TW200534928A - Coating machine and method of cleaning the same - Google Patents

Coating machine and method of cleaning the same Download PDF

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Publication number
TW200534928A
TW200534928A TW094103894A TW94103894A TW200534928A TW 200534928 A TW200534928 A TW 200534928A TW 094103894 A TW094103894 A TW 094103894A TW 94103894 A TW94103894 A TW 94103894A TW 200534928 A TW200534928 A TW 200534928A
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TW
Taiwan
Prior art keywords
solvent
gas
coating liquid
coating
piping
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Application number
TW094103894A
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Chinese (zh)
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TWI343283B (en
Inventor
Sosuke Akao
Mitsuhiro Onda
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Toppan Printing Co Ltd
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Publication of TWI343283B publication Critical patent/TWI343283B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254Coating heads with slot-shaped outlet
    • B05C5/0258Coating heads with slot-shaped outlet flow controlled, e.g. by a valve
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material

Abstract

The present invention is a kind of coating machine which comprises a die head (3), a coating solution supply pump (20), a coating solution reserving container (19) and coating solution pipes (21) connecting with. There is a cleaning means (101) connected on the said coating solution pipes to deliver gas and solvent alternately and clean said coating solution pipes by means of passing the interface of gas and solvent.

Description

20Ό534928 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種塗覆裝置,尤其是關於可洗淨藉由模 頭(die-head)進行塗覆的模具塗覆器(die-coater)配管(塗覆 液配管)內部的塗覆裝置及塗覆裝置的洗淨方法。 【先前技術】 以往,在使用塗覆裝置的情況,根據用途使用照相凹版 塗覆(gravure coat)、輥子塗覆(gravure coat)、滑式塗覆(slide • coat)、幕式塗覆(curtain coat)、擠壓塗覆(extrusion coat)等 的各種方式。其中,在以高速進行品質高之穩定的塗覆時, 採用擠壓塗覆或幕式塗覆或滑式塗覆等,使用具有狹縫噴嘴 (slit nozzle)的模頭。 作爲具有狹縫噴嘴的模頭,爲達成塗覆量之寬度方向上 的均勻性,狹窄地設定狹縫的開口厚度(間隙:gap),而且, 集合管(manifold)—般爲確保較大容積者。 但是,上述模頭係具有微小開口部與其眼前的大容積液 ^ 體儲積部的構造,因此內部的液體交換性差。除此之外,上 述模頭不易暫時流動多量的液體,而抱有在塗覆液的交換發 生時等需要洗淨之際,洗淨性極差的問題。 因此,在實際進行如上述的模頭洗淨的狀況,花費長時 間使大量的溶劑等通過。或是,爲期待更爲確實的效果,採 取分解模頭進行清掃的對應。因此在任一情況,無論在時間 上還是在作業量上均造成負荷過大。 對於上述問題,在日本國特開平7- 1 3 2267號公報提出 200534928 以短時間且效率良好地洗淨模頭內部的具有狹縫噴嘴的塗 覆頭(head)的洗淨方法。 又,如日本國特開2003- 1 0767號公報所公開’還知道 無招致作業效率降低而可完全除去殘留於模頭之狹縫噴嘴 前端的不斷固形化中的塗覆液的狹縫噴嘴的洗淨方法及洗 淨機構。 另一方面,在爲將塗覆液供給模頭而連接於該模頭的配 管部分中,爲了從模頭的狹縫噴嘴前端均勻且穩定地吐出塗 • 覆液的目的,一般安裝塗覆液用過濾器(filter)及塗覆液供給 泵(恆定流量泵)等。 因此,配管部分也成爲內面形成複雜的形狀,或具有成 爲大容積蓄液構造的部位的結果,其洗淨性極差。這(配管 部分)在實際進行洗淨的狀況中,也花費長時間使多量的溶 劑等通過。或是,爲期待更爲確實的效果,採取在泵等中進 行分解並清掃,在配管中根據情況交換爲新品的對應方法。 因此任一情況對模頭內部的洗淨同樣造成過大的負荷。 ® 對於上述問題,如日本國特開平9 - 8 5 1 5 3號公報所公 開,還知道藉由使用壓縮氣體或或生鐵(pig),可減低洗淨時 的塗料損失(1 〇 s s ),同時,可使用少量的洗淨溶劑短時間且 效率良好地洗淨的模具塗覆器(die_coater)塗料洗淨裝置。 對於模具塗覆方式的塗覆裝置的此種洗淨性的劣點,在 曰本國特開平7- 1 3 2267號公報所記載的技術中,藉由將溶 劑導入模頭內部’同時’從配管的模頭連接部附近吹入惰性 氣體(inert gas),以使溶劑「汽泡流」化,用以有效洗淨模 ► 200534928 頭的集合管內壁及狹縫噴嘴。 但是在該方法中,對於要求精密塗覆更少量的塗覆液的 領域、例如液晶顯示裝置用濾色器(color filter)的製造等中 所使用的狹縫間隙〇 · 1 mm前後的模頭,無法獲得充分的效 果。另外,對於配管部分則無法應用該方法。 因爲根據日本國特開平7- 1 32267號公報之實施例,對 狹縫間隙(slit gap)0.5mm的模頭,邊流動3.01/min的洗淨液 邊吹入1.01/min的氮氣。實際上若無法確保該程度的流量, ® 則無法成爲屬在液體內分散氣泡之亂流的「氣泡流」。這是 因爲通常在以30〜300ml/min程度的吐出量所使用的上述狹 縫間隙0· 1 mm前後的模頭,要獲得此種大流量極爲困難,其 結果洗淨液被分離爲氣液的2層而無法維持所期望的洗淨狀 態的緣故。 另外,在配管部分中,在通過狹窄且長的管內之過程 中,氣泡流失去分散狀態而分離爲2層,因此同樣無法維持 所期望的洗淨狀態。 ^ 在日本國特開2003- 10767號公報中,顯示對於模頭的 狹縫噴嘴前端,從設有仰角而裝設的噴嘴噴射洗淨液,而從 設有伏角而裝設的噴嘴噴射氣體(air)進行洗淨的方法及機 構。但是,這是以噴嘴外側爲對象者,而對於內面之洗淨並 未有設想。 另外,在日本國特開平9 - 8 5 1 5 3號公報,記載有利用將 壓縮氣體直接導入配管內、或是在插入生鐵內後藉由壓縮氣 體使其(壓縮氣體)移動,除去殘留於配管內的塗料,而容易 200534928 持續洗淨的裝置。 又,同公報陳述利用將混合(mix)壓縮氣體與洗淨用溶 劑的氣體混合洗淨劑供給擠壓出塗料後的配管,與僅壓送洗 淨用溶劑的情況比較不會降低洗淨效果,而可以少量的洗淨 用溶劑進行配管洗淨的裝置。 但是,即使具有此等任一裝置,仍無法應用於連接有塗 覆液供給泵等的配管部分及整個模頭,或是即使可應用但卻 無法獲得充分的效果。 ® 這是因爲在將壓縮氣體直接導入配管內的情況,恐有氣 體導入後殘留於配管內的塗料(塗覆液)乾燥而成爲異物的 擔憂。另外,這是因爲在插入生鐵進行移動的情況,恐有損 傷不易讓金屬粉末混入塗膜內的領域等所經常使用的樹脂 配管的擔憂。 在要求精密塗覆更少量的塗覆液的領域中,塗覆液的乾 燥異物的產生,即意味著產生不良塗膜。另外,若配管有損 傷,則將成爲更爲不易掉落塗覆液的原因。又,對於生鐵而 ® 言則具有在泵等的內面形狀複雜的部位或狹縫噴嘴等的狹 小部位產生堵塞的問題。 .另一方面,在供給氣體混合洗淨劑的情況,只要不特別 在裝置上設置控制氣體與溶劑之混合的機構,泵及模頭部的 洗淨也變得不完全。實際上在日本國特開平9-85153號公 報,具有應以容易對泵進行分離、分解清掃的方式而藉由配 管接頭進行連接的記述。 本發明係爲了解決上述塗覆裝置之洗淨中的習知問題 200534928 點而完成者,提供一種具備利用具有複雜的配管路徑的模具 塗覆器’尤其是對要求精密塗覆更少量的塗覆液,在非分解 的狀態下可短時間且良好洗淨內部的洗淨手段的塗覆裝置 及塗覆裝置的洗淨方法。 【發明內容】 申請專利範圍第1項之本發明,提供一種塗覆裝置,係 由模頭、塗覆液供給泵、塗覆液儲藏容器、及連接此等的塗 覆液配管所構成,其特徵爲:在上述塗覆液配管上連接有洗 ^ 淨手段。藉由此種構成,可提供一種從塗覆液配管途中以任 意比率邊保持交錯送出氣體與溶劑的洗淨流體,邊可將該洗 淨流體送出至該塗覆液配管,可以高效果淨化模具塗覆器配 管及模頭內部,用以進行洗淨的塗覆裝置。 申請專利範圍第2項之本發明,係於申請專利範圍第1 項之塗覆裝置,提供一種塗覆裝置,其特徵爲:洗淨手段連 接於具有可連結從塗覆液儲藏容器拆下的塗覆液配管端部 的機構。藉由此種構成,可提供一種將塗覆液配管端部連接 ® 於洗淨手段,而可進行與申請專利範圍第1項相同洗淨的塗 覆裝置。 申請專利範掘第3項之本發明,係於申請專利範圍第1 或2項之塗覆裝置,提供一種塗覆裝置,其特徵爲:洗淨手 段具備溶劑容器、連接於該溶劑容器的溶劑配管、混合用氣 體儲藏容器、連接於該混合用氣體儲藏容器的混合用氣體配 管、連接溶劑配管的終端及混合用氣體的終端的混合用閥、 及從該混合用閥伸長的洗淨流體配管,且具有調整溶劑與混 -9-20Ό534928 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a coating device, and more particularly to a die-coater that can be cleaned and coated by a die-head. Coating device inside the piping (coating liquid piping) and cleaning method of the coating device. [Prior Art] Conventionally, when a coating device is used, a gravure coat, a gravure coat, a slide coat, and a curtain coat are used depending on the application. various methods such as coat), extrusion coating and the like. Among them, when high-quality and stable coating is performed at a high speed, extrusion coating, curtain coating, or slip coating is used, and a die having a slit nozzle is used. As a die with a slit nozzle, in order to achieve uniformity in the width direction of the coating amount, the opening thickness (gap) of the slit is set narrowly, and a manifold is generally used to ensure a large volume. By. However, the above-mentioned die has a structure with a small opening portion and a large-volume liquid storage portion in front of it, and therefore, the liquid exchangeability inside is poor. In addition, the above-mentioned die is not easy to flow a large amount of liquid temporarily, and there is a problem that the cleaning performance is extremely poor when the coating liquid needs to be washed, such as when exchange of the coating liquid occurs. Therefore, in a situation where the die cleaning is actually performed as described above, it takes a long time to pass a large amount of solvent and the like. Or, in order to expect a more reliable effect, a disassembly die is used for cleaning. Therefore, in either case, the load is excessive in terms of time and workload. To solve the above-mentioned problems, Japanese Patent Application Laid-Open No. 7- 1 3 2267 proposes a cleaning method for cleaning a coating head having a slit nozzle inside a die head in a short time and efficiently. Also, as disclosed in Japanese Patent Application Laid-Open No. 2003-1 0767, it is also known that a slit nozzle that can completely remove the coating liquid that is continuously solidified at the tip of the slit nozzle of the die head without causing a decrease in work efficiency. Cleaning method and cleaning mechanism. On the other hand, in the piping portion connected to the die for supplying the coating liquid, the coating liquid is generally installed for the purpose of uniformly and stably discharging the coating and coating liquid from the tip of the slit nozzle of the die. Filters, coating liquid supply pumps (constant flow pumps), etc. Therefore, the piping portion also has a complicated shape on the inner surface, or has a portion having a large-capacity liquid storage structure, resulting in extremely poor detergency. In this case (piping part), it takes a long time to pass a large amount of solvent and the like even when the cleaning is actually performed. Or, in order to expect a more definite effect, a corresponding method of disassembling and cleaning in a pump or the like, and replacing it with a new product in the piping as appropriate. Therefore, in any case, the internal cleaning of the die also causes an excessive load. ® For the above problems, as disclosed in Japanese Patent Application Laid-Open No. 9-8 5 1 5 3, it is also known that the use of compressed gas or pig iron can reduce paint loss (10 ss) during cleaning. At the same time, it is possible to use a small amount of cleaning solvent for a short-time and efficient cleaning of a die coater paint cleaning device. For the disadvantages of such detergency of the coating apparatus of the mold coating method, in the technology described in Japanese Patent Application Laid-Open No. 7- 1 3 2267, the solvent is introduced into the die head from the pipe at the same time. Inert gas is blown near the connecting part of the die head to make the solvent “bubble flow” to effectively clean the mold. ► 200534928 The inner wall of the header tube and the slit nozzle. However, in this method, for areas where precise application of a smaller amount of a coating liquid is required, for example, a slit gap of 0.1 mm before and after the slit gap used in the manufacture of a color filter for a liquid crystal display device is used. , Can not get full results. In addition, this method cannot be applied to the piping section. According to the embodiment of Japanese Patent Application Laid-Open No. 7-1 32267, 1.01 / min of nitrogen is blown into the die having a slit gap of 0.5 mm while flowing a cleaning solution of 3.01 / min. In fact, if a flow rate of this level cannot be ensured, ® cannot be a "bubble flow" which is a turbulent flow in which bubbles are dispersed in a liquid. This is because it is extremely difficult to obtain such a large flow rate of the die head before and after the slit gap of 0.1 mm used at a discharge volume of about 30 to 300 ml / min. As a result, the cleaning liquid is separated into a gas liquid. Because it cannot maintain the desired washing state due to its two layers. In the piping section, the bubble flow loses its dispersed state and separates into two layers during the passage through the narrow and long tube. Therefore, the desired washing state cannot be maintained. ^ Japanese Patent Application Laid-Open No. 2003-10767 shows that, for the tip of the slit nozzle of the die head, the cleaning liquid is sprayed from a nozzle provided with an elevation angle, and the gas is sprayed from a nozzle provided with an angle ( air) Method and mechanism for cleaning. However, this is aimed at the outside of the nozzle, and there is no idea of cleaning the inside. In addition, Japanese Patent Application Laid-Open No. 9-8 5 1 5 3 describes that compressed gas is introduced directly into a pipe, or after being inserted into a pig iron, the compressed gas is moved (compressed gas) to remove the residual Apparatus for piping and easy to clean 200534928. In the same publication, it is stated that the use of a mixed gas of a compressed gas and a cleaning solvent to supply a pipe after the coating material has been squeezed out will not reduce the cleaning effect as compared with the case where only the cleaning solvent is pressure-fed. A device for piping cleaning with a small amount of cleaning solvent. However, even with any of these devices, it cannot be applied to the piping portion and the entire die to which the coating liquid supply pump is connected, or even if it is applicable, sufficient effects cannot be obtained. ® This is because when the compressed gas is directly introduced into the pipe, there is a concern that the paint (coating liquid) remaining in the pipe after the gas is introduced may be dried and become a foreign substance. In addition, this is because there is a concern that when a pig iron is inserted and moved, there is a fear of damage to a resin piping that is often used, such as an area where metal powder is not easily mixed into the coating film. In areas where precise application of a smaller amount of coating liquid is required, the generation of dry foreign matter in the coating liquid means that a poor coating film is generated. In addition, if the piping is damaged, it becomes a cause that makes the coating liquid more difficult to drop. In addition, for pig iron, there is a problem that clogging occurs in a part having a complicated inner shape such as a pump or a narrow part such as a slit nozzle. On the other hand, in the case of supplying a gas-containing cleaning agent, as long as a mechanism for controlling the mixing of the gas and the solvent is not provided in the apparatus, the cleaning of the pump and the die head is not complete. Actually, in Japanese Patent Application Publication No. 9-85153, there is a description that the pump should be connected by a piping joint in a manner that facilitates separation, disassembly and cleaning of the pump. The present invention was made in order to solve the problem of conventional problems in the cleaning of the above-mentioned coating device 200534928, and provides a mold coater provided with a complicated piping path, especially for coatings requiring a smaller amount of precision coating In a non-decomposed state, the coating device and the cleaning method of the coating device that can clean the internal cleaning means in a short time and well. [Summary of the Invention] The present invention in the first scope of the application for a patent provides a coating device, which is composed of a die, a coating liquid supply pump, a coating liquid storage container, and a coating liquid pipe connected to these. It is characterized in that a washing means is connected to the coating liquid pipe. With this configuration, it is possible to provide a cleaning fluid that stably sends gas and solvent in a staggered manner from the coating liquid pipe at an arbitrary ratio, and the cleaning fluid can be sent to the coating liquid pipe while purifying the mold with high efficiency The coating device is used to clean the inside of the applicator piping and the die. The invention according to the second patent application scope is a coating device according to the first patent application scope. A coating device is provided, which is characterized in that the cleaning means is connected to a coating device which can be detached from the coating liquid storage container. Mechanism for coating liquid pipe end. With this configuration, it is possible to provide a coating device that connects the end of the coating liquid pipe to the cleaning means, and can perform the same cleaning as in the first patent application. The invention according to item 3 of the patent application is a coating device of item 1 or 2 of the patent application scope. A coating device is provided, which is characterized in that the cleaning means includes a solvent container and a solvent connected to the solvent container. A piping, a mixing gas storage container, a mixing gas piping connected to the mixing gas storage container, a mixing valve connected to a solvent piping terminal and a mixing gas terminal, and a cleaning fluid pipe extended from the mixing valve , And has adjustment solvent and mixed -9-

V 200534928 合用氣體的流量及混合比率的功能。藉由此種構成,可提供 一種可邊以任意氣液比率保持由混合用閥混合的洗淨流體 邊予以送出,可以高效果淨化模具塗覆器配管及模頭內部的 塗覆裝置。 申請專利範圍第4項之本發明,提供一種申請專利範圍 第3項之塗覆裝置,其特徵爲:在溶劑容器具有溶劑使用量 測定機構,在混合用氣體儲藏容器具有氣體使用量測定機 構,且依據溶劑及混合用氣體的使用量來控制混合用閥的開 • 閉的手段。藉由此種構成,通過根據溶劑、氣體的使用量細 調控制溶劑或氣體或其混合物的上述洗淨流體的導入、非導 入,對模具塗覆器之液體交換性不良而洗淨困難的部位,不 伴有乾燥而由氣體交換塗覆液,接著,可利用使內部液面上 下移動而由氣液界面的通過所產生的氣液分配平衡的方 法。因此可提供一種可以高效果淨化該部位的塗覆裝置。 申請專利範圍第5項之本發明,提供一種申請專利範圍 第3或4項之塗覆裝置,其特徵爲:具有溶劑的流速控制手 ^ 段。藉此,可提供一種將氣體與溶劑保持爲適宜混合狀態用 的可進行洗淨溶劑的動態流速控制的塗覆裝置。又,動態流 速控制係指非以隨意而是以指定比率來控制混合用氣體與 溶劑的比率。另外,在動態流速控制還可含有洗淨狀態的監 視、基於該監視結果以回饋(feedback)於全體控制系統(閥的 調整等)等。 申請專利範圍第6項之本發明,提供一種申請專利範圍 第3或4或5項之塗覆裝置,其特徵爲:具有混合用氣體的 -10- 200534928 流速控制手段。藉此,可提供一種將氣體與溶劑保持爲適宜 的混合狀態用的可進行混合用氣體的動態流速控制的塗覆 裝置。 申請專利範圍第7項之本發明,提供一種申請專利範圍 第1項之塗覆裝置,其特徵爲:洗淨手段具有使用2種以上 的溶劑,從與塗覆液的相溶性高的溶劑順序流向相溶性低的 溶劑的手段。藉由此種構成,可抑制溶劑衝擊(solvent shock) 〇 • 申請專利範圍第8項之本發明,提供一種塗覆裝置之洗 淨方法,係洗淨具備模頭、塗覆液供給泵、塗覆液儲藏容器、 及連接此等的塗覆液配管的塗覆裝置的方法,其藉由對上述 塗覆液配管交錯送出氣體與溶劑,使此等流通於上述塗覆液 配管內,利用氣體與溶劑的界面以洗淨該塗覆液配管。藉由 此種方法,可以高效果淨化模具塗覆器配管及模頭內部。 申請專利範圍第9項之本發明,提供一種申請專利範圍 第8項之塗覆裝置的洗淨方法,其特徵爲:使用2種以上的 ^ 溶劑,從與塗覆液的相溶性高的溶劑順序流向相溶性低的溶 劑。藉由此種構成,可抑制溶劑衝擊。 根據本發明,可提供一種利用具有複雜的配管路徑的模 具塗覆器,尤其是對要求精密塗覆更少量的塗覆液,在非分 解的狀態下可短時間且良好洗淨內部的塗覆裝置及塗覆裝 置的洗淨方法。 【實施方式】 以下,參照第1圖說明本發明之第1實施形態。本實施 -11- 200534928 形態之塗覆裝置100,係具有從塗覆液儲藏容器19通過附屬 裝置(例如’塗覆液供給泵2 0等),從連接於模頭3之配管(塗 覆液配管)2 1的途中,藉由作爲洗淨手段的洗淨裝置(例如, 作爲洗淨流體送出手段的洗淨流體送出裝置)i 〇丨送出交錯 送出氣體與液體而成的洗淨流體,而以高效果洗淨塗覆液配 管2 1內部的功能。 第1圖顯示導入洗淨流體用的配管(洗淨流體供給配 管)11介由閥(導入閥)12而與塗覆液配管21連接的塗覆裝置 ^ 100的一例。又,第1圖中之元件符號23表示塗覆液用過濾 器,元件符號24表示塗覆液導入閥,元件符號25表示洩氣 閥(air· vent valve),元件符號26表示塗覆液承載,元件符號 27表示廢液槽,元件符號11〇表示塗覆單元部(模具塗覆 器)。導入閥12、塗覆液導入閥24及洩氣閥25,係藉由作 爲控制手段的控制部(未圖示)分別控制其開閉。 藉由上述導入閥1 2,模頭3側以與塗覆時相同方向的流 向送出洗淨流體,而塗覆液供給側以與塗覆時相反方向的流 ^ 向送出洗淨流體。又,在洗淨塗覆液供給側的期間,將塗覆 液儲藏容器1 9更換爲作爲廢液回收機構的廢液回收容器(未 圖示)。 又,除此種廢液回收機構外,本發明還可包含其他的機 構。例如,搬送機構及塗覆厚度調整機構等。 另外,上述洗淨流體的導入部位,如第1圖中二點鎖線 所示,也可設於泵20與塗覆液用過濾器23之間’或塗覆液 用過濾器23與塗覆液配管21的端部(插入塗覆液配管21中 -12- 200534928 的塗覆液儲藏容器1 9的端部)等。 又,上述洗淨流體的導入部位不限於塗覆液配管途中, 也可爲端部。該情況,在導入洗淨流體用的配管11預先準 備連接機構,在洗淨時從塗覆液儲藏容器1 9拆下塗覆液配 管2 1而連接於上述連結機構。 以下,參照第2圖說明本發明之第2實施形態。第2圖 顯示從塗覆液配管2 1端部設爲洗淨流體的導入部位的情況 的介由連結機構連接有導入洗淨流體用的配管1 1的塗覆裝 ® 置(模具塗覆器)1〇〇的一例。第2圖中之元件符號22表示作 爲連結機構的易連接接頭(one-touch coupler)。又,其他之 構成與第i實施形態相同,故而重複之說明則於圖中施以相 同的元件符號,並省略重複說明。 如上述第1及第2實施形態的塗覆裝置1 00,洗淨流體 係從塗覆液配管21途中或端部導入,但此時重要的是以保 持最可發揮目的之洗淨效果的値的方式設定洗淨流體的氣 液混合比率及送出流量。若非如此,雖然可略微減少溶劑使 ® 用量’但卻根本無法期待相較僅流動溶劑的方法的洗淨程度 的改善。 又’最適合之氣液混合比率,係依據配管長度、配管直 徑、設置於途中的機器·器具、充塡中的塗覆液及使用洗淨 溶劑的粘度等而不同,但在加壓狀態下,大致的氣體:溶劑 的體積比率,以1 : 2〜3 : 1爲較佳。 另外’最適合之流量也同樣依各種條件而各異,大致以 塗覆時之吐出量的1〜3倍爲較佳,在使用上述狹縫間隙 -13- 200534928 0.1mm前後的模頭時,以30ml/min〜900ml/min的程度爲較 佳。 在此欲重點強調的是’該洗淨流體並非處於微小氣泡分 散於溶劑中的系統。即使將此種狀態的混合溶劑吹入配管1 1 中仍將在通過長管內的過程中分離爲2層,另外,說起將氣 液分散狀態的溶劑流經配管,其洗淨性仍無大的改善。 本發明中,「交錯送出氣體與溶劑,利用通過氣體與溶 劑的界面進行洗淨」,係指以短週期規則性送出氣體與溶劑 ® 的態樣,例如,最好在配管1 1、2 1內成爲分別通過各約3ml 〜20ml的氣體與溶劑的狀況。藉此,利用氣體與溶劑的界 面通過配管11、21內壁時產生的氣液分配平衡,從配管21 的壁面使塗覆液溶出於液相而予以淨化。 作爲實際之塗覆裝置的洗淨手段,只要具備以短週期送 出氣體與溶劑的方式,以使氣液混合比率及送出流量保持爲 最佳値的機構即可。例如,可考慮氣體與溶劑的送出壓力保 持爲一定比率的情況、及收緊氣體·溶劑的流路斷面積用以 ^ 限制各送出量的情況等,但不限於此等。 但是,根據欲洗淨之塗覆液配管之構成或在洗淨時點的 所殘留的塗覆液、及使用之洗淨溶劑的粘度等,最適宜氣體 與溶劑送出量或混合比率各異,因此可任意設定此等而較爲 便利。 對應於如上之情況,塗覆裝置100係具有調整溶劑與混 合用氣體流量及混合比率的功能的構成。 以下,參照第3圖說明本發明之第3實施形態。第3圖 -14- 200534928 爲顯示包含具有調整溶劑與混合用氣體流量及混合比率的 功能的洗淨手段1 0 1的塗覆裝置1 00的一例的槪要圖。本實 施形態中,洗淨手段1 0 1具有洗淨機溶劑供給部1及洗淨機 混合用氣體供給部2。 洗淨手段1 0 1具備收容溶劑的溶劑容器4 ;連接於該溶 劑容器4的溶劑配管5 ;收容混合用氣體的混合用氣體儲藏 容器14,·連接於該混合用氣體儲藏容器14的混合用氣體配 管1 5 ;連接溶劑配管5的終端與混合用氣體配管1 5的終端 ® 的混合用閥1 〇 ;從該混合用閥1 〇延伸的洗淨流體送出配管 1 04 ;及調整上述溶劑之流量、混合用氣體流量及此等混合 比率的調整機構。混合用閥1 0係依據溶劑及上述混合用氣 體的使用量,而由作爲控制手段的控制部(未圖示)來控制其 開閉。上述調整機構如具備溶劑用開閉閥6、溶劑用送出量 調整機構7、混合用氣體用開閉閥1 6、及混合用氣體用送出 量調整機構1 7。溶劑用開閉閥6及混合用氣體用開閉閥1 6 的開閉,可由上述控制部來控制。 ® 又,第3圖中,元件符號8表示作爲測定溶劑之使用量 的溶劑使用量測定機構的溶劑流量計,元件符號9表示溶劑 用過濾器,元件符號1 3表示負荷單元,元件符號1 8表示作 爲測定混合用氣體之使用量的氣體使用量測定機構的混合 用氣體流量計。其他構成則與第1實施形態相同,故而重複 之說明則於圖中施以相同的元件符號,並省略重複說明。 本實施形態之塗覆裝置100中,考量塗覆液配管21的 構成或塗覆液與洗淨溶劑的粘度等,利用設定溶劑容器4之 -15- 200534928 送出量調整機構7及混合用氣體配管1 5之混合用氣體流量 調整閥(混合用氣體用送出量調整機構)1 7的開啓度,由混合 用閥1 〇而以響應設定之任意比例混合氣體與溶劑,並從導 入閥12送入塗覆液配管(模具塗覆器配管)21內。 如此般作爲調節溶劑與混合用氣體的流量及混合比的 洗淨流體調整機構,以分別調整混合用氣體與溶劑的流量’ 且在洗淨流體狀態下未予控制的構成簡單者爲較佳,但不限 於此,還可爲不調節溶劑而調節混合用氣體的流量調整與全 ® 體的洗淨流體的流量的構成,預先決定混合比用以流量調整 規定混合溶劑的構成,在所有階段進行調節的構成等。 另外,流量調整一般是通過閥來進行者,但也可爲依定 量泵等的各種手段者。又,配管同樣除可爲簡單之T型管接 頭外,還可使用構成閥等的洗淨流體調整機構的一部分的各 種混合器具。 在第1至第3實施形態所示塗覆裝置100中,藉由對塗 覆液配管2 1送出混合了氣體與溶劑的洗淨流體,以使該洗 ^ 淨流體流通於塗覆液配管2 1內,便可洗淨該塗覆液配管。 又,根據此種塗覆裝置的洗淨方法,可效果良好地洗淨 模頭3內及配管21內,但在塗覆液供給泵20及模頭3等液 交換性差而洗淨困難的部位中,與習知方法比較,所洗淨的 程度雖高但仍然微量殘留有塗覆液。 對於此種液交換性差而洗淨困難的部位,通過根據使用 溶劑重量·氣體混合體積細調控制氣體或溶劑或其混合物的 上述洗淨流體的導入·非導入,便可成爲以高效果洗淨該部 -16- 200534928 位的構成。該情況,例如,如第3實施形態的塗覆裝置100 般進行構成,從設於溶劑容器4的負荷單元1 3所示重量變 化及設於混合用氣體配管1 5的流量計的乘算値,使符合預 先測定之洗淨困難的部位的內容積,進行塗覆液的依氣體的 取代、溶劑充塡、溶劑排出的各動作,便可達成利用依通過 氣液界面的氣液分配平衡的洗淨。 以下,以將第3圖所示塗覆裝置100應用於第4圖及第 5圖所示模頭3的情況爲例,說明該洗淨方法之洗淨推移。 ® 在塗覆結束之時點,模頭之集合管28內充滿了塗覆液。 在此首先藉由從塗覆液供給口 30送入洗淨流體用以交換塗 覆液。 此時,洗淨流體中的溶劑成分與塗覆液一起被從狹縫噴 嘴29排出,通過從上部開始蓄積氣體,最終無乾燥之擔憂 而可讓氣體充滿包含容易滯留液體的部位在內的內部。 接著,目測完全排出塗覆液的時點,此時僅將溶劑送入 集合管2 8內,予以充滿溶劑。在此,若在模頭存在有洩氣 ® 口( a i r v e n t ρ 〇 r t) 3 1,利用打開此便可更爲有效地充塡溶劑。 在完全排出塗覆液的時點,從集合管28的容積、與藉由備 於裝置上的負荷單元1 3所求得的溶劑使用量及藉由混合用 氣體流量計1 8所乘算的混合用氣體使用量的比較便可進行 判斷。 最後,在目測溶劑充滿了集合管2 8內的時點,再度送 入洗淨流體以排出溶劑。此時,從上部開始不斷堆積氣體, 利用通過氣液界面時產生的氣液分配平衡從壁面使塗覆液 -17- 200534928 溶出於液相而予以淨化。 在以上述一次動作而不能達成充分的效果的情況,還可 藉由重複進行溶劑充塡與排出以期待完全的洗淨。另外,還 可在洗淨結束後藉由僅送入氣體以進行乾燥,用以準備下一 步驟。在充滿了溶劑的時點,同樣可從集合管28的容積與 溶劑使用量的比較進行判斷。 當然,使用量的測定,其將溶劑通過重量變化,將氣體 通過流量的乘算來進行的上述方式雖然簡單,但也可根據其 ®他的手段來進行。 又,洗淨動作的控制,除以此種使用量等爲基礎進行的 控制外,還可依對照洗淨流體或溶劑·氣體的流速等與經過 時間的控制等。該情況如還可在塗覆裝置1 〇〇設置控制溶劑 之流速的溶劑用流速控制手段(例如,流速計)及控制混合用 氣體之流速的混合氣體用流速控制手段(例如,流速計)。另 外,還可在塗覆裝置1〇〇,使用通過介由閥而將加壓之混合 用氣體混入溶劑內,以使流動於較上述閥更下游側的配管內 ® 的溶劑及混合用氣體中的至少一方的流速變化之構成的流 速控制手段。 又,在具備第3圖所示模頭3之塗覆裝置100中,例如, 還可從送出量調整機構7及混合用氣體流量調整閥1 7的開 啓度與洗淨經過時間的比較,計算洗淨流體的擠壓量來進行 動作,若可能的話還可進行洗淨度本身的測定用以控制洗淨 動作。 上述洗淨時使用的溶劑並無特別的限定,但通常作爲模 -18- 200534928 頭的材質,若考慮使用金屬的情況及洗淨後的乾燥的容易 度,可適當考慮甲醇、乙醇、異丙醇、環己烷、丙酮、2-丁 酮、二氯甲烷等的低沸點有機化合物。 同樣,也不特別限定使用之氣體,但在採用低級醇及低 分子酮等的具有引火性的物質的情況,最好選擇氮氣及氬氣 等的惰性氣體。 另外,可將使用之溶劑設爲2種類以上進行洗淨。該情 況,多數個準備溶劑容器·負荷單元·溶劑流量計等,並介 由交換閥將配管連接於混合用閥。 針對構成上述洗淨動作的機構,若可實現該洗淨要點則 不問形態如何,但藉由程控邏輯控制器(PLC)進行各種監 視·控制,其控制之時間滯後少且微細控制較爲容易而較爲 理想。 以上,在依本發明之模具塗覆器配管洗淨中成爲重要因 素的是,將洗淨流體的氣液混合比例及送出量保持爲最適合 値,而這藉由溶劑之送出量調整機構7與混合用氣體流量調 整閥1 7的設定進行調整之情況,如上所陳。但是,即使在 洗淨相同之模具塗覆器的情況,達成上述氣液混合比例及送 出量的溶劑的送出量調整機構7與混合用氣體流量調整閥 1 7的設定値,也不一定經常爲一定値。 這是因爲上述設定値當然依洗淨前所充塡之塗覆液的 種類而可各異’更且’甚至還有根據洗淨進展之配管內塗覆 液殘量的減少而變化的可能性的緣故。這係根據粘度隨塗覆 液而變化的情況,另外由粘度較一般塗覆液低的溶劑來取代 -19- 200534928 塗覆液的情況,而使得相對擠壓的配管阻力發生變化的情 況。 除此之外,即使根據如上述的洗淨環境的變化’移動達 成最佳氣液混合比例的設定値,仍可爲動態進行洗淨溶劑的 流速控制,而具有維持混合狀態的功能的裝置。 ,相同地,即使根據如上述的洗淨環境的變化,移動達成 最佳氣液混合比例的設定値,仍可爲動態進行混合用氣體的 流速控制,而具有維持混合狀態的功能的裝置。 β 上述兩裝置均是從設於溶劑容器4之負荷單元1 3所示 重量變化率及設於混合用氣體配管1 5的流量計1 8的計測 値,計算氣液混合比例及洗淨流體的送出量,在本發明之申 請專利範圍第5項之發明的裝置中,於溶劑之送出量調整機 構7藉由回饋結果以實現該功能,而於同申請專利範圍第6 項之發明的裝置中,於混合用氣體流量調整閥1 7藉由回饋 結果以實現該功能。 以下’參照第6圖說明本發明之第4實施形態。本實施 ® 形態之塗覆裝置1 〇〇,適合於要求高精度、高精密的塗覆的 如濾色器、液晶材料、感熱記錄材料、經皮吸收製劑等的構 件的塗覆。本實施形態之塗覆裝置丨00係由塗覆單元部1 1 〇 及具有溶劑儲藏部300與乾燥氣體單元200的洗淨處理部 400所構成。 塗覆單元部110具備儲藏塗覆用塗覆液的塗覆液儲藏容 器1 9;爲在將塗覆液供給模頭3時從狹縫噴嘴等始終且均勻 形成簾幕狀塗覆液,用以除去灰塵等的異物的塗覆液用過濾 -20- 200534928 器23 ;更從塗覆液儲藏容器1 9移送塗覆液用的塗覆液供給 泵2 0 ;簾幕狀形成塗覆液的模頭3 ;進一步載取從模頭3落 下的塗覆液的塗覆液承載26 ;及儲積落於塗覆液承載26的 塗覆液及供給模頭3的多餘的塗覆液的廢液槽27。除模頭3 及塗覆液承載26外,各部分由對樹脂製管或不鏽鋼管或金 屬管的內面施以數之加工等的管進行配管。 塗覆單元部1 10進行以下之動作,即儲積於塗覆液儲藏 容器1 9的塗覆液係藉由塗覆液供給泵2 0的驅動從塗覆液儲 • 藏容器19通過處於配管途中的塗覆液用過濾器23進入塗覆 液供給泵20。又,通過連接於塗覆液供給泵20的吐出方向 的配管將塗覆液供給模頭3。供給模頭3之多餘塗覆液係從 模頭3呈簾幕狀流出,而未被塗覆之塗覆液則由廢液槽27 所回收。 從洗淨處理部400延伸的配管介由導入閥12而與塗覆 單元部1 10連接。此時,洗淨處理部400與塗覆單元部1 10 的連接部位,如第6圖之二點鎖線所示,還可設在泵20與 ^ 塗覆液用過濾器23之間、或塗覆液用過濾器23與塗覆液配 管21的端部(插入塗覆液配管21中的塗覆液儲藏容器19的 端部)。 溶劑儲藏部300爲抑制溶劑衝擊(solvent shock) ’具備 可儲積2種類以上的溶劑的2個以上、如4個溶劑箱5 1 a、 5 1 b、5 1 c、5 1 d。下游側的溶劑箱內的溶劑’其與塗覆液的 相容性較上游側的溶劑箱內的溶劑高。另外,下游側的溶劑 箱內的溶劑的洗淨性較上游側的溶劑箱內的溶劑高。 -21- 200534928 爲在各個溶劑箱5 1 a、5 1 b、5 1 c、5丨d,從與塗覆液具有 相容性者順序交換爲洗淨性高的溶劑,在各溶劑箱5 1 a、 5 1 b、5 1 c、5 1 d的上游側設置三通杯型的箱交換用閥5 3 a、 53b、53c、53d。又,箱交換用閥 53a、53b、53c、53d 的操 作,可通過從外部輸入操作信號來進行。另外,箱交換用閥 53a、53b、53c、53d的操作,也可由人工操作來進行。 另外,爲消除洗淨的不勻,在各溶劑箱5 1 a、5 1 b、5 1 c、 5 Id的底部設有進行溶劑的重量控制的負荷單元54a、54b、 # 54c、54d。又,爲消除從溶劑容器4移送的溶劑的洗淨不勻, 設有進行溶劑的流速控制用的溶劑流量控制閥5 6。在溶劑流 量控制閥5 6的吐出側設有計測溶劑流量的溶劑用流量計 5 2。通過溶劑用流量計5 2之溶劑’通過取得溶劑中的異物 等用的溶劑用過濾器55到達由交換閥57實施與來自乾燥氣 體單元部200的氣體作交換的場所,並於洗淨時從塗覆單元 部1 1 0的塗覆液交換閥1 2移送洗淨用的溶劑,順序由具有 相容性的溶劑洗淨塗覆單元部1 1 0的配管或模頭內部。另 ® 外,還可於洗淨時混合溶劑與氮氣等的乾燥用氣體並送入塗 覆單元部110,而藉由氣液界面洗淨塗覆單元部的配管或模 頭3。溶劑直到到達交換閥7 3爲止流動於溶劑用配管7 0內。 乾燥氣體單元部2〇〇具備儲藏使配管或模頭3內部乾燥 用的氣體的乾燥用氣體箱5 8 ;控制氣體流速用的乾燥用氣體 氣流控制部59 ;計測通過乾燥用氣體氣流控制部59的氣體 流量的乾燥用氣體流量計60 ;及以分別對應於各溶劑箱 5 1 a、5 1 b、5 1 c、5 1 d的方式並聯而設的4個氣體流量控制部。 -22- 200534928 對應於溶劑箱5 1 a的氣體流量控制部,係將氣體混入從溶劑 箱5 1 a吐出的溶劑內者,具備壓力控制閥80a、氣體流量控 制閥8 1 a及氣體流量計8 2 a。對應於溶劑箱5 1 b的氣體流量 控制部,係將氣體混入從溶劑箱5 1 b吐出的溶劑內者,具備 壓力控制閥80b、氣體流量控制閥81b及氣體流量計82b。 對應於溶劑箱5 1 c的氣體流量控制部,係將氣體混入從溶劑 箱5 1 c吐出的溶劑內者,具備壓力控制閥80c、氣體流量控 制閥8 1 c及氣體流量計82c。對應於溶劑箱5 1 d的氣體流量 控制部,係將氣體混入從溶劑箱5 1 d吐出的溶劑內者,具備 壓力控制閥80d、氣體流量控制閥81d及氣體流量計82d。 該塗覆裝置100中,以如下方式進行塗覆裝置100的洗 淨。 首先,從溶劑箱5 1 a吐出溶劑。藉由對應於溶劑箱5 1 a 的氣體流量控制部的控制,使氣體混入該溶劑內。停止溶劑 從溶劑箱5 1 a吐出。接著,從溶劑箱5 1 b吐出溶劑。藉由對 應於溶劑箱5 1 b的氣體流量控制部的控制,使氣體混入該溶 劑內。停止溶劑從溶劑箱5 1 b吐出。接著,從溶劑箱5 1 c吐 出溶劑。藉由對應於溶劑箱5 1 c的氣體流量控制部的控制, 使氣體混入該溶劑內。停止溶劑從溶劑箱5 1 c吐出。再者, 從溶劑箱5 1 d吐出溶劑。藉由對應於溶劑箱5 1 d的氣體流量 控制部的控制,使氣體混入該溶劑內。停止溶劑從溶劑箱5 1 d 吐出。最後,完全乾燥較交換閥57的下游側。 如上述,根據本實施形態之塗覆裝置1 00,即使爲要求 高精度、高精密的塗覆的情況,仍可良好地洗淨塗覆單元部 -23- 200534928 110° 又,在配管及模頭之洗淨時/乾燥時,針對較與洗淨處 理部連接的導入閥1 2的下游側、亦即塗覆液儲藏容器丨9側 的配管,恐有洗淨溶劑逆流的擔憂。因此在塗覆液儲藏容器 1 9的前面近處設置閥,利用與廢液槽27連接進行交換,以 防止污染到塗覆液儲藏容器1 9,但最好將塗覆液儲藏容器 19本身與接受廢液用的廢液罐等進行交換。 另外,溶劑箱5 1 a、5 1 b、5 1 c、5 1 d內的溶劑,係根據 • 與塗覆液的相溶性而可適宜選擇。例如,在用於塗覆液的主 溶劑爲二氯甲烷溶劑時,由二氯甲烷溶劑且以20KPa〜100 KPa的擠壓壓力進行洗淨,又,也可使用2_丁酮溶劑且以 3 0KPa〜100 KPa的擠壓壓力進行洗淨。 【圖式簡單說明】 第1圖爲顯示本發明之第1實施形態的塗覆裝置的槪要 圖。 第2圖爲顯示本發明之第2實施形態的塗覆裝置的槪要 •圖。 第3圖爲顯示本發明之第3實施形態的塗覆裝置的槪要 圖。 第4圖爲顯示模頭之一例的前視圖。 第5圖爲顯示模頭之右側視圖。 第6圖爲顯示本發明之第4實施形態的塗覆裝置的槪要 圖0 【元件符號說明】 -24- 200534928 1 洗 2 洗 3 模 4 溶 5 溶 6 溶 7 溶 8 溶 9 溶 10 混 11 洗 12 導 13 負 14 混 15 混 16 混 17 混 18 混 19 塗 20 塗 2 1 塗 22 易 23 塗 24 塗V 200534928 The function of combined gas flow and mixing ratio. With this configuration, it is possible to provide a coating device that can deliver the cleaning fluid mixed by the mixing valve at an arbitrary gas-liquid ratio while purifying the inside of the die coater pipe and the die head with high efficiency. The invention of claim 4 in the scope of patent application provides a coating device for claim 3 in the scope of patent application, which is characterized in that the solvent container has a solvent usage amount measurement mechanism, and the mixing gas storage container has a gas usage amount measurement mechanism. Means to control the opening and closing of the mixing valve based on the amount of solvent and gas used for mixing. With such a structure, the introduction or non-introduction of the cleaning fluid of the solvent or gas or a mixture thereof is finely controlled in accordance with the amount of the solvent or gas used, and the liquid exchangeability to the mold coater is poor and the cleaning is difficult. The coating liquid is exchanged with a gas without drying, and then a method of moving the internal liquid surface up and down to balance the gas-liquid distribution caused by the passage of the gas-liquid interface can be used. Therefore, it is possible to provide a coating device capable of purifying the part with high efficiency. The invention applying for item 5 of the patent scope provides a coating device for applying item 3 or 4 of the patent scope, which is characterized by having a solvent flow rate control means. This makes it possible to provide a coating device capable of controlling the dynamic flow rate of the cleaning solvent while maintaining the gas and the solvent in a suitable mixed state. The dynamic flow rate control refers to controlling the ratio of the gas for mixing to the solvent at a predetermined ratio, not at random. In addition, the dynamic flow rate control may include monitoring of the cleaning state, and feedback to the overall control system (such as valve adjustment) based on the monitoring results. The present invention with a scope of patent application No. 6 provides a coating device with a scope of patent application No. 3 or 4 or 5, which is characterized by: -10- 200534928 flow rate control means for mixing gas. This makes it possible to provide a coating apparatus capable of controlling the dynamic flow rate of the gas for mixing while maintaining the gas and the solvent in an appropriate mixed state. The invention of claim 7 in the scope of patent application provides a coating device for claim 1 in the scope of patent application, which is characterized in that the cleaning means has the use of two or more solvents, and the solvent is highly compatible with the coating liquid in order. Means to flow to solvents with low compatibility. With this structure, solvent shock can be suppressed. ○ • The present invention in the eighth aspect of the patent application provides a cleaning method for a coating device, which is provided with a die head, a coating liquid supply pump, and a coating device. A liquid-covered storage container and a method of coating a coating device connected to the coating liquid piping, wherein gas and solvents are alternately sent to the coating liquid piping, so that these flows in the coating liquid piping, and the gas is used. The interface with the solvent washes the coating liquid pipe. With this method, the inside of the die coater pipe and the die can be purified with high efficiency. The invention of item 9 of the scope of the patent application provides a method for cleaning a coating device of the scope of the patent application, characterized in that two or more solvents are used, and the solvent is highly compatible with the coating solution. Sequential flow to solvents with low compatibility. With this configuration, the impact of the solvent can be suppressed. According to the present invention, it is possible to provide a mold coater using a complicated piping path, and in particular, for a coating that requires a smaller amount of coating liquid to be precisely coated, in a non-decomposed state, the internal coating can be cleaned in a short time and well. Device and cleaning method of coating device. [Embodiment] Hereinafter, a first embodiment of the present invention will be described with reference to Fig. 1. The coating device 100 in the form of the present embodiment 11-200534928 has a coating liquid storage container 19 through an auxiliary device (such as a 'coating liquid supply pump 20', etc.), and a pipe (coating liquid) connected to the die 3 On the way to piping 21, a washing device (for example, a washing fluid delivery device as a washing fluid delivery means) is used as a washing means (i.e., a washing fluid delivery means that alternately sends gas and liquid), and The function of cleaning the inside of the coating liquid pipe 21 with high efficiency. FIG. 1 shows an example of a coating device ^ 100 which is connected to a coating liquid pipe 21 through a valve (introduction valve) 12 through a pipe (washing fluid supply pipe) 11 for introducing a washing fluid. In the first figure, the reference numeral 23 indicates a coating liquid filter, the reference numeral 24 indicates a coating liquid introduction valve, the reference numeral 25 indicates an air vent valve, and the reference numeral 26 indicates a coating liquid bearing. The reference numeral 27 denotes a waste liquid tank, and the reference numeral 110 denotes a coating unit section (mold applicator). The introduction valve 12, the coating liquid introduction valve 24, and the blow-off valve 25 are individually controlled to be opened and closed by a control unit (not shown) as a control means. With the introduction valve 12 described above, the die 3 side sends the cleaning fluid in the same direction as the flow during coating, and the coating liquid supply side sends the cleaning fluid in the direction opposite to the direction during coating. During the cleaning of the coating liquid supply side, the coating liquid storage container 19 was replaced with a waste liquid recovery container (not shown) as a waste liquid recovery mechanism. In addition to the waste liquid recovery mechanism, the present invention may include other mechanisms. For example, a conveyance mechanism and a coating thickness adjustment mechanism. In addition, the introduction portion of the cleaning fluid may be provided between the pump 20 and the coating liquid filter 23 or the coating liquid filter 23 and the coating liquid as indicated by a two-point lock line in the first figure. The end of the pipe 21 (the end of the coating liquid storage container 19 inserted into the coating liquid pipe 21-12-200534928) and the like. The introduction portion of the cleaning fluid is not limited to the middle of the coating liquid pipe, and may be an end portion. In this case, a connection mechanism is prepared in advance for the piping 11 for introducing the washing fluid, and the coating liquid pipe 21 is removed from the coating liquid storage container 19 during cleaning and connected to the above-mentioned connection mechanism. Hereinafter, a second embodiment of the present invention will be described with reference to FIG. 2. Figure 2 shows the case where the end of the coating liquid pipe 21 is set as the introduction part of the cleaning fluid. The coating device (the mold applicator) is connected to the connection pipe 1 1 through the connection mechanism. ) An example of 100. The reference numeral 22 in FIG. 2 indicates a one-touch coupler as a coupling mechanism. In addition, other configurations are the same as those in the i-th embodiment, and therefore duplicated explanations are given the same element symbols in the drawings, and duplicated explanations are omitted. As in the coating apparatus 100 of the first and second embodiments described above, the cleaning flow system is introduced midway or from the end of the coating liquid pipe 21, but at this time, it is important to maintain the cleaning effect that can best exhibit the purpose. Set the gas-liquid mixing ratio of the cleaning fluid and the flow rate. If this is not the case, although the amount of solvent can be reduced slightly, the improvement in the degree of cleaning compared to the method of flowing only the solvent cannot be expected at all. Also, the most suitable gas-liquid mixing ratio varies depending on the piping length, piping diameter, the equipment and appliances installed in the middle, the coating liquid in the filling, and the viscosity of the cleaning solvent used, but it is under pressure. The approximate volume ratio of gas: solvent is preferably 1: 2 ~ 3: 1. In addition, the most suitable flow rate also varies depending on various conditions, and it is preferably about 1 to 3 times the discharge amount during coating. When using the above-mentioned slit gap -13- 200534928 0.1mm die, It is preferably about 30 ml / min to 900 ml / min. It is important to emphasize here that the cleaning fluid is not a system in which fine bubbles are dispersed in a solvent. Even if the mixed solvent in this state is blown into the piping 1 1, it will be separated into two layers during the passage through the long pipe. In addition, when the gas-liquid dispersed solvent flows through the piping, the cleanability is still not good Great improvement. In the present invention, "the gas and the solvent are staggered and washed through the interface between the gas and the solvent" refers to the state that the gas and the solvent are regularly delivered in a short cycle. For example, it is best to use the pipe 1 1 and 2 1 The inside is in a state where gas and solvent of about 3ml to 20ml each pass. Thereby, the gas-liquid distribution balance generated when the interface between the gas and the solvent passes through the inner walls of the pipes 11 and 21 is applied, and the coating liquid is dissolved in the liquid phase from the wall surface of the pipe 21 to be purified. As a practical means for cleaning the coating device, a mechanism may be provided in which the gas and the solvent are sent out in a short cycle so that the gas-liquid mixing ratio and the delivery flow rate are kept at the optimum level. For example, there may be considered a case where the delivery pressure of the gas and the solvent is maintained at a constant ratio, and a case where the cross-sectional area of the flow path of the gas / solvent is tightened to restrict each delivery amount, but is not limited thereto. However, depending on the composition of the coating liquid pipe to be cleaned, the remaining coating liquid at the time of cleaning, and the viscosity of the cleaning solvent used, the optimum amount of gas and solvent sent out or the mixing ratio will vary, so It is convenient to set these arbitrarily. In response to the above, the coating apparatus 100 has a function of adjusting the flow rate and mixing ratio of the solvent and the gas for mixing. Hereinafter, a third embodiment of the present invention will be described with reference to FIG. 3. Figure 3 -14- 200534928 is a schematic diagram showing an example of a coating device 100 including a cleaning means 1 0 1 having a function of adjusting the flow rate and mixing ratio of a solvent and a mixing gas. In this embodiment, the washing means 101 includes a washing machine solvent supply unit 1 and a washing machine mixing gas supply unit 2. The washing means 101 is provided with a solvent container 4 containing a solvent; a solvent pipe 5 connected to the solvent container 4; a mixing gas storage container 14 containing a mixing gas; and a mixing device connected to the mixing gas storage container 14. Gas piping 15; end of solvent piping 5 and end of mixing gas piping 15® mixing valve 1 0; washing fluid extending from the mixing valve 1 0 to send out pipe 10 04; and adjusting the solvent Flow rate, mixing gas flow rate, and adjustment mechanism for these mixing ratios. The mixing valve 10 is controlled by a control unit (not shown) as a control means depending on the amount of the solvent and the gas used for the mixing. The adjustment mechanism includes, for example, a solvent on-off valve 6, a solvent delivery amount adjustment mechanism 7, a mixing gas on-off valve 16 and a mixing gas delivery amount adjustment mechanism 17. The opening and closing of the solvent on-off valve 6 and the gas-on-off valve 16 for mixing can be controlled by the above-mentioned control unit. ® In the third figure, the element symbol 8 indicates a solvent flowmeter as a solvent usage measuring mechanism for measuring the amount of solvent used, the element symbol 9 indicates a solvent filter, the element symbol 1 3 indicates a load cell, and the element symbol 1 8 A gas flow meter for mixing, which is a gas usage-amount measuring mechanism that measures the amount of gas used for mixing. The other structures are the same as those of the first embodiment, and therefore duplicated explanations are given the same reference numerals in the drawings, and duplicated explanations are omitted. In the coating apparatus 100 according to this embodiment, the configuration of the coating liquid pipe 21, the viscosity of the coating liquid and the cleaning solvent, etc. are considered, and the setting of the solvent container 4-15-200534928. The opening degree of the mixing gas flow adjustment valve for 15 (mixing gas delivery amount adjustment mechanism) 17 is opened by mixing valve 10 and mixing the gas and the solvent at an arbitrary ratio set by the response, and is sent from the introduction valve 12 Inside the coating liquid pipe (mold applicator pipe) 21. In this way, as a cleaning fluid adjusting mechanism for adjusting the flow rate and the mixing ratio of the solvent and the mixing gas, it is better to simply adjust the flow rate of the mixing gas and the solvent, and to control the flow rate of the mixing gas and the solvent without cleaning, However, it is not limited to this, and it is also possible to adjust the composition of the flow rate of the mixing gas and the flow rate of the entire cleaning fluid without adjusting the solvent. The composition of regulation, etc. The flow rate adjustment is generally performed by a valve, but it may be performed by various means such as a fixed volume pump. In addition, the piping can also be a simple T-shaped pipe joint, and various mixing devices constituting a part of the cleaning fluid adjusting mechanism such as a valve can also be used. In the coating apparatus 100 shown in the first to third embodiments, a cleaning fluid mixed with a gas and a solvent is sent to the coating liquid pipe 2 1 so that the cleaning fluid flows through the coating liquid pipe 2. The coating liquid pipe can be cleaned within 1 minute. In addition, according to the cleaning method of such a coating device, the inside of the die 3 and the piping 21 can be effectively cleaned, but in areas where the liquid exchangeability of the coating liquid supply pump 20 and the die 3 is poor and the cleaning is difficult Compared with the conventional method, although the degree of washing was high, the coating liquid remained in a trace amount. For such parts with poor liquid exchangeability and difficult cleaning, it is possible to achieve high-efficiency cleaning by finely controlling the introduction or non-introduction of the above-mentioned cleaning fluid of a gas, a solvent, or a mixture thereof in accordance with the solvent weight and gas mixing volume. Composition of the Ministry-16-200534928. In this case, for example, it is structured like the coating apparatus 100 of the third embodiment, and is calculated from the weight change shown in the load unit 13 provided in the solvent container 4 and the multiplication of the flow meter provided in the mixing gas pipe 15. In order to make the internal volume of the part that is difficult to clean in accordance with the measurement in advance, and perform the actions of replacing the coating liquid with the gas, filling the solvent, and discharging the solvent, the balance of gas-liquid distribution through the gas-liquid interface can be achieved. Wash. In the following, a case where the coating device 100 shown in FIG. 3 is applied to the die 3 shown in FIGS. 4 and 5 is taken as an example to explain the cleaning transition of this cleaning method. ® At the end of coating, the manifold 28 of the die is filled with coating liquid. First, the cleaning fluid is fed from the coating liquid supply port 30 to exchange the coating liquid. At this time, the solvent component in the cleaning fluid is discharged from the slit nozzle 29 together with the coating liquid. By accumulating gas from the upper part, there is no fear of drying, and the gas can be filled into the interior including the part that is prone to stagnation of liquid. . Next, when the coating liquid was completely discharged, the solvent was sent into the header pipe 28 only at this time and filled with the solvent. Here, if there is a blow-out ® port (a i r v e n t ρ 〇 r t) 3 1 in the die head, the solvent can be filled more effectively by opening this. When the coating liquid is completely discharged, the volume is collected from the volume of the manifold 28, the amount of solvent used obtained by the load unit 13 provided on the device, and the mixture multiplied by the gas flow meter 18 for mixing. This can be judged by comparing the gas usage. Finally, at the point when the solvent filled the manifold 28 visually, the cleaning fluid was fed again to discharge the solvent. At this time, the gas is continuously accumulated from the upper part, and the coating liquid -17- 200534928 is dissolved in the liquid phase from the wall to be purified by using the gas-liquid distribution balance generated when passing through the gas-liquid interface. In the case where a sufficient effect cannot be achieved by the above-mentioned one-time operation, it is also possible to expect complete washing by repeatedly filling and discharging the solvent. In addition, after the washing is completed, only the gas is sent in for drying to prepare for the next step. When the solvent is filled, the comparison can be made from the comparison between the volume of the header 28 and the amount of solvent used. Of course, the above method of measuring the amount of use is to multiply the solvent by weight and multiply the gas by the flow rate, but it can also be performed by other means. In addition to controlling the cleaning operation based on the amount of use, etc., it can also be controlled by comparing the flow rate of the cleaning fluid, solvent, and gas with the elapsed time. In this case, for example, a flow rate control means for a solvent (for example, a flow meter) that controls the flow rate of the solvent and a flow rate control means for a mixed gas (for example, a flow meter) that controls the flow rate of the mixing gas may be provided in the coating apparatus 100. In addition, in the coating device 100, a pressurized mixing gas may be mixed into the solvent through a valve so that the solvent and the mixing gas flowing in the pipe® downstream from the valve may be used. A flow rate control means constituted by at least one of the flow rate changes. Further, in the coating apparatus 100 including the die 3 shown in FIG. 3, for example, the opening amount of the delivery amount adjustment mechanism 7 and the mixing gas flow adjustment valve 17 can be compared with the washing elapsed time to calculate The squeezing amount of the washing fluid is used to perform the operation, and if possible the measurement of the degree of washing itself may be performed to control the washing operation. The solvent used in the above washing is not particularly limited, but it is usually used as the material of the mold-18-200534928 head. If the use of metal and the ease of drying after washing are considered, methanol, ethanol, and isopropyl can be properly considered. Low-boiling organic compounds such as alcohols, cyclohexane, acetone, 2-butanone, and dichloromethane. Similarly, the gas to be used is not particularly limited, but when a pyrophoric substance such as a lower alcohol or a low-molecular ketone is used, an inert gas such as nitrogen or argon is preferably selected. In addition, the solvent to be used can be washed with two or more types of solvents. In this case, a plurality of solvent containers, load cells, solvent flow meters, etc. are prepared, and piping is connected to the mixing valve via an exchange valve. Regarding the mechanism that constitutes the above-mentioned cleaning operation, regardless of the form, if the cleaning points can be realized, but various monitoring and control are performed by a programmable logic controller (PLC), the time lag of the control is small and fine control is relatively easy. More ideal. The above, which becomes an important factor in the cleaning of the mold applicator piping according to the present invention, is to maintain the gas-liquid mixing ratio and the delivery amount of the cleaning fluid to the most suitable level, and this is performed by the solvent delivery amount adjustment mechanism 7 The adjustment with the setting of the gas flow adjustment valve 17 for mixing is as described above. However, even when the same mold applicator is cleaned, the settings of the delivery amount adjustment mechanism 7 for the solvent and the mixing gas flow adjustment valve 17 for achieving the above-mentioned gas-liquid mixing ratio and delivery amount may not always be Definitely. This is because the above settings, of course, may vary depending on the type of coating liquid filled before cleaning, and may even change depending on the decrease in the amount of coating liquid remaining in the pipe during cleaning progress. Sake. This is based on the fact that the viscosity changes with the coating liquid, and the solvent with a lower viscosity than the general coating liquid is used to replace the -19-200534928 coating liquid, which changes the relative squeezed piping resistance. In addition, even if the optimum gas-liquid mixing ratio is set by moving according to the change of the cleaning environment described above, the device can still maintain the mixing state for dynamically controlling the flow rate of the cleaning solvent. In the same way, even if the setting of the optimal gas-liquid mixing ratio is moved according to the change of the cleaning environment as described above, the device can still maintain the mixing state for dynamically controlling the flow rate of the mixing gas. β Both devices calculate the gas-liquid mixing ratio and the washing fluid from the measurement of the weight change rate shown in the load unit 13 of the solvent container 4 and the flow meter 18 of the mixing gas pipe 15. In the device of the invention of claim 5 in the scope of patent application of the present invention, the amount of delivery is adjusted by the solvent delivery amount adjustment mechanism 7 to realize the function by returning the result, and in the device of the invention of claim 6 of the scope of patent application In the mixing gas flow adjustment valve 17, the function is realized by feeding back the results. Hereinafter, a fourth embodiment of the present invention will be described with reference to Fig. 6. The coating device 100 in this embodiment ® form is suitable for coating components such as color filters, liquid crystal materials, thermal recording materials, transdermal absorption preparations, etc. that require high precision and high precision coating. The coating apparatus 丨 00 in this embodiment is composed of a coating unit section 110 and a cleaning treatment section 400 including a solvent storage section 300 and a drying gas unit 200. The coating unit 110 is provided with a coating liquid storage container 19 for storing a coating liquid for coating. In order to form a curtain-shaped coating liquid from a slit nozzle or the like consistently and uniformly when the coating liquid is supplied to the die 3, Filter for coating liquid for removing foreign matter such as dust-20- 200534928 device 23; coating liquid supply pump 20 for transferring coating liquid from coating liquid storage container 19; curtain-shaped coating liquid Die 3; a coating liquid carrier 26 further carrying the coating liquid dropped from the die 3; and a coating liquid storing the coating liquid dropped on the coating liquid carrier 26 and a waste liquid of excess coating liquid supplied to the die 3 Slot 27. Except for the die 3 and the coating liquid carrier 26, each part is piped by a pipe made of a number of processes such as a resin pipe, a stainless steel pipe, or a metal pipe. The coating unit section 10 performs the following operation. The coating liquid stored in the coating liquid storage container 19 is driven by the coating liquid supply pump 20 from the coating liquid storage container 19 through the pipeline. The coating liquid filter 23 enters the coating liquid supply pump 20. The coating liquid is supplied to the die 3 through a pipe connected to the discharge direction of the coating liquid supply pump 20. The excess coating liquid supplied to the die head 3 flows out from the die head 3 in a curtain shape, and the uncoated coating liquid is recovered by the waste liquid tank 27. The piping extending from the cleaning treatment section 400 is connected to the coating unit section 10 through the introduction valve 12. At this time, the connection part between the cleaning treatment part 400 and the coating unit part 10 may be provided between the pump 20 and the filter 23 for the coating liquid, or as shown in FIG. 6 dot lock line. The liquid-covering filter 23 and the end of the coating liquid pipe 21 (the end of the coating liquid storage container 19 inserted into the coating liquid pipe 21). The solvent storage unit 300 is for suppressing a solvent shock, and is provided with two or more solvents capable of storing two or more types of solvents, such as four solvent tanks 5 1 a, 5 1 b, 5 1 c, and 5 1 d. The solvent 'in the solvent tank on the downstream side is more compatible with the coating liquid than the solvent in the solvent tank on the upstream side. In addition, the cleanability of the solvent in the solvent tank on the downstream side is higher than that in the solvent tank on the upstream side. -21- 200534928 For each solvent tank 5 1 a, 5 1 b, 5 1 c, 5 丨 d, they are sequentially exchanged from those with compatibility with the coating solution to solvents with high detergency. In each solvent tank 5 On the upstream side of 1 a, 5 1 b, 5 1 c, and 5 1 d, three-way cup-type box exchange valves 5 3 a, 53b, 53c, and 53d are provided. The operation of the tank exchange valves 53a, 53b, 53c, and 53d can be performed by inputting an operation signal from the outside. The operation of the tank exchange valves 53a, 53b, 53c, and 53d can also be performed manually. In order to eliminate uneven washing, load units 54a, 54b, # 54c, and 54d for controlling the weight of the solvent are provided at the bottom of each of the solvent tanks 5 1 a, 5 1 b, 5 1 c, and 5 Id. In order to eliminate uneven washing of the solvent transferred from the solvent container 4, a solvent flow control valve 56 for controlling the flow rate of the solvent is provided. A solvent flow meter 52 for measuring the solvent flow rate is provided on the discharge side of the solvent flow control valve 56. The solvent passed through the solvent flow meter 5 2 ′ passes through the solvent filter 55 for obtaining foreign matters in the solvent, etc., and reaches the place where the exchange valve 57 exchanges the gas from the dry gas unit 200 with the exchange valve 57 and removes the The coating liquid exchange valve 12 of the coating unit section 1 10 transfers the cleaning solvent, and the inside of the piping or the die of the coating unit section 10 is sequentially cleaned by a compatible solvent. In addition, during cleaning, a solvent, nitrogen, and other drying gas may be mixed and sent to the coating unit section 110, and the pipes or the die 3 of the coating unit section may be cleaned by a gas-liquid interface. The solvent flows into the solvent pipe 70 until it reaches the exchange valve 73. The drying gas unit section 200 is provided with a drying gas box 5 8 for storing gas for drying inside the piping or the die 3; a drying gas flow control section 59 for controlling a gas flow rate; and a measurement passing the drying gas flow control section 59 A gas flow meter 60 for drying the gas flow rate; and four gas flow rate control units provided in parallel so as to correspond to the respective solvent tanks 5 1 a, 5 1 b, 5 1 c, and 5 1 d. -22- 200534928 The gas flow control unit corresponding to the solvent tank 5 1 a is a gas flow control unit that mixes gas into the solvent discharged from the solvent tank 5 1 a. It includes a pressure control valve 80a, a gas flow control valve 8 1 a, and a gas flow meter. 8 2 a. The gas flow rate control unit corresponding to the solvent tank 5 1 b is a gas flow control unit that mixes gas into the solvent discharged from the solvent tank 5 1 b, and includes a pressure control valve 80b, a gas flow control valve 81b, and a gas flow meter 82b. The gas flow rate control unit corresponding to the solvent tank 5 1 c is a gas flow control unit that mixes gas into the solvent discharged from the solvent tank 5 1 c, and includes a pressure control valve 80c, a gas flow control valve 8 1c, and a gas flow meter 82c. The gas flow rate control unit corresponding to the solvent tank 5 1 d includes a pressure control valve 80d, a gas flow control valve 81d, and a gas flow meter 82d, which mixes gas into the solvent discharged from the solvent tank 5 1d. In this coating apparatus 100, the coating apparatus 100 is cleaned as follows. First, the solvent is discharged from the solvent tank 5 1 a. The gas is mixed into the solvent under the control of a gas flow control unit corresponding to the solvent tank 5 1 a. Stop the solvent and spit it out from the solvent tank 5 1 a. Then, the solvent is discharged from the solvent tank 5 1 b. The gas is mixed into the solvent under the control of the gas flow control unit corresponding to the solvent tank 5 1 b. Stop the solvent from being discharged from the solvent tank 5 1 b. Then, the solvent is discharged from the solvent tank 5 1 c. The gas is mixed into the solvent under the control of a gas flow control unit corresponding to the solvent tank 5 1 c. Stop the solvent from being discharged from the solvent tank 5 1 c. In addition, the solvent was discharged from the solvent tank 5 1 d. The gas is mixed into the solvent under the control of the gas flow rate controller corresponding to the solvent tank 5 1 d. Stop the solvent from spitting out from the solvent tank 5 1 d. Finally, the downstream side of the exchange valve 57 is completely dried. As described above, according to the coating device 100 of this embodiment, even in the case where high-precision and high-precision coating is required, the coating unit section can be cleaned well. 23- 200534928 110 ° When the head is cleaned / dried, there is a concern that the washing solvent may flow backward with respect to the piping on the downstream side of the introduction valve 12 connected to the washing treatment section, that is, on the coating liquid storage container 9 side. Therefore, a valve is provided near the front of the coating liquid storage container 19 and exchanged with the waste liquid tank 27 to prevent contamination to the coating liquid storage container 19, but it is better to separate the coating liquid storage container 19 itself with Waste liquid tanks for receiving waste liquid are exchanged. The solvents in the solvent tanks 5 1 a, 5 1 b, 5 1 c, and 5 1 d can be appropriately selected depending on the compatibility with the coating solution. For example, when the main solvent used for the coating solution is a dichloromethane solvent, washing with a dichloromethane solvent and a squeezing pressure of 20 KPa to 100 KPa may be carried out. Wash at a pressure of 0 KPa to 100 KPa. [Brief description of the drawings] Fig. 1 is a schematic diagram showing a coating apparatus according to a first embodiment of the present invention. Fig. 2 is a schematic diagram showing a coating apparatus according to a second embodiment of the present invention. Fig. 3 is a schematic view showing a coating apparatus according to a third embodiment of the present invention. Fig. 4 is a front view showing an example of the die. Figure 5 is a right side view of the display die. Fig. 6 is a summary diagram showing a coating device according to a fourth embodiment of the present invention. [Description of Symbols] -24- 200534928 1 Wash 2 Wash 3 Mold 4 Dissolve 5 Dissolve 6 Dissolve 7 Dissolve 8 Dissolve 9 Dissolve 10 Dissolve 11 wash 12 lead 13 negative 14 mix 15 mix 16 mix 17 mix 18 mix 19 Tu 20 Tu 2 1 Tu 22 Easy 23 Tu 24 Tu

淨機溶劑供給部 淨機混合用氣體供給部 頭 劑容器 劑配管 劑用開閉閥 劑用送出量調整機構 劑流量計 劑用過濾器 合用閥 淨流體供給配管 入閥弁 荷單元 合用氣體儲藏容器 合用氣體配管 合用氣體用開閉閥 合用氣體用送出量調整機構 合用氣體流量計 覆液儲藏容器 覆液供給泵 覆液配管 連接接頭(one-touch coupler) 覆液用過濾器 覆液導入閥 -25- 200534928 5 1 d 25 26 27 28 29 30 3 1 51a、 51b、 51 52 53a 、 53b 、 53c 、 53d 54a 、 54b 、 54c 、 54d 55 56 57 58 59 60 70 7 3 80a、80b、80c、80d 81a 、 81b 、 81c 、 81d 82a 、 82b 、 82c 、 82d 100 101 洩氣閥(air vent valve) 塗覆液承載 廢液槽 集合管 狹縫噴嘴 塗覆液供給口 拽氣口 (air vent port) 溶劑箱 溶劑用流量計 箱交換用閥 負荷單元 溶劑用過濾器 溶劑流量控制閥 交換閥 乾燥用氣體箱 乾燥用氣體氣流控制部 乾燥用氣體流量計 溶劑用配管 交換閥 壓力控制閥 氣體流量控制閥 氣體流量計 塗覆裝置 洗淨裝置(洗淨手段) -26- 200534928 104 1 10 200 300 400 洗淨流體送出配管 塗覆單元部 乾燥氣體單元部 溶劑儲藏部 洗淨處理部Cleaner solvent supply unit Cleaner gas supply unit Head agent container agent Piping agent On-off valve agent Delivery amount adjustment mechanism Agent Flow meter agent Filter combined valve Net fluid supply piping inlet valve load unit Combined gas storage container Gas piping combined gas on-off valve combined gas delivery volume adjustment mechanism combined with gas flow meter liquid storage container liquid supply pump liquid connection piping connector (one-touch coupler) liquid filter filter liquid inlet valve-25- 200534928 5 1 d 25 26 27 28 29 30 3 1 51a, 51b, 51 52 53a, 53b, 53c, 53d 54a, 54b, 54c, 54d 55 56 57 58 59 60 70 7 3 80a, 80b, 80c, 80d 81a, 81b , 81c, 81d, 82a, 82b, 82c, 82d 100 101 Air vent valve Air-liquid coating liquid carrying waste tank collection tube slit nozzle Coating liquid supply port air vent port Solvent tank solvent flowmeter Valve exchange unit for tank load Unit filter for solvent Solvent flow control valve exchange valve Drying gas box drying Gas flow control unit Drying gas flow meter Solvent piping Valve changing pressure control valve Gas flow control valve Gas flow meter Coating device Cleaning device (cleaning means) -26- 200534928 104 1 10 200 300 400 Washing fluid sending out piping coating unit section Dry gas unit section Solvent storage section Washing Net Processing Department

-27--27-

Claims (1)

200534928 十、申請專利範圍: 1· 一 種塗覆裝置(coating machine),具備模頭(die-head)、塗 覆液供給泵(pump)、塗覆液儲藏容器、及連接此等的塗覆 液配管,其特徵爲: 在上述塗覆液配管上,連接有洗淨手段,交錯送出氣體 與溶劑且利用通過氣體與溶劑的界面來洗淨該塗覆液配 管的。 2.如申請專利範圔第i項之塗覆裝置,其中塗覆液儲藏容器 ® 係設於塗覆液配管的端部, 塗覆液配管具備配管,具有在拆下塗覆液儲藏容器時可 連結該端部的連結機構, 洗淨手段連接於上述配管。 3 ·如申請專利範圍第1或2項之塗覆裝置,其中洗淨手段具 備收容溶劑之溶劑容器;連接於該溶劑容器的溶劑配管; 收容混合用氣體之混合用氣體儲藏容器;連接於該混合用 氣體儲藏容器的混合用氣體配管;連接溶劑配管的終端及 ® 混合用氣體的終端的混合用閥;從該混合用閥伸長的洗淨 流體配管;及調整溶劑流量、混合用氣體流量及此等混合 比率的調整機構。 4·如申請專利範圍第3項之塗覆裝置,其中設置測定溶劑使 用量之溶劑使用量測定機構, 設置測定混合用氣體使用量之氣體使用量測定機構, 還具備根據溶劑及混合用氣體之使用量控制混合用閥 的開閉的控制手段。 -28 - 200534928 5 ·如申請專利範圍第3項之塗覆裝置,其中還具備控制溶劑 流速的流速控制手段。 6.如申請專利範圍第3項之塗覆裝置,其中還具備控制混合 用氣體之流速的流速控制手段。 7·如申請專利範圍第1項之塗覆裝置,其中洗淨手段具有使 用2種以上的溶劑,從與塗覆液的相溶性高的溶劑順序流 向相溶性低的溶劑的手段。 8·—種塗覆裝置之洗淨方法,用於洗淨具備模頭(die_head)、 ® 塗覆液供給栗(pump)、塗覆液儲藏容器、及連接此等的塗 覆液配管的塗覆裝置的方法,其特徵爲: 藉由對上述塗覆液配管交錯送出氣體與溶劑,使此等流 通於上述塗覆液配管內,利用氣體與溶劑的界面以洗淨該 塗覆液配管。 9 ·如申請專利範圍第8項之塗覆裝置之洗淨方法,其中使用 2種以上的溶劑,從與塗覆液的相溶性高的溶劑順序流向 相溶性低的溶劑。 -29-200534928 10. Scope of patent application: 1. A coating machine, which includes a die-head, a coating liquid pump, a coating liquid storage container, and a coating liquid connected to the coating liquid. The piping is characterized in that the coating liquid piping is connected with a washing means, and the gas and the solvent are staggered and the coating liquid piping is cleaned by an interface between the gas and the solvent. 2. The coating device according to item i of the patent application, wherein the coating liquid storage container ® is provided at the end of the coating liquid piping, and the coating liquid piping is provided with a piping, which can be used when the coating liquid storage container is removed. The connecting mechanism that connects the end portions is connected to the piping by a washing means. 3. The coating device according to item 1 or 2 of the scope of patent application, wherein the cleaning means includes a solvent container containing a solvent; a solvent pipe connected to the solvent container; a mixing gas storage container containing a mixing gas; connected to the Mixing gas piping for mixing gas storage containers; mixing valve connected to the terminal of the solvent piping and ® terminal of the mixing gas; cleaning fluid piping extending from the mixing valve; and adjusting the solvent flow rate, mixing gas flow rate, and These mixing ratio adjustment mechanisms. 4. The coating device according to item 3 of the patent application scope, wherein a solvent usage amount measuring mechanism for measuring the solvent usage amount is provided, a gas usage amount measuring mechanism for measuring the gas usage amount for the mixing is provided, and a method Control method for controlling the opening and closing of the mixing valve with the amount of use. -28-200534928 5 · The coating device according to item 3 of the patent application, which also includes a flow rate control means for controlling the flow rate of the solvent. 6. The coating device according to item 3 of the patent application scope, further comprising a flow rate control means for controlling the flow rate of the mixed gas. 7. The coating device according to item 1 of the patent application range, wherein the cleaning means has a means for sequentially flowing from a solvent having a high compatibility with the coating liquid to a solvent having a low compatibility using two or more solvents. 8 · —A cleaning method of a coating device for cleaning a coating provided with a die_head, a coating liquid supply pump, a coating liquid storage container, and a coating liquid pipe connected thereto The method of coating a device is characterized in that gas and solvent are alternately sent to the coating liquid piping so as to flow through the coating liquid piping, and the interface of the gas and the solvent is used to clean the coating liquid piping. 9 · The cleaning method of the coating device according to item 8 of the patent application, wherein two or more solvents are used, and the solvent from the solvent having high compatibility with the coating liquid is sequentially flowed to the solvent having low compatibility. -29-
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TWI551356B (en) * 2012-12-20 2016-10-01 東京威力科創股份有限公司 Liquid treatment device, liquid treatment method and medium for liquid treatment
TWI551355B (en) * 2012-12-20 2016-10-01 東京威力科創股份有限公司 Liquid treatment device, liquid treatment method and medium for liquid treatment

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JP4590877B2 (en) 2010-12-01
JP2005219014A (en) 2005-08-18
CN1909975B (en) 2010-08-04
KR20060110337A (en) 2006-10-24
CN1909975A (en) 2007-02-07
WO2005075107A1 (en) 2005-08-18
KR101113848B1 (en) 2012-03-13

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