來將轉移模子固定至一固持構件；測量 轉移模子與物件之間的—距離並輸出測量得的距離；根據 測量得的距離來決定-與固持構件接觸之移動構件的一移 動里’及使和動構件移動該移動量以帶領轉移模子接近物 20 200537456 件。 圖式簡單說明 第1圖顯示根據本發明的一實施例之一圖案轉移裝置； 第2圖顯示根據本發明的實施例之圖案轉移裝置的俯 5 視圖， 第3圖顯示根據本發明的實施例之圖案轉移裝置的一 主部分； 第4圖顯示根據本發明的實施例之圖案轉移裝置的一 主部分； 10 第5圖顯示本發明的實施例之一修改之一圖案轉移裝 置的一主部分； 第6圖為根據本發明的實施例之另一修改之一圖案轉 移裝置的一主部分之俯視圖； 第7圖顯示根據本發明的實施例之另一修改之一圖案 15 轉移裝置的一主部分； 第8圖顯示根據本發明的實施例之另一修改之一圖案 轉移裝置的一主部分； 第9圖顯示根據本發明的實施例之另一修改之一圖案 轉移裝置的一主部分； 20 第10A至10C圖顯示根據本發明的實施例之另一修改 之一圖案轉移裝置的一主部分。 I：實施方式3 較佳實施例之詳細說明 現在參照圖式來描述根據本發明的一實施例之一圖案 8 200537456 轉移裝置。 如第1及2圖所示，—轉移模子固 .彼此相對且近似平行的方式排列為二 ，5子示)係切_烟轉件…轉移模 離美广槿i ^可在一其中使轉移模子固持構件11移近或移 構:二接I3之方向A中往上或往下移動。複數個負荷施加 模子固持構件11的-上表面並轉移一 !。成一 加構件15的一端點Μ形成為具有-用以形 成一球體的-部分之凸形圓滑性，如第 固持構件u的上表面上係形成有凹部u，。各凹部= ;用以形成—球體的—部分之凹形圓滑性且其曲率係等於 或大於負荷施加構件15的端點⑸之 較佳係等一的曲率。因此，負荷施加構= 5 15a係接觸到轉移模子固持構件1]66立 … 荷—Μ滑動，且負 Λ舰 料構件11上旋轉。令負荷施 ^ 端點以之物於轉移模子固持構件η的凹 ^之曲率的理由係在於增加負荷施加構件奴轉移模 有效率地轉移至轉移模子固错持^Γ施加構件15的-負荷 :a有用以形成—球體—部分的圓滑性之凹部 成於負荷施加構件Μ的-端點上，而具有用以 形成-球體-部分的圓滑性之凹部200537456 IX. Description of the invention: [The invention belongs to the 4th member of the technology] Field of the invention The present invention relates to a pattern transfer device and a pattern transfer method using the pattern transfer device. More specifically, the present invention relates to a pattern transfer device and a method for transferring a fine convex-concave pattern. C Prior Art] Background of the Invention In an optical disc recording and reproduction process using laser light or the like, an imprint method is used. The embossing method uses a transfer mold to form embossed patterns such as pits and guide grooves. In more detail, first, a transfer mold is manufactured. The transfer mold includes a concave portion and a convex portion respectively corresponding to the convex portion and the concave portion of the convex-concave pattern formed on the surface of a resin replica included in the optical disc. Then, the transfer mold is pressed into the softened resin applied to the glass or resin 15 to have a uniform thickness so as to transfer the convexo concave pattern on the transfer mold to the softened resin layer. After the resin layer is hardened, the resin replica is removed from the transfer mold. Then, a procedure for forming a -recording film, a -reflective film, and the like on the resin replica by spraying is performed. Use this method to obtain a disc. The recording density of the 20 ㈣-f recording media has increased, and the convexo-concave patterns of the resin replicas have become finer at higher densities. In this example, the procedure for pressing the transfer mold into an object to be transferred by a pattern requires a larger pressure force than the resistance force of a conventional information recording medium. Therefore, it is necessary to bring the object and the transfer mold close to each other and insert the transfer mold into the 5 200537456 object, while maintaining its parallelism more strictly. Japanese New Zealand Patent Publication No. Ng2GG21_38 discloses a movable jig. The movable jig can be moved in a direction to bring the transfer mold and the object closer to each other while maintaining its parallelism. In more detail, the transfer mold and the object (base material) are fixed to the holding part of the jig, and at the same time, the CCD is adjusted with -CCD photography. Then, the transfer mold and the object are moved with the jig to the hydraulic punching port, in which a load is applied to the transfer mold. Because the relative parallel relationship between the transfer mold and the object is restricted, the transfer element 2 approaches the object without changing its parallelism. In this way, the transfer mold is pressed into the object. SUMMARY OF THE INVENTION 15 Summary of the Invention-The pattern transfer system of the present invention is-using two patterns to transfer to the opposite of the transfer mold-a fixed surface of the object. The pattern transfer device includes:-a base member, which is used for the base material on which the object is formed; a holding member to bring the holding member closer to the object. Figure =-= way __ 子 心 ^ in the direction of the moving structural member. -2 'to move between the holding members, which is used to measure the amount of movement between the transfer mold and the object; and to control the amount of movement of one of the moving members according to the distance measured. 〃Used for roots Another pattern transfer device of the present invention is a convex-concave map of a transfer mold, which is used to transfer the objects from the surface of the liver that is held in the concave pattern to the pattern transfer device of 200537456. The pattern transfer includes:-a base member, which is used to fix the substrate;-a holding member, two = the holding member moves in the direction close to the substrate to hold the rotation: a branch makes it appear opposite to the substrate; moving parts , Which includes-moving the holding member in a direction in which the holding member approaches the base member: a member measurement assembly 'which is used to measure the distance between the transfer mold and the door of the substrate and outputs the measured distance; and a control part , Which is used to control the amount of movement of one of the moving members according to the obtained distance. A pattern transfer method of the present invention is a pattern transfer method for transferring a transfer mold and a convex-concave pattern to the -object-to-surface opposite to the transfer mold. The pattern transfer method includes the following steps: fixing a substrate with an object formed thereon to a base member; fixing the transfer mold to a holding member in such a way that the convex and concave figures ㈣ objects are opposite; measuring the transfer of Mo Zi and A distance between the objects and the measured distance is output, determined according to the measured distance-a moving amount of the moving member in contact with the holding member; and moving the moving member to move the moving amount to bring the transfer mold closer to the object. This month's # ® case transfer method is a pattern transfer method for transferring a convex-concave pattern of a transfer mold to a surface of an object opposite to the transfer mold. The pattern transfer method includes the following steps: fixing a substrate having an object formed thereon to a base member; fixing the transfer mold to a holding member in such a manner that the convex-concave pattern is opposed to the object; measuring between the transfer mold and the object -Distance and output the measured distance; determined based on the measured distance-a movement of the moving member in contact with the holding member 'and moving the moving member by this amount of movement to lead the transfer mold approach 20 200537456 pieces. Brief Description of the Drawings Figure 1 shows a pattern transfer device according to an embodiment of the present invention; Figure 2 shows a top 5 view of a pattern transfer device according to an embodiment of the present invention, and Figure 3 shows an embodiment according to the present invention FIG. 4 shows a main part of a pattern transfer device according to an embodiment of the present invention; FIG. 5 shows a main part of a pattern transfer device which is a modification of an embodiment of the present invention; 6 is a top view of a main part of a pattern transfer device according to another modification of the embodiment of the present invention; FIG. 7 is a main diagram of a pattern 15 transfer device according to another modification of the embodiment of the present invention FIG. 8 shows a main part of a pattern transfer device according to another modification of an embodiment of the present invention; FIG. 9 shows a main part of a pattern transfer device according to another modification of an embodiment of the present invention; 20 FIGS. 10A to 10C show a main part of a pattern transfer device according to another modification of the embodiment of the present invention. I: Detailed Description of the Preferred Embodiment Mode 3 Now, a pattern 8 200537456 transfer device according to an embodiment of the present invention will be described with reference to the drawings. As shown in Figures 1 and 2, the transfer molds are solid. They are arranged opposite to each other and are approximately parallel. They are arranged in two, shown in Figure 5). The mold holding member 11 moves closer or closer to the structure: it moves up or down in the direction A of the second connection I3. A plurality of load applying molds hold the -upper surface of the member 11 and transfer one !. One end point M of the adding member 15 is formed so as to have a convex smoothness of a portion for forming a sphere, such as a recess u formed on the upper surface of the first holding member u. Each concave portion =; the concave-smoothness used to form the -spherical portion, and its curvature is preferably equal to or greater than the end point 负荷 of the load applying member 15. Therefore, the load application structure = 5 15a is in contact with the transfer mold holding member 1] 66… The load—M slides, and the negative Λ ship member 11 rotates. The reason for making the load applying the end point to the curvature of the concave of the transfer mold holding member η is to increase the load applying member and the transfer mold to efficiently transfer to the transfer mold holding misalignment ^ Γ of the load 15: a The concave portion for forming a -spherical portion is formed on the -end point of the load applying member M, and has a concave portion for forming a -spherical portion
固持構件U的一上，如第物示。在：I 9 200537456 軸承=列在凹部⑸，與11之間。此配置中，負荷施加構 件15係連接至轉賴子固持構件η藉以可在轉移模子固持 構件11上滑動及旋轉，如同上述配置。 、 致 如第3或4圖所示，轉移模子固持構件u及負荷施加構 件15亚未穩固地固定以保持剛性。取而代之，其可由接頭 連接。這是因為提供複數個貞荷施加構件如分配負荷= 參照第1及2圖，各負荷施加構件ls可在方向A中往上及 瞻往下移動。各負荷施加構件15係由一負荷控制器塊 10在方向A中對於其他負荷施加構件15獨立地往上及往下移 動。請注意負荷施加構件15的配置及數量未特別受限，但 第2圖顯示以規則間隔排列在兩條線中之六個負荷施加構 件15 〇 -用於固定’移模子的治具係設置於轉移模子固持 15構件11的-下表面11a上，但未加以顯示。〉、台具可將轉移模 子21固定至轉移模子固持構件_無餘隙。諸如凹坑及引 籲 #溝槽等將被轉移之記錄標記的-凸凹圖案係形成於轉移 模子21的-表面21a上。易言之，轉移模子以的表面叫係 具有藉由轉移一用以形成一所製造的資訊記錄媒體（譬如 20 一光碟）的一部分之樹脂複製物的一表面之一凸凹圖案所 獲得之一形狀。下文中，表面21a的形狀稱為一“經轉移，，形 狀。轉移模子21的凹部及凸部係分別對應於樹脂複製物的 凸部及凹部。因此，轉移模子21的凹部及凸部可分別地配 合樹脂複製物的凸部及凹部。轉移模子21係如下述藉由可 200537456 傳輸一自一雷射光源31發射的雷射束之材料所形成。 基底構件13係包括一用於固定一基材23之治具（未圖 示）°基材23被無餘隙地固^。身為圖案轉移的_物件之融 化（軟化）的樹脂係施加至基材23的一表面23a上而具有一均 5勻的厚度，藉以形成一樹脂層25。 一雷射光源31及-_器33個定輯移模子固持構 件11上方（位於上方附接有負荷施加構件15之轉移模子固 持構件11的-側上)之—贿32。雷射光源31则成為往下 發射-雷射束41a(朝向轉移模子21)。光學_器幻係排列 10為自下方接收-雷射光束41b。轉移模子固持構件^具有一 可讓自雷射光源31發射的雷射束及後述的經反射雷射束 41b及41c通過之通孔17。 當自一中央處理單元51接收一信號時，一光控制器55 係供應一電流至雷射光源31藉以使雷射光源31發射雷射束 15 41a。所發射的雷射束41a係穿過轉移模子固持構件u的通 孔17。然後’所發射的雷射束41a之一部分係自樹脂層辦 一表面反射，而另一部分則自轉移模子21的表面2ib反射。 自轉移模子21的表面21b反射之雷射束仙係再度穿過通孔 Π，且隨後入射在光學偵測器33上。類似地，自樹脂層乃 2〇表面反射之雷射束41c係傳輸通過轉移模子21、穿過通孔 Π、而入射在光學偵測器33上。光學偵測器幻係接收雷射 束41b及41c並將-信號傳送到一偵測信號處理單元57。偵 測信號處理單元57係從該信號來計算轉錢子21的表面 21b與樹脂層25之間的-距離，並將計算出的距離傳送至中 11 200537456 央處理單元51。 接著’參照第1圖來描述根據本發明的第一實施例之一 用於轉移一轉移模子的一凸凹圖案之方法。 經軟化（融化）的樹脂係以一均勻厚度施加至玻璃或樹 5月曰的一基材23上，藉以形成一樹脂層25。因此，樹脂層25 具有一爲平表面。基材23係藉由一固定治具（未圖示）固定至 基底構件13而無餘隙。對於樹脂層25使用的樹脂可為熱固 月曰、光固化性樹脂或類似物。然而，在一將轉移模子 21壓入樹脂層25内之程序期間係需要防止樹脂層25的樹脂 1〇產生硬化。譬如，在一熱固性樹脂之案例中，藉由裝設一 加熱器（未圖示）於基底構件内以使樹脂層25的溫度保持在 一固定溫度。 轉移模子21係以使轉移模子21的凸凹表面21b與基材 呈現相對之方式藉由一固定治具（未圖示）固定至轉移模子 15固持構件11而無餘隙。 然後，轉移模子21的表面21a及樹脂層25的表面係藉由 使其彼此平行之方式利用_CCD攝影機、一水平儀或類似 物（未圖不）精孩、地予以調整。該調整之後，轉移模子Η及基 材23藉由固疋治具（未圖示）再度分別地固定至轉移模子固 20持構件11及基底構件13。該調整中，因為轉移模子21的表 面21a及21b形成為確切地平行，可利用雷射束41&來調整轉 移模子21的表面21a及樹脂層25的表面之平行性。易言之， 可藉由㈣器33自轉移模子21及樹脂層25上之雷射束仙 的入射角及轉移财21的表面21b與樹脂層25的表面之間 12 200537456 的距離所測量之幾何式獲得的雷射束41b&41c的位置，來 進行平行性的調整。 一操作者係在一以上述方式完成轉移模子21的表面 21a及樹脂層25表面之平行性的調整之狀態中將一轉移開 5始信號傳送到中央處理單元51。中央處理單元51將一信號 傳送至光控制器55並使光控制器55將一電流供應至雷射光 源31。因此，雷射光源31發射雷射束41a。偵測器％係接收 自轉移模子21的表面21b所反射之雷射束41b及自樹脂層25 表面所反射《雷射束仙，並將一信號傳送至_信號處理 1〇單元57。偵測#號處理單元57係計算轉移模子21的表面21b 與樹脂層25表面之間的距離並將計算出的距離傳送至中央 處理單元51。 ' 15 20 中央處理單元51隨後將一信號傳送至一負荷控制器53 藉以利用-固定速率來往下移動負荷施加構件15。亦即， 轉移模子21的表面叫及樹脂層25表面理想上係在保持其 平行性之同時彼此靠近。在該運動期間，_信號處理單 切雜續地將自與雷射束仙及仏相對位置有關的信號 所獲付之轉軸子21的表面21b與樹脂層Μ表面之間的距 =專送=央處理單元5卜中央處理單元似定自侧信 k理早兀51所傳$的轉資訊相對於以―固定速率往下 =動之轉移模子固持構件u的理想移動速率是否具有“不 := 如延遲或提早等。在具有任何不-致之案例中， 代表轉移模子21相對於樹脂層财面呈現傾斜。 當制上述“不1”時，提前儲存有-處理圖案之中 13 200537456 央處理單元51係將一用以控制各負荷施加構件15的移動速 率之k號傳送至負荷控制器53藉以補償該“不—致，。負荷 控制器53係回應藉此傳送的信號來調整各負荷施加構件15 之移動速率。中央處理單元51重覆此操作直到自摘測信號 5處理單元57所傳送的距離資訊相對於理想移動速率之不一 致被消除為止。 利用此方式，轉移模子^永遠保持平行於樹脂層Μ表 面。因此，轉移模子21的表面21a係接觸到樹脂層二5表面， 同時與其保持平行。 然後，當轉移模子固持構件^藉由已經提前儲存在中 央處理單7051的壓抵量而進一步往下移動時，轉移模子21 仔止移動。在此狀悲中，樹脂層25產生硬化。在樹脂層Μ 由一熱固性樹脂製成之案例中，樹脂產生冷卻。在一光固 化性樹脂的案例中，樹脂層25受到紫外線或類似物所輻 15照，故使樹脂層25硬化。在上述樹脂硬化程序之後係為一 用於自轉移模子21移除樹脂層25以獲得一樹脂複製物之程 序、及其他程序。因為後續程序係與一記錄媒體的已知製 造方法中相同，此處省略了後續程序的詳細描述。 根據本發明的上述實施例，可能確實地使轉移模子21 20的表面21&與樹脂層25表面保持彼此平行，直到一緊位於轉 移模子21及樹脂層25接觸前之時間為止。因此，轉移模子 21並未相對於樹脂層25傾斜，而是保持平行，同時被壓入 樹脂層25内。因此，即使在轉移一細微凸凹圖案之案例中， 仍可獲得高的轉移精密度。尚且，可盡量減少作用在轉移 200537456 杈子21上的對抗力，藉此降低因其變形所造成之轉移模子 21的劣化。亦可降低基材23的變形。此外，即使在大氣中 進行上述轉移程序之案例中，可能盡量減少空氣受困於轉 移模子21與樹脂層25之間。因此，本實施例的圖案轉移係 5 較為理想。 在上述實施例的一修改中，可使用一自轉移模子U的 表面21 a所反射之雷射束41d，如第5圖所示。在此例中，即 便如果轉移模子21變形而破壞了轉移模子21的表面21&及 21b之間的平行關係，轉移模子21的表面2U及樹脂層乃表 10 面仍可保持確切地平行。 上述實施例的另一修改中，一呈現狹縫形式的通孔17, 係可形成於轉移模子固持構件丨丨中，如第6圖所示。在雷射 光源31及偵測器33沿著通孔17，移動時進行測量。在此例 中’可在排列於一條線中的複數個位置進行測量，且因此 15可在一較寬範圍中補償轉移模子21及樹脂層25表面之平行 性。或者，並不使雷射光源31及偵測器33移動，可提供複 數對的雷射光源31及偵測器33。在此例中，亦可在包括分 別排列有該等對雷射光源31及偵測器33的複數個位置之一 較寬範圍中來補償轉移模子21及樹脂層25表面的平行性。 20 因此，此配置亦較為理想。 上述實施例的其他修改中，可使用自不只兩部分反射 之不只兩束，如第7及8圖所示。在此例中，可能較細微地 調整轉移模子21及樹脂層25表面之平行性。此外，可測量 各構件及類似物的變形。因此，使用不只兩個經反射束係 15 200537456 較為理想。 亦可藉由測量分別自轉移模子21的表面21a及21b所反 射之雷射束41d及41b來測量轉移模子21的變形，如第7圖所 不。亦即，利用雷射束4lc及41d來調整轉移模子21及樹脂 5層25表面之平行性。利用雷射束41b及41d來轉移模子21的 變形。亦可在轉移模子21的表面21a接觸到樹脂層25之後轉 移模子21壓入樹脂層25内的同時來進行此測量。因此，可 能莩握住轉移期間自樹脂層25作用在轉移模子21上的一對 抗力所造成之轉移模子21的變形狀態。因此，轉移模子21 10可以同精岔度來壓入樹脂層25内，同時控制施加至轉移模 子21的一負荷之一平衡直到轉移完成為止。 在樹脂層25由一用以傳輸雷射束41a的材料所形成之 案例中’亦可利用自基材23的表面仏反射之一束來測量基 材23及樹脂層25的變形，如第8圖所示。當轉移模子的表 I5面21a接觸到樹脂層25且進一步壓入樹脂層内時，樹脂層 25的树月曰係w動’造成其表面的高度變化。在此例中，較 佳使用基材23的表面仏而非樹脂層说面來作為參考。易 口之轉移模子21接觸到樹脂層25表面之後，利用雷射束 41d及41e而非雷射束41d及41。來控制施加至轉移模子u的 負荷之平衡藉以保持轉移模子21的表面仏及基材^的表 面23a之平仃性。此方式，轉移模子㈣以高精密度壓 入樹脂層25内。 第9圖所不的另一實施例中，如同前述實施例，雷射光 源31及债測器33係固定至轉移模子固持構件以上方（位於 16 200537456 上方排列有負荷施加構件15之轉移模子固持構件u側上) 之撐條32(未圖示）。固定至一撐條（未圖示）之另一雷射光源 31a及另一偵測器33&係排列在轉移模子21及基材23的各別 側上。因此，即便在轉移模子21由一不會傳輸自雷射光源 5 31所發射的雷射束之材料所形成之案例中，仍可調整轉移 杈子21及樹脂層25表面的平行性。易言之，藉由雷射光源 31及偵測為33來測量轉移模子21的表面21b在高度方向中 之位置，而樹脂層25表面的高度則由雷射光源31&及偵測器 33a加以測量。請注意轉移模子21的表面2U及21b係形成為 10平行。因此，轉移模子21的表面21a及樹脂層25的表面可藉 由進行上述實施例所描述的控制來保持確切地平行。 固定至一撐條（未圖示）之另一雷射光源31b及另一偵測 |§ 33b係可進一步排列在轉移模子2丨及基材23的各別側 上，藉以測量轉移模子21的表面2ia在高度方向中之位置。 15在此例中，雷射光源31b及偵測器33b可相對地繞著轉移模 子21及基材23而旋轉。因此，可對於轉移模子21上的複數 個位置來補償轉移模子21及樹脂層25之平行性。因此，此 配置係較為理想。 尚且’當使用該對雷射光源31a及偵測器33a及該對雷 20射光源31b及偵測器33b時，其可相對地繞著轉移模子21及 基材23而旋轉。因此，可對於轉移模子21的表面21a及樹脂 層25表面之複數個位置來測量平行性。因此，此配置係較 為理想。 上文描述中’說明一其中將轉移模子的表面之凸凹形 17 200537456 狀轉移至軟化的樹脂層之案例。然而’本發明不在此限。 本發明的方法係可使用於一記錄媒體之一製造方法，如第 10A至10C圖所示。第10A至10C圖的方法中，一受轉移物件 103係被固持在可被附接及移除之一轉移模子101的一凸凹 5 圖案之一凹部中。轉移模子101被帶領而接觸一基材105， 故使物件103轉移至基材105。在此例中，根據本發明上述 程序，轉移模子101及基材105係被帶領而彼此接近，同時 連續地測量其間距離且其保持平行。易言之，本發明的方 法係可使用於一令兩扁平板被帶領而接觸同時保持平行之 10 方法中。 此申請案係基於以引用方式併入本文中之日本專利申 請案 No.2004-95314 號。 I：圖式簡單說明3 第1圖顯示根據本發明的一實施例之一圖案轉移裝置； 15 第2圖顯示根據本發明的實施例之圓案轉移裝置的俯 視圖； 第3圖顯示根據本發明的實施例之圖案轉移裝置的— 主部分； 第4圖顯示根據本發明的實施例之圖案轉移裝置的— 20 主部分； 第5圖顯示本發明的實施例之一修改之一圖案轉移穿 置的一主部分， 第6圖為根據本發明的貫施例之另一修改之一圖孝轉 移裝置的一主部分之俯視圖； 18 200537456 第7圖顯示根據本發明的實施例之另一修改之一圖案 轉移裝置的一主部分； 第8圖顯示根據本發明的實施例之另一修改之一圖案 轉移裝置的一主部分； 5 第9圖顯示根據本發明的實施例之另一修改之一圖案 轉移裝置的一主部分； 第10A至10C圖顯示根據本發明的實施例之另一修改 之一圖案轉移裝置的一主部分。 【主要元件符號說明】 11…轉移模子固持構件 23，105…級 11’…轉移模子固持構件11的凹部 23a···基材23的表面 11a· ··轉移模子固持構件11的下表面 25…樹脂層 lib···轉移模子固持構件11的上 31,31a31b…雷射光源 表面 32…撐條 13…基底構件 33,33a33b···债測器 14···轴承 41Mlb,41c,41d，41e …雷射束 15…負荷施加構件 5l···中央處理單元 15a···負荷施加構件15的端點 53…負荷控制器 15a’···凹部 55…光控制器 17…通孔 57···债測信號處理單元 17,…通孔 103…受轉移物件 2U〇l···轉移模子 A…方向 21^2113··囀移模子21的表面 19The top of the holding member U is as shown in the first item. In: I 9 200537456 Bearing = listed in the recess ⑸, and 11. In this configuration, the load applying member 15 is connected to the relay holding member η so that it can slide and rotate on the transfer mold holding member 11 as in the above-mentioned configuration. As shown in FIG. 3 or 4, the transfer mold holding member u and the load applying member 15 are not firmly fixed to maintain rigidity. Instead, it can be connected by a connector. This is because a plurality of chuck load applying members are provided, such as distributed load = referring to Figs. 1 and 2, each load applying member ls can move in the direction A upward and downward. Each load applying member 15 is independently moved upward and downward by a load controller block 10 in the direction A for the other load applying members 15. Please note that the configuration and number of load application members 15 are not particularly limited, but Figure 2 shows six load application members 15 arranged in two lines at regular intervals. 0-Fixture system for fixing the 'moving mold' is set at The transfer mold is held on the lower surface 11a of the member 11 but is not shown. 〉, The table can fix the transfer mold 21 to the transfer mold holding member _ without clearance. The emboss-concave patterns of the recording marks to be transferred such as pits and grooves are formed on the -surface 21a of the transfer mold 21. In other words, the surface of the transfer mold is a shape obtained by transferring a concave-convex pattern on a surface of a resin replica to form a part of a manufactured information recording medium (such as a 20-disc). . Hereinafter, the shape of the surface 21a is referred to as a "transformed, shape. The concave and convex portions of the transfer mold 21 correspond to the convex and concave portions of the resin replica, respectively. Therefore, the concave and convex portions of the transfer mold 21 may be respectively The convex portion and the concave portion of the resin replica are matched to the ground. The transfer mold 21 is formed by a material that can transmit a laser beam emitted from a laser light source 31 as 200537456 as described below. The base member 13 includes a base for fixing a base. The fixture (not shown) of the material 23 ° The base material 23 is fixed without a gap. The melting (softening) resin that is a pattern transfer object is applied to one surface 23a of the base material 23 and has a uniform 5 A uniform thickness to form a resin layer 25. A laser light source 31 and -33 fixed-moving mold holding members 11 (located on the-side of the transferring mold holding members 11 with a load applying member 15 attached above them) )-Bribe 32. The laser light source 31 becomes a downward emission-laser beam 41a (toward the transfer mold 21). The optical device arrangement 10 is received from below-the laser beam 41b. The transfer mold holding member ^ has One that can be emitted from the laser light source 31 The beam and the through-hole 17 through which the reflected laser beams 41b and 41c described later pass. When a signal is received from a central processing unit 51, a light controller 55 supplies a current to the laser light source 31 to make the laser light source 31 emits a laser beam 15 41a. The emitted laser beam 41a passes through the through hole 17 of the transfer mold holding member u. Then, a part of the emitted laser beam 41a is reflected from one surface of the resin layer and the other One part is reflected from the surface 2ib of the self-transferring mold 21. The laser beam fairy reflected from the surface 21b of the self-transferring mold 21 passes through the through hole Π again, and is then incident on the optical detector 33. Similarly, the self-resin layer is 20 The surface reflected laser beam 41c is transmitted through the transfer mold 21, passes through the through hole Π, and is incident on the optical detector 33. The optical detector phantom receives the laser beams 41b and 41c and transmits a-signal To a detection signal processing unit 57. The detection signal processing unit 57 calculates the -distance between the surface 21b of the coin 21 and the resin layer 25 from the signal, and transmits the calculated distance to the center 11 200537456 Processing unit 51. Next, 'refer to FIG. 1 to describe A method for transferring a convex-concave pattern of a transfer mold according to one of the first embodiments of the present invention is described. A softened (melted) resin is applied to a substrate 23 of glass or a tree at a uniform thickness in May Thus, a resin layer 25 is formed. Therefore, the resin layer 25 has a flat surface. The base material 23 is fixed to the base member 13 without a clearance by a fixing jig (not shown). The resin used for the resin layer 25 It may be a thermosetting resin, a photo-curable resin or the like. However, it is necessary to prevent the resin 10 of the resin layer 25 from being hardened during a process of pressing the transfer mold 21 into the resin layer 25. For example, in the case of a thermosetting resin, a heater (not shown) is installed in the base member to keep the temperature of the resin layer 25 at a fixed temperature. The transfer mold 21 is fixed to the transfer mold 15 holding the member 11 without a clearance by a fixing jig (not shown) so that the convex and concave surfaces 21b of the transfer mold 21 and the base material are opposed to each other. Then, the surface 21a of the transfer mold 21 and the surface of the resin layer 25 are adjusted in parallel by using a CCD camera, a spirit level, or the like (not shown). After the adjustment, the transfer mold Η and the base material 23 are fixed again to the transfer mold holding member 11 and the base member 13 by a fixing jig (not shown), respectively. In this adjustment, since the surfaces 21a and 21b of the transfer mold 21 are formed to be exactly parallel, the laser beam 41 & can be used to adjust the parallelism of the surface 21a of the transfer mold 21 and the surface of the resin layer 25. In other words, the geometry can be measured by the angle of incidence of the laser beam fairy on the transfer mold 21 and the resin layer 25 from the mold 33 and the distance between the surface 21b of the transfer layer 21 and the surface of the resin layer 25 of 20052005456. The position of the laser beam 41b & 41c obtained by the equation is used to adjust the parallelism. An operator transmits a transfer start signal to the central processing unit 51 in a state where the parallelism of the surface 21a of the transfer mold 21 and the surface of the resin layer 25 is adjusted in the above-mentioned manner. The central processing unit 51 transmits a signal to the light controller 55 and causes the light controller 55 to supply a current to the laser light source 31. Therefore, the laser light source 31 emits a laser beam 41a. The detector% receives the laser beam 41b reflected from the surface 21b of the transfer mold 21 and the laser beam fairy reflected from the surface of the resin layer 25, and transmits a signal to the signal processing unit 10. The detection #processing unit 57 calculates the distance between the surface 21b of the transfer mold 21 and the surface of the resin layer 25 and transmits the calculated distance to the central processing unit 51. '15 20 The central processing unit 51 then sends a signal to a load controller 53 by which the load applying member 15 is moved down at a fixed rate. That is, the surface of the transfer mold 21 and the surface of the resin layer 25 are ideally close to each other while maintaining their parallelism. During this movement, the _signal processing tangently separates the distance between the surface 21b of the rotating shaft 21 and the surface of the resin layer M obtained from the signals related to the relative positions of the laser beam fairy and the puppet = exclusive delivery = The central processing unit 5 The central processing unit seems to set the transfer information of $ transmitted by the side letter K Lizao 51 with respect to the ideal moving speed of the fixed mold holding member u at ―fixed rate down = moving. Such as delay or early. In the case of any inconsistency, it means that the transfer mold 21 is inclined with respect to the resin surface of the resin layer. When the above "No 1" is made, the -processing pattern is stored in advance 13 200537456 Central processing The unit 51 transmits a k-number for controlling the moving speed of each load applying member 15 to the load controller 53 to compensate for the "no-fit". The load controller 53 adjusts the moving rate of each load applying member 15 in response to the signal transmitted thereby. The central processing unit 51 repeats this operation until the inconsistency of the distance information transmitted from the processing signal 57 by the processing unit 57 with respect to the ideal movement rate is eliminated. In this way, the transfer mold ^ is always kept parallel to the surface of the resin layer M. Therefore, the surface 21a of the transfer mold 21 is in contact with the surface of the resin layer 25, while maintaining parallel to it. Then, when the transfer mold holding member ^ is further moved downward by the pressing amount that has been stored in the central processing sheet 7051 in advance, the transfer mold 21 is stopped. In this state, the resin layer 25 is hardened. In the case where the resin layer M is made of a thermosetting resin, the resin is cooled. In the case of a photocurable resin, the resin layer 25 is irradiated with ultraviolet rays or the like, so that the resin layer 25 is hardened. The above-mentioned resin hardening procedure is a procedure for removing the resin layer 25 from the transfer mold 21 to obtain a resin replica, and other procedures. Since the subsequent procedure is the same as in the known manufacturing method of a recording medium, a detailed description of the subsequent procedure is omitted here. According to the above-mentioned embodiment of the present invention, it is possible to surely keep the surface 21 & of the transfer mold 21 20 and the surface of the resin layer 25 parallel to each other until a time immediately before the transfer mold 21 and the resin layer 25 contact. Therefore, the transfer mold 21 is not inclined with respect to the resin layer 25, but remains parallel while being pressed into the resin layer 25. Therefore, even in the case of transferring a fine convex-concave pattern, a high transfer precision can be obtained. Moreover, the counteracting force acting on the transfer 200537456 branch 21 can be reduced as much as possible, thereby reducing the deterioration of the transfer mold 21 due to its deformation. The deformation of the base material 23 can also be reduced. In addition, even in the case where the above-mentioned transfer procedure is performed in the atmosphere, it is possible to minimize air trapped between the transfer mold 21 and the resin layer 25. Therefore, the pattern transfer system 5 of this embodiment is preferable. In a modification of the above embodiment, a laser beam 41d reflected from the surface 21a of a self-transfer mold U may be used, as shown in FIG. In this example, even if the parallel relationship between the surfaces 21 & and 21b of the transfer mold 21 is destroyed by the deformation of the transfer mold 21, the surface 2U and the resin layer of the transfer mold 21 can be kept exactly parallel. In another modification of the above embodiment, a through hole 17 in the form of a slit can be formed in the transfer mold holding member 丨 丨 as shown in FIG. 6. The measurement is performed when the laser light source 31 and the detector 33 move along the through hole 17. In this example, 'can be measured at a plurality of positions arranged in a line, and therefore 15 can compensate the parallelism of the surfaces of the transfer mold 21 and the resin layer 25 in a wide range. Alternatively, without moving the laser light source 31 and the detector 33, a plurality of pairs of the laser light source 31 and the detector 33 may be provided. In this example, the parallelism of the surfaces of the transfer mold 21 and the resin layer 25 can also be compensated in a wide range including one of a plurality of positions in which the pair of laser light sources 31 and the detector 33 are respectively arranged. 20 Therefore, this configuration is also ideal. In other modifications of the above embodiment, more than two beams reflecting from more than two parts may be used, as shown in FIGS. 7 and 8. In this example, it is possible to finely adjust the parallelism of the surfaces of the transfer mold 21 and the resin layer 25. In addition, the deformation of each member and the like can be measured. Therefore, it is ideal to use more than two reflected beam systems 15 200537456. The deformation of the transfer mold 21 can also be measured by measuring the laser beams 41d and 41b reflected from the surfaces 21a and 21b of the transfer mold 21, respectively, as shown in FIG. That is, the laser beams 4lc and 41d are used to adjust the parallelism of the surfaces of the transfer mold 21 and the resin 5 layer 25. The laser beams 41b and 41d are used to transfer the deformation of the mold 21. This measurement can also be performed while the surface 21a of the transfer mold 21 contacts the resin layer 25 while the transfer mold 21 is pressed into the resin layer 25. Therefore, it is possible to hold the deformed state of the transfer mold 21 caused by a pair of resistances acting on the transfer mold 21 from the resin layer 25 during the transfer. Therefore, the transfer mold 21 to 10 can be pressed into the resin layer 25 with the same degree of precision, while controlling one of a load applied to the transfer mold 21 to be balanced until the transfer is completed. In the case where the resin layer 25 is formed of a material for transmitting the laser beam 41a, 'a beam reflected from the surface of the substrate 23 can also be used to measure the deformation of the substrate 23 and the resin layer 25, as described in Section 8 As shown. When the surface 21a of the surface I5 of the transfer mold contacts the resin layer 25 and is further pressed into the resin layer, the tree-shaped movement of the resin layer 25 causes a change in the surface height. In this example, it is preferable to use the surface of the substrate 23 instead of the resin layer as a reference. After the easy transfer mold 21 contacts the surface of the resin layer 25, the laser beams 41d and 41e are used instead of the laser beams 41d and 41. The balance of the load applied to the transfer mold u is controlled to maintain the flatness of the surface 仏 of the transfer mold 21 and the surface 23a of the substrate ^. In this manner, the transfer mold ㈣ is pressed into the resin layer 25 with high precision. In another embodiment shown in FIG. 9, as in the previous embodiment, the laser light source 31 and the debt detector 33 are fixed above the transfer mold holding member (located above 16 200537456 and the transfer mold holding the transfer mold 15 is held). On the u side) of the member 32 (not shown). Another laser light source 31a and another detector 33 & fixed to a stay (not shown) are arranged on respective sides of the transfer mold 21 and the base material 23. Therefore, even in the case where the transfer mold 21 is formed of a material that does not transmit the laser beam emitted from the laser light source 5 31, the parallelism of the surfaces of the transfer branch 21 and the resin layer 25 can still be adjusted. In other words, the position of the surface 21b of the transfer mold 21 in the height direction is measured by the laser light source 31 and the detection as 33, and the height of the surface of the resin layer 25 is measured by the laser light source 31 & and the detector 33a. measuring. Note that the surfaces 2U and 21b of the transfer mold 21 are formed in parallel. Therefore, the surface 21a of the transfer mold 21 and the surface of the resin layer 25 can be kept exactly parallel by performing the control described in the above embodiment. Another laser light source 31b and another detection fixed to a stay (not shown) | § 33b can be further arranged on each side of the transfer mold 2 丨 and the substrate 23 to measure the The position of the surface 2ia in the height direction. 15 In this example, the laser light source 31b and the detector 33b can be relatively rotated around the transfer mold 21 and the substrate 23. Therefore, the parallelism of the transfer mold 21 and the resin layer 25 can be compensated for the plural positions on the transfer mold 21. Therefore, this configuration is ideal. Furthermore, when the pair of laser light sources 31a and detectors 33a and the pair of laser 20 light sources 31b and detectors 33b are used, they can relatively rotate around the transfer mold 21 and the substrate 23. Therefore, parallelism can be measured for a plurality of positions on the surface 21a of the transfer mold 21 and the surface of the resin layer 25. Therefore, this configuration is ideal. In the above description, 'a case where the convex-concave shape of the surface of the transfer mold 17 200537456 is transferred to the softened resin layer is explained. However, the present invention is not limited to this. The method of the present invention is applicable to a manufacturing method of a recording medium, as shown in Figs. 10A to 10C. In the method of FIGS. 10A to 10C, a transfer-receiving object 103 is held in a concave portion of a convex-concave 5 pattern of a transfer mold 101 that can be attached and removed. The transfer mold 101 is led to contact a substrate 105, so that the object 103 is transferred to the substrate 105. In this example, according to the above-mentioned procedure of the present invention, the transfer mold 101 and the base material 105 are led close to each other, while the distance therebetween is continuously measured and kept parallel. In other words, the method of the present invention can be used in a method in which two flat plates are brought into contact while keeping parallel. This application is based on Japanese Patent Application No. 2004-95314, which is incorporated herein by reference. I: Brief description of the drawings 3 FIG. 1 shows a pattern transfer device according to an embodiment of the present invention; 15 FIG. 2 shows a top view of a circle transfer device according to an embodiment of the present invention; FIG. 3 shows according to the present invention FIG. 4 shows the main part of a pattern transfer device according to an embodiment of the present invention. FIG. 4 shows the main part of a pattern transfer device according to an embodiment of the present invention. FIG. 5 shows a modification of one of the embodiments of the present invention. Fig. 6 is a top view of a main part of a filial transfer device according to another modification of the embodiment of the present invention; 18 200537456 Fig. 7 shows another modification of the embodiment according to the present invention. A main part of a pattern transfer device; FIG. 8 shows a main part of a pattern transfer device according to another modification of an embodiment of the present invention; FIG. 9 shows one of another modification of an embodiment of the present invention. A main part of the pattern transfer device; FIGS. 10A to 10C show a main part of the pattern transfer device according to another modification of the embodiment of the present invention. [Description of main component symbols] 11 ... Transfer mold holding member 23, 105 ... Class 11 '... Recess 23a of transfer mold holding member 11 ... Surface 11a of base material 23 ... Lower surface 25 of transfer mold holding member 11 ... Resin layer lib ... Upper 31, 31a31b of transfer mold holding member 11 ... laser light source surface 32 ... strut 13 ... base member 33, 33a33b ... debt detector 14 ... bearing 41Mlb, 41c, 41d, 41e ... laser beam 15 ... load application member 51 ... central processing unit 15a ... endpoint 53 of load application member 15 ... load controller 15a '... recessed portion 55 ... light controller 17 ... through hole 57 ... Debt measurement signal processing unit 17, ... through-hole 103 ... transfer object 2U0l ... transfer mold A ... direction 21 ^ 2113 ... transfer surface 19 of mold 21