200532171 九、發明說明： 【發明所屬之技術領域】 本發明關於一種聲波接觸檢測穿 觸控面板。 、j衣置，例如一超音波 【先前技術】 ίϊΐ聲波接觸檢縣置現紅廣泛使用。豆岸用 接觸I印機、及金融機構的八™。這些聲波 =二=_奐二包含提供於由玻璃之類形成 器作用如同νίί (壓電元件)。這些轉換 面板之手指之躺散射之^檢測由接觸該觸控 換器與控制電路由以絕緣;蓋絕=線=電路之轉 然而，在該基板週邊由聚光圈之類费 由於空間的S乏，很難配置該佈線。'Ί之h況中’ 已有應用扁平電纜的情況，例 (FPC) ’如揭示於曰本未請求審查的：J 6(1994)_324792號（第5頁、第九圖）中。月A開水弟 刷於其上之撓性板。 C為電路印 在FPC應用連接基板的情況中，外略、 進入形成於該FPC上的信號電路(信號佈 =波= 外，有一個問題電磁波自該信號佈線輻射至展）。除此之 理由係由於構成該FPC之信號佈線，使得复=二 至該外部。在該FPC應用於日本未請求審 案第6-324792號的情況中，大於該Fpr二的舍月A開 茗兮171^〜从田a η、奋-姐从 ^ 6勺遮蔽電極覆 皿5玄FPC以作用如同‘敝構件 '然而，由 200532171 件’此構造增加該裝置之成本。 【發明内容】 、本务明已鑑於上述各點加以開發。本發明之目的係 以低成本提供一種於抗電磁干擾(EMI)性質上之波接 觸檢測裝置。 本發明之聲波接觸檢測裝置包含： 一基板，具有聲波沿其傳播之表面； 一聲波產生裝置； 一反射陣列，用以導致該已產生聲波沿著該基板之 表面傳播； 檢測恭，用以檢測由接觸該基板之表面之物導 致之聲波中之變更；及 控制恭，用以決定該物件之幾何座標； 一其中前述聲波產生裝置及前述檢測器至少其中之 :由撓性平面佈線連接該控制器；且前述撓性平面佈線 係於信號佈狀至少-側±提供接_狀佈線圖案。 该繞性平面佈線可包含： 複數個信號佈線配置於其中之信號佈線群；及 位於該信號佈線群兩側之接地佈線。 除了於該基板之表面上傳播之表面聲波之外，該聲 波包含透過該薄基板沿著其表面傳播之超音波。 邊f波產生裝置可包含模式轉換元件與超音波振 ^器。該模式轉換元件可由與該基板整合形成之複數個 平行脊構成。 該檢測ϋ可為-轉換器。該轉換器可為黏著附加 该基板之後表面之型態。或者，該轉糾n換形轉 200532171 換器，其黏著附加至三角枉之一端，其黏著附加至該基 板之前表面。 該撓性平面佈線包含FPC與撓性扁平電纜(FFC)。 雙線佈線可利用為該撓性平面佈線之其他選擇。 在本發明之聲波接觸檢測裝置中，該聲波產生裝置 與該檢測器至少其中之一由撓性平面佈線連接該控制 器。該撓性平面佈線係接地佈線提供於信號佈線之至少 一側上之佈線圖案。因此，該信號佈線係由該接地佈線 電磁遮蔽，改良該聲波接觸檢測裝置之抗EMI性質。除 此之外，當需要避免一額外遮蔽結構時，降低該裝置成 本。 此外，可採用一構造，其中該撓性平面佈線包含複 數個信號佈線配置於其中之一信號佈線群；及接地佈線 位於該信號佈線群之兩側。在此情況中，該信號佈線群 允許集合與有效遮蔽’進一步改良該抗EMI性質。此構 造亦允許該撓性平面佈線之縮小化。當FPC之成本實質 上對其區城成正比時，FPC之縮小化進一步貢獻以降低 其成本。 【實施方式】 將參照附圖說明聲波接觸檢測裝置（以下簡稱為「裝 置」）之較隹具體實施例。 第一圖係欲利用於裝置1中之觸控面板3之前視 圖。如第一圖所示，該觸控面板3包含：由矩形玻璃板 形成之基板2 ;裂設於該基板2上之撓性印刷電路 4(FPC);及電氣連結至該FPC 4之控制器6。 該FPC 4分支至FPC分支4a與FPC分支4b中。 200532171 該H>C分支4a沿著該基板2之水平方向延伸，亦即由 該箭頭X所指之X軸方向。該FPC分支4b沿著垂直於 該X軸之基板之垂直方向延伸，亦即由該箭頭γ所指之 Υ軸方向。用以產生超音波之轉換器（體波產生裝置 與Η)裝設於該FPC 4上。除此之外，作用 之轉換器（檢測器）12與14裝設於該卯€4上。心°° 包含大量傾斜線16之反射陣列18沿著基板2之前 表面上之Y軸形成於其一橫向邊緣44附近。包含大量 傾斜線20之反射陣列22面對反射陣列18形成於該基 板之另一松向邊緣44處。包含大量傾斜線26之反射陣 列28沿著該基板2之上邊緣24附近之χ軸形成。包含 大量傾斜線30之反射陣列32面對該反射陣列28形成 於6玄基板之下邊緣45附近。這些反射陣列1 $、22、28 及32之圖案揭示於曰本未請求審查的發明公開案第 61(1986)-239322與2001-14094號中。注意該反射陣列 18、22、28及32將統稱為反射陣列33。該反射陣列33 反射聲波’且導致其沿著該基板2之前表面傳播。 該轉換器8、10、12及14黏著附加至該基板2之 後表面。模式轉換元件78、80、82及84(光柵)形成於該 基板2之前表面上，分別於對應至該轉換器8、10、12 及14之位置處。此構造將參照第十一圖說明，採取該 模式轉換元件80作為一範例。第十一圖係基板2之概 略部分放大圖，自箭頭A之方向檢視。第十一圖之模式 轉換元件80藉由燒结玻璃膏於該基板2上形成，且包 含複數個平行脊80a。第十一圖中所示之脊8〇a以垂直 於该圖紙之表面之方向延伸。 該脊80a之寬度設定為400//m，而高度設定為35 200532171 或更向。該體波反射之方向藉由變化該脊⑽&間之 :隔加以變更。在本具體實施例中，該脊80a形成具有 =表面聲波直接產生於該脊•旁之間隔。該轉換器 以r 加絲賴模式轉換元件⑽之基板側上，且 乂大干枓電連接至FPC分支4b。 由元C轉換元件78、82及84為相同構造。其中， 轉換由：二f:代表之杈式轉換元件(聲波產生裝置) 該模與10產生之體波至表面聲波。 j杈式轉換兀件82與84轉換已沿 傳播之表面聲波回體波。 料基板2之則表面 (體^。轉5.5MHz之頻率產生超音波振動 V篮友）。δ亥超音波振動自其後表面旅絲 800 射）之表面聲波。由動脊術傳播（反 射二，二=== 傳播，直到其到達該向内傾斜線26為止。 波不元件78與80轉換至表面聲波之體 8〇之所^以來自該模式轉換元件78與 轉換哭12盥'4 右该未轉換體波之一部分傳送至該 此之ΐ，料賴礙主要㈣檢狀偽波。除 脊之：方轉換元件78與80構成以垂直於其 方向產生°。H已知該微表面聲波以非預期 偽波ΐ、=ΐΐ面聲波亦可變成妨礙主要信號檢測之 右4偽波到達轉換器Μ，於此產生噪音 反射到達該反射陣列28之表面聲波，藉此朝向該 200532171 f，換7L件84傳播。到達該模式轉換元件84之表面 卓波藉此轉換為體波。該已轉換體波傳送至該基板2之 後表面上之轉換器14，其感測與轉換其振動至電子信 號。 σ ^ j類似方式，由該轉換器8產生之超音波振動（體波) =該模式轉換元件78轉換至表面聲波。接著，該表面 耸波經由該反射陣列18與該反射陣列22到達該模式轉 換兀件82。該表面聲波由該模式轉換元件82轉換為體 波’傳送至將其感測與轉換至電子信號之轉換器14。 如此一來，該表面聲波跨由該反射陣列18、22、28 及32覆蓋之基板2之前表面之整個區域傳播。因此， 若手指（物件）接觸（觸控）此區域中之基板2，由該手指阻 滯之表面聲波會消失或被弱化。伴隨該表面聲波中變更 之信號變更自作用如同感測器之轉換器12與14傳送至 其連接之控制器6之計時電路。該控制器6決定由該手 指觸控之位置之幾何座標。 該表面聲波由該反射陣列33之各傾斜線16、2〇、 26及30反射。到達各傾斜線之〇 5%至1%之表面聲波 藉此反射。剩餘者穿透且傳送至該相鄰傾斜線，使得所 有傾斜線接著反射該表面聲波。 用以藉由漫射偽波降低噪音之偽波散射裝置，亦即 漫射光柵，形成於該裝置1之基板2之前表面上。該漫 射光柵包含第一圖中由元件符號34、36及38所代表之 矩形部、由傾斜線40與42沿著該上邊緣24形成之漫 射光柵43、及由傾斜線46與48沿著該橫向邊緣44形 成之漫射光柵49。該傾斜線40、42、46及48構成第二 反射陣列，具有不同於該反射陣列18、22、28及32之 200532171 功能。該第二 38中（參照第 二反射陣列亦提供於該漫射光柵34、36 參照第七圖卜該漫射光柵34、36、38、43及的 之細節將在稍後說明。注意該漫射光柵將統稱為漫射光 ，下來，黏著附加至該基板2之FPC 4將參照第二 圖弟一圖及第四圖說明。第二圖係前視圖，顯示附加 至該基板2之FPC 4。雖然該FPC 4黏著附加至該基板 2之後表面，為了方便的目的以實線繪製。注意該反射 陣列33與漫射光柵5〇從第二圖省略。第三圖係概略平 面圖，顯示該FPC 4之整體。第四圖係由第三圖 指之FPC 4部分之敌大圖。該fpc 4如第三圖與第四圖 中所示對應至自第二圖之基板2之後表面檢視之狀態。 分別對應至該轉換器（感測器）12與14之電極52與 54提供於該FPC 4之_端，如第三圖與第四圖所示。該 電極52與54自上方藉由焊接導電膠，例如銀膏或各^ 異性導電膠連接至該轉換器12與14。亦即，該轉換器 12與14放置於該FpC 4與該基板2之後表面之間。該 FPC 4由述FPC分支4a與4b及用以連接該控制器6 之連接線4c構成。200532171 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a sonic contact detection penetrating touch panel. , J clothing, such as an ultrasonic wave [prior art] ϊΐ ϊΐ sound wave contact inspection county is now widely used. Dou An For contact with I printers and financial institutions. These sound waves = 二 = _ 奂 二 Contains a shaper provided by a glass or the like that acts like νίί (piezoelectric element). The fingers of these conversion panels are scattered and detected by touching the touch switch and the control circuit to be insulated; cover = wire = circuit turn. However, the periphery of the substrate is charged by the aperture and the like due to space shortage It is difficult to configure this wiring. In the case of "Ί 之 h", there have been cases where flat cables have been used, for example (FPC) 'As disclosed in the Japanese without requesting review: J 6 (1994) _324792 (page 5, ninth figure). Moon A boiling water brush on the flexible board. C is the circuit printed. In the case of the connection substrate of the FPC application, it enters the signal circuit formed on the FPC (signal cloth = wave = outside, there is a problem that electromagnetic waves radiate from the signal wiring to the exhibition). The reason for this is because the signal wiring that constitutes the FPC makes complex = two to the outside. In the case where this FPC is applied to Japanese Unrequested Case No. 6-324792, the month A that is larger than the Fpr II is opened 171 ^ ~ Cong Tian a η, Fen-Sister from ^ 6 spoons to cover the electrode cover 5 Mysterious FPC acts like a 'concrete member'. However, this structure increases the cost of the device by 200532171 pieces. SUMMARY OF THE INVENTION The present invention has been developed in view of the above points. The object of the present invention is to provide a wave contact detection device with anti-electromagnetic interference (EMI) properties at a low cost. The acoustic wave contact detection device of the present invention comprises: a substrate having a surface along which sound waves propagate; a sound wave generating device; a reflection array for causing the generated sound waves to propagate along the surface of the substrate; and a detector for detecting A change in sound waves caused by an object contacting the surface of the substrate; and a control to determine the geometric coordinates of the object; one of the aforementioned sound wave generating device and the aforementioned detector: at least one of the aforementioned: a flexible planar wiring connected to the control And the aforementioned flexible planar wiring is provided on at least one side of the signal cloth shape, and a wiring pattern is provided. The winding planar wiring may include: a signal wiring group in which a plurality of signal wirings are arranged; and ground wirings on both sides of the signal wiring group. In addition to surface acoustic waves propagating on the surface of the substrate, the acoustic waves include ultrasonic waves that propagate along the surface of the thin substrate. The side-wave generating device may include a mode conversion element and an ultrasonic oscillator. The mode conversion element may be constituted by a plurality of parallel ridges integrated with the substrate. The detection unit can be a converter. The converter may be in a form in which the surface after the substrate is attached. Alternatively, the rotation-correction n-shape change 200532171 converter has an adhesive attached to one end of the triangular ridge, and an adhesive attached to the front surface of the substrate. The flexible planar wiring includes an FPC and a flexible flat cable (FFC). Two-wire wiring can take advantage of other options for this flexible planar wiring. In the acoustic wave contact detection device of the present invention, at least one of the acoustic wave generation device and the detector is connected to the controller by a flexible planar wiring. The flexible planar wiring is a wiring pattern in which a ground wiring is provided on at least one side of a signal wiring. Therefore, the signal wiring is electromagnetically shielded by the ground wiring to improve the EMI resistance of the acoustic contact detection device. In addition, when an additional shielding structure needs to be avoided, the cost of the device is reduced. In addition, a configuration may be adopted in which the flexible planar wiring includes a plurality of signal wirings arranged in one of the signal wiring groups; and the ground wiring is located on both sides of the signal wiring group. In this case, the signal wiring group allows aggregation and effective shielding 'to further improve the anti-EMI property. This configuration also allows the flexible planar wiring to be reduced. When the cost of FPC is substantially proportional to its districts, the reduction of FPC further contributes to reducing its cost. [Embodiment] A specific embodiment of a sonic contact detection device (hereinafter referred to as "device") will be described with reference to the drawings. The first figure is a front view of the touch panel 3 to be used in the device 1. As shown in the first figure, the touch panel 3 includes: a substrate 2 formed of a rectangular glass plate; a flexible printed circuit 4 (FPC) split on the substrate 2; and a controller electrically connected to the FPC 4 6. The FPC 4 branches into the FPC branch 4a and the FPC branch 4b. 200532171 The H & C branch 4a extends along the horizontal direction of the substrate 2, that is, the X-axis direction indicated by the arrow X. The FPC branch 4b extends along the vertical direction of the substrate perpendicular to the X-axis, that is, the Y-axis direction indicated by the arrow γ. A converter (body wave generating device and Η) for generating ultrasonic waves is mounted on the FPC 4. In addition, the converters (detectors) 12 and 14 are mounted on this unit. The center angle ° A reflection array 18 containing a large number of inclined lines 16 is formed near a lateral edge 44 along the Y axis on the front surface of the substrate 2. A reflective array 22 containing a large number of oblique lines 20 is formed facing the reflective array 18 at the other loose edge 44 of the substrate. A reflection array 28 containing a large number of inclined lines 26 is formed along the x-axis near the upper edge 24 of the substrate 2. A reflective array 32 including a large number of inclined lines 30 is formed near the lower edge 45 of the six-dimensional substrate facing the reflective array 28. The patterns of these reflective arrays 1 $, 22, 28, and 32 are disclosed in Japanese Unexamined Invention Publication Nos. 61 (1986) -239322 and 2001-14094. Note that the reflection arrays 18, 22, 28, and 32 will be collectively referred to as the reflection array 33. The reflection array 33 reflects an acoustic wave 'and causes it to propagate along the front surface of the substrate 2. The converters 8, 10, 12 and 14 are adhered to the rear surface of the substrate 2. The mode conversion elements 78, 80, 82, and 84 (gratings) are formed on the front surface of the substrate 2 at positions corresponding to the converters 8, 10, 12, and 14, respectively. This configuration will be described with reference to the eleventh figure, and the mode conversion element 80 is taken as an example. The eleventh figure is an enlarged view of a schematic part of the substrate 2, viewed from the direction of arrow A. The mode conversion device 80 in FIG. 11 is formed on the substrate 2 by sintered glass paste, and includes a plurality of parallel ridges 80a. The ridge 80a shown in the eleventh figure extends in a direction perpendicular to the surface of the drawing. The width of the ridge 80a is set to 400 // m, and the height is set to 35 200532171 or more. The direction of the body wave reflection is changed by changing the interval between the ridges &. In this specific embodiment, the ridge 80a is formed to have a surface acoustic wave directly generated at the interval between the ridge and the side. This converter is on the substrate side of the R-plus-Si mode conversion element and is electrically connected to the FPC branch 4b. The element C conversion elements 78, 82, and 84 have the same structure. Among them, the conversion is: two f: representative branch-type conversion element (acoustic wave generating device), the body wave generated by the mode and 10 to surface acoustic wave. The j-shaped conversion elements 82 and 84 convert surface acoustic waves that have propagated back into body waves. The surface of the substrate 2 (body ^. Ultrasonic vibration is generated at a frequency of 5.5MHz). δHydraulic vibrations are emitted from the rear surface traveling wire 800) surface acoustic waves. Spine propagation (reflection II, II === propagates until it reaches the inwardly inclined line 26. The wave elements 78 and 80 are converted to the surface acoustic wave body 80 where the ^ is from the mode conversion element 78 The 12 part of the unconverted body wave is transmitted to this place with the converted cry 12. It is expected that the main examination-like pseudo wave is hindered. In addition to the ridge: the square conversion elements 78 and 80 are formed to produce a perpendicular to the direction. H. It is known that the micro-surface acoustic wave can be converted into a right 4 pseudo-wave which hinders the detection of the main signal from reaching the converter M with an unintended pseudo wave ΐΐ, and the surface acoustic wave, In this way, towards the 200532171 f, change the 7L piece 84 to propagate. The surface droop that reaches the mode conversion element 84 is thereby converted into a body wave. The converted body wave is transmitted to the converter 14 on the surface behind the substrate 2 and its sense Measure and convert its vibration to an electronic signal. Σ ^ j In a similar manner, the ultrasonic vibration (bulk wave) generated by the converter 8 = the mode conversion element 78 is converted into a surface acoustic wave. Then, the surface wave passes through the reflection array. 18 arrives with the reflection array 22 The mode conversion element 82. The surface acoustic wave is converted by the mode conversion element 82 into a body wave and transmitted to a converter 14 that senses and converts it to an electronic signal. In this way, the surface acoustic wave is transmitted across the reflection array 18, The entire area of the front surface of the substrate 2 covered by 22, 28, and 32 spreads. Therefore, if a finger (object) contacts (touches) the substrate 2 in this area, the surface acoustic wave blocked by the finger will disappear or be weakened. The changed signal in the surface acoustic wave changes from the timing circuit which acts like the transducers 12 and 14 of the sensor to its connected controller 6. The controller 6 determines the geometric coordinates of the position touched by the finger. The surface The sound waves are reflected by each of the inclined lines 16, 20, 26, and 30 of the reflection array 33. Surface acoustic waves that reach 0 to 1% of each inclined line are thereby reflected. The remaining ones penetrate and transmit to the adjacent inclined line So that all the oblique lines then reflect the surface acoustic wave. A pseudo wave scattering device for reducing noise by diffusing pseudo waves, that is, a diffusion grating, is formed on the front surface of the substrate 2 of the device 1. The diffusion grating contains In the first figure, the rectangular portion represented by the component symbols 34, 36, and 38, the diffusion grating 43 formed by the inclined lines 40 and 42 along the upper edge 24, and the lateral edge 44 by the inclined lines 46 and 48. A diffused grating 49 is formed. The oblique lines 40, 42, 46, and 48 constitute a second reflection array and have functions different from 200532171 of the reflection arrays 18, 22, 28, and 32. In the second 38 (refer to the second reflection The array is also provided in the diffusion gratings 34, 36. Refer to the seventh figure for details of the diffusion gratings 34, 36, 38, 43 and 43. Note that the diffusion gratings will be collectively referred to as diffused light. The FPC 4 attached to the substrate 2 will be described with reference to the second figure and the fourth figure. The second figure is a front view showing the FPC 4 attached to the substrate 2. Although the FPC 4 is adhered to the rear surface of the substrate 2, it is drawn with a solid line for the sake of convenience. Note that the reflection array 33 and the diffusion grating 50 are omitted from the second figure. The third figure is a schematic plan view showing the whole of the FPC 4. The fourth picture is the enemy picture of the FPC 4 part referred to by the third picture. The fpc 4 corresponds to the state viewed from the surface of the substrate 2 after the second figure as shown in the third and fourth figures. The electrodes 52 and 54 corresponding to the converters (sensors) 12 and 14 are provided at the _ terminal of the FPC 4, as shown in the third and fourth figures. The electrodes 52 and 54 are connected to the converters 12 and 14 from above by soldering a conductive paste, such as silver paste or anisotropic conductive paste. That is, the converters 12 and 14 are placed between the FpC 4 and the rear surface of the substrate 2. The FPC 4 is composed of the FPC branches 4a and 4b and a connection line 4c for connecting the controller 6.
該連接線4c與該FPC分支4a為相同長度 形成為-頻帶⑻”三穿孔56形成 200532171 如第四圖所示，連接線4c之印刷佈線64包含十個 印刷佈線 64a、64b、64c、64d、64e、64f、64g、64h、 64i及64j。信號佈線群由連接至該轉換器（感測器）12與 14之四個印刷佈線（信號接受佈線)64d、64e、64f及64g 構成。在此重要的是接地佈線64c與64h提供於該信號 佈線群之任一側。 埂接至傳送轉換器8與1〇之信號佈線64b與64 分別提供相鄰於該接地佈線64c與64h。此外，接地佈 線64a與64j分別提供相鄰於其外側上之信號佈線6处 與64i。此構造導致分別由該接地佈線 t信號接受佈線64d、6一及64g、及由 線6乜及6½與該接地佈線64h及64j環_ =4b與64i遮蔽所有信號佈線。此關係“。=The connecting line 4c is the same length as the FPC branch 4a and is formed as a -band ⑻ "three perforation 56 to form 200532171. As shown in the fourth figure, the printed wiring 64 of the connecting line 4c includes ten printed wirings 64a, 64b, 64c, 64d, 64e, 64f, 64g, 64h, 64i, and 64j. The signal wiring group is composed of four printed wirings (signal receiving wirings) 64d, 64e, 64f, and 64g connected to the converters (sensors) 12 and 14. Here, It is important that the ground wirings 64c and 64h are provided on either side of the signal wiring group. (The signal wirings 64b and 64 connected to the transmission converters 8 and 10 are provided adjacent to the ground wirings 64c and 64h, respectively. In addition, the ground Wirings 64a and 64j respectively provide signal wirings 6 and 64i adjacent to the outside thereof. This configuration results in signal receiving wirings 64d, 6i, and 64g by the ground wiring t, and wirings 6 乜 and 6½ with the ground wiring, respectively. 64h and 64j rings _ = 4b and 64i shield all signal wiring. This relationship ". =
Ilf 6? t ° # ^ ^^ ^ 64b > 64d > 64e、64f、64g及64i組成之信號佈線 電磁波影響。於此同時，亦町獲得電 ϋ此被外部 該外部輻射之效果。上述構造特別，不太可能朝向 沿著該基板2延伸一長距離之情況中^改良°亥FpC 4 ^ r之抗EMI性皙。 注思该FPC分支4b之彎曲綠於證 一、 號66與砧代表。該FPC分支4b以四，中由元件符 表面之方向沿著彎曲線66彎曲。接著，向第四圖之圖紙 以遠離第四圖之圖紙表面之方向沿著織该FPC分支4b 曲，使得該電極62(參照第三圖）面對^ ，68逆向彎Ilf 6? T ° # ^ ^^ ^ 64b > 64d > Signal wiring consisting of 64e, 64f, 64g and 64i Electromagnetic wave influence. At the same time, Ichimachi gained the effect of electricity being radiated from the outside. The above-mentioned structure is special, and it is unlikely to be oriented toward a case where it extends a long distance along the substrate 2 ^ Improved EMI resistance of FpC 4 ^ r. Note that the curved green of the FPC branch 4b is represented by the card No. 66 and the anvil. The FPC branch 4b is bent along the bending line 66 in the direction of the middle part of the symbol. Next, weave the FPC branch 4b in a direction away from the drawing surface of the fourth drawing toward the drawing of the fourth drawing, so that the electrode 62 (refer to the third drawing) faces ^, 68 and bends backward
曲部於第二圖中由元件符號6 9代表。^換f + 1 〇 °該f 分支4b沿著該基板2之橫向邊緣44配b。來二:亥FPC 4由黏著劑（未顯示）之類固定至該基板$。 ’主心。亥FPC 接下來，將參照第五圖說明該反射陣列33之配置。 200532171 第五圖係該反射陣列33之前視圖，對應至第一圖。用 以散射偽波之漫射光栅34、36、38等等自第五圖省略。 該反射陣列18、22、28及32之各傾斜線16、20、26 及30於45。角傾斜。該傾斜線16、20、26及30配置以 朝向跨該基板2面對它們的反射陣列反射表面聲波。該 反射陣列33藉由印刷已經形成的鉛玻璃之微細粒子至 網版印刷等等之基板2之前表面上之糊狀物中，接著於 約500°C燒结加以形成。注意該基板2之角落部分顯示 於第五圖中，由元件符號25代表。或者，一 UV可醫治 有機墨或使金屬粒子作為填充加入其中以改良其反射 性質之有機墨可利用為該反射陣列之材料。 該傾斜線16、20、26及30間之區間減少，亦即該 傾斜線以更高密度配置，其離該傳送側轉換器8與10 更遠。這是由於當穿透該該傾斜線16、20、26及30時， 該表面聲波之強度變弱。因此，採用上述構造以補償該 弱化，以沿著該基板2之前表面均勻傳播該表面聲波變 為必要。注意該反射陣列22與28分別自該基板之上邊 緣24與該橫向邊緣44(參照第一圖）稍微向内提供。這使 得稍後將說明的漫射光柵50之傾斜線40、42、46及48 可提供於反射陣列22與28之外側。 接下來，將參照第六圖說明作用如同一偽波散射裝 置之漫射光柵50。第六圖係對應至第一圖顯示該漫射光 柵50以及該模式轉換元件78、80、82及84之前視圖。 組成該第二反射陣列之傾斜線40與42互相相關形成於 該基板2之上邊緣24附近之相對角處。該傾斜線之角 度使得其近似垂直朝向該基板2之中央部份，且逐漸減 少朝向其邊緣。以一類似方式，組成該第二反射陣列之 13 200532171 其它傾斜線46與48互相相關以逐漸變更角度形成於相 對角處。這使得偽波不以相同方向反射，而是漫射。 該傾斜線40、42、46、與48放置於帶之類黏著至 傳統觸控面板處之區域。亦即說，該傾斜線40、42、46、 與48形成以取代傳統觸控面板之帶。到達這些區域之 偽波由該傾斜線40、42、46、與48漫射反射，使得其 不傳播至該轉換器（感測器）12與14。超音波振動能量之 弱化率根據該超音波之頻率、該振動模式及玻璃型態而 異。於頻率5·5ΜΗζ之表面聲波之強度於沿著由鹼石灰 鲁 玻璃形成之典型基板2傳播4〇cm後弱化為1/1〇其原始 強度。因此，该没射反射偽波於其跨該基板2反射時快 速弱化且消失。 傾斜於45°或-45。外之其他角度之複數個分離脊，亦 即傾斜線，形成於矩形漫射光栅34、36及38處。該脊 之形狀將參照第七圖與第八圖說明。第七圖係該漫射光 柵36與該反射陣列33之部分放大圖。第八圖係該漫射 光柵38與該反射陣列33之部分放大圖。清楚顯示於第 七圖中該漫射光柵36之傾斜線36a之角度不同於該反射 麵 陣列18與32。同樣的，第八圖清楚顯示由陡傾斜線38a 組成之漫射光柵38。 這些漫射光栅36與38亦作用以漫射反射於45°或 -45°外之其他角度朝向外部沿著該基板2之前表面傳播 之偽波。雖然未詳細例示，該漫射光柵34佔用一類似 結構與功能。該傾斜線36a與38a可為平行或於個別漫 射光柵36與38中逐漸變更角度。該漫射光柵34與38 亦作用以阻滯以一預定方向之外之其他方向傳播之表 面聲波之路徑，使得其不到達該轉換器（感測器）Π與14。 14 200532171 该沒射光拇5 〇猎由錯玻璃粒子形成於糊狀物中印 刷於該基板2上，以與該反射陣列33相同之方式。因 此，該漫射光柵50可於該反射陣列33形成之同時印 刷。這會改良生產力與降低製造成本。 該漫射光柵36與38之傾斜線36a與38a形成為複 數個脊。然而’該漫射光柵並不限於由脊形成，且各種 修改為可能。該〉哭射光拇之另一構造顯示於第九圖中。 第九圖係該漫射光柵之另一形式之放大圖。此漫射光柵 51由平面圖中鑽石形之大量突出部51a構成。到達該漫 馨 射光栅51之偽波於該區域中重複由突出部51 a反射該時 弱化藉此形成。該突出部之形狀不限於鑽石形，且可為 任何想要的形狀，例如矩形、三角形、其他多邊形、或 橢圓形。 第十圖係顯示形成於基板2之前表面上之漫射光柵 50與反射陣列33之相對位置之前視圖。第十圖清楚顯 示該傾斜線40與42位於該反射陣列28外及該傾斜線 46與48位於該反射陣列22外。放置該漫射光柵34、 36及38 ’使得穿透該反射陣列33而無反射之表面聲波 馨 以不同於該反射陣列33反射它們的方向反射。 舉例而言，尤其由該轉換器8與該模式轉換元件78 產生之表面聲波當穿透時由該反射陣列18朝向該反射 陣列22反射。不由該反射陣列is反射之表面聲波到達 漫射光柵36。如第七圖所示，該漫射光柵36作用以朝 向該基板2外側反射表面聲波。亦即說，該漫射光栅36 以主要方向之相對方向反射該表面聲波，使得會導致噪 音的超音波振動不會到達該轉換器（感測器）12。 沿著該基板2之邊緣形成之傾斜線40、42、46及 15 200532171 48構成以漫射反射與弱化沿著該基板2之前表面傳播之 體波。一般而言，體波由该模式轉換元件78與80轉換 至表面聲波。然而，並非100%轉換的體波以其預定方 向外的其他方向傳播。因此，該傾斜線40、42、46及 48利用以弱化這些偽體波。 除此之外，表面聲波於由該模式轉換元件78與80 轉換後以其預定方向外的其他方向傳播。該傾斜線40、 42、46及48亦漫射反射這些雜散表面聲波，使得其以 各種方向散射。偽超音波振動到達該轉換器（感測器）12 與14以導致噪音之危險由此漫射反射降低。 海豚圖片82印刷於第十圖中該傾斜線40與42之 間’也於該傾斜線46與48之間。該圖片82亦有效降 低噪音。該圖片82具有彎曲的輪廓。到達該圖片82輪 廟的體波或雜散表面聲波以各種方向反射與弱化。只要 其輪靡以彎曲線形成，或其角度導致偽波漫射反射至各 種方向’可應用任何圖片。或者，可印刷圖案於這些部 分的基板2上。 接下來，將參照第十二圖說明本發明之裝置之第二 鲁 具體貫施例。第十二圖係一傾斜表面形成於玻璃基板之 邊、’豪且一轉換器裝設於傾斜表面上之觸控面板之部分 放大圖。面向上傾斜表面94沿著此第二具體實施例之 觸控92之基板90邊緣之整個長度形成，對應至前 一具體貫施例之上邊緣24與橫向邊緣44。橫剖面為三 角形之轉換器98(楔形轉換器）黏著附加至該傾斜表面 94 °FPC 96黏著附加至該基板90之後表面90a。FPC 96 之部分96a向外延伸，且經由電極99連接至該轉換器 98 °注意在苐十二圖中，元件符號97代表為該轉換器 16 200532171 =二:匕，壓電元件。該轉換器、98 1為傳送轉換器或 =:、态。除此之外，該FPC 96或者可供於傾 表面94上。 哭〇在此第^具體實施例之觸控面板92中，在該轉換 二^為傳送轉換器之情況中，藉此產生之超音波振動 =者该傾斜表面94，接著沿著該基板9〇之前表面90b 二士傳播，如箭頭95所指。沿著該前表面9〇b傳播之 ^曰波藉=接觸手指之類變更。該變更之檢測與該觸控 置以與前一具體實施例相同之方式決定。在第十二圖 鲁 例示的具體實施例中，該轉換器98提供於該基板90 ^傾，表面94上。因此，該轉換器98不會自該基板90 1出部，且容易適應於聚光圈中，即使該基板9()之週 邊由聚光圈之類覆蓋。 壯接下來’將參照第十三圖至第十五圖說明本發明之 =置之第三具體實施例。該裝置之第三具體實施例應用 桃性扁平電纜（以下簡稱為「FFC」）於其觸控面板103 ^ °、/主意與該第一具體實施例相同之部分以相同元件符 唬代表。第十三圖係附加至該基板2之FFC 1〇〇之前視 _ 圖第十四圖係第十三圖之FFC 100之部分放大圖。第 十五圖係該FFC 100之概略放大剖面圖。如第十五圖中 =示二該FFC 100包含三個扁平線性導體。該三個扁平 …性導體係兩個實質上平行之信號佈線1〇4與1〇4及提 ，於该兩個信號佈線104之間實質平行於此之接地佈線 02。该信號佈線104與該接地佈線1〇2由扁平絕緣體 %後盍，藉此互相絕緣。藉由此構造，該信號佈線1〇4 由該接地佈線102遮蔽。 邊絕緣體106之外部周圍係由導電膜1〇8例如鍍銅 17 200532171 f ^，其經由—連接部l〇8a電連接至該接地佈線102。 糟$構造，除了該接地佈線102之外，兩個信號佈線 / 联iU8遮敝進一步改良該抗EMI性質。該膜108 係由了絕緣外部覆蓋110覆蓋且保護。 以=個方式構成的兩個FFC 1〇〇利用於該基板2 上如第十二圖與第十四圖所示。亦即，FFC 100a提供 於，基板2之上邊緣24處，而FFC 1〇〇b提供於該橫向 邊緣44處。該抒匸l〇〇a與該FFC 100b經由剛性電路 板112連接。電氣連接器ι14裝設於該剛性電路板Μ〕 上。该電氣連接器114作用以建立與該控制器6之電氣 連接’經由虛線部分所示之卯。100。該FFC 100b之方 向藉由自該橫向邊緣44朝向該上邊緣24摺疊而變更。 該轉換器12與14經由導體116與116連接至該剛性電 路板112。該轉換器8與10分別藉由焊接電連接至該 FFC 100a與100b之遠端。該FFC 100、該轉換器8、10、 12、14、以及该剛性電路板112黏著附加至該基板2。 注意該剛性電路板112可由FPC取代。用以連接該電氣 連接器114之佈線與連接器6不限於該FFC 100。或者 可應用FPC、雙線佈線(稍後將說明）、或第十五圖所示 之導電膜108與該絕緣外部覆蓋110自此移除之FFC， 亦即包含該接地佈線102、該信號佈線1〇4及該絕緣體 106 之 FFC。 接下來’將參照弟十六圖至第十八圖說明本發明之 裝置之第四具體實施例。該第四具體實施例之觸控面板 133利用FFC之另一形式。第十六圖至第十八圖分別對 應至第十三圖至第十五圖。第十六圖係附加至該基板之 FFC 130之前視圖。第十七圖係第十六圖之FFC 130之 18 200532171 部分放大圖。第十八圖係第十六圖之FFC 130之概略放 大剖面圖。如第十八圖中所示，該FFC 130包含兩扁平 導體。該兩扁平導體係信號佈線132與接地佈線134， 互相平行配置。該信號佈線132與該接地佈線134之週 邊係由絕緣體136覆蓋。該絕緣體136進一步由外部覆 蓋138覆蓋，雖然此外部覆蓋138並非永遠必要。在此 具體實施例中，第十三圖至第十五圖顯示之前一具體實 施例之膜108被省略。然而，該信號佈線132係於其由 該接地佈線134遮蔽之狀態中。 該FFC 130包含黏著附加於該基板2之上邊緣24 之FFC 130a及黏著附加於該橫向邊緣44之FFC 130b。 該FFC 130a及該FFC 130b經由剛性電路板14〇電氣連 接。該剛性電路板140包含沿著該上邊緣24之主體140a 及朝向該橫向邊緣44之臂部140b。該FFC 130a藉由焊 接連接至該主體140a。該FFC 130b連接至該臂部140b。 該轉換器12與14分別經由FFC 130c與FFC 130d電氣 連接至該剛性電路板140。用以經由FFc 130連接該剛 性電路板140與該控制器6之連接器142裝設於該剛性 電路板140上。注意FFC 130僅部分由虛線顯示於第十 七圖中，且该控制态6被省略。注意該剛性電路板工 可由FPC取代。用以連接該電氣連接器142至該剛性電 路板之佈線可為FPC或雙線佈線，如對該FFC 13〇 代品。 一 在第十三圖至第十八圖中顯示之第三與第四具體 實施例中，僅小片段剛性電路板112與14〇或Fpc為必 要。因此，促進材料之保存，改良可用性與降低成本\ 因此，為泫佈線長度部分結合應用便宜FFC的效果，可 19 200532171 全面降低根據該第三與第四具體實施例之裝置之成 本。在應用該剛性電路板112與140之情況中，需要分 離導體例如該FFC 130，以連接至該轉換器8、1〇、12 及14。然而，在該剛性電路板ι12與14〇由Fpc取代 之情況中，該轉換器8、10、12及14可直接焊接於其 Ji ° … 具有極小橫剖面區域之佈線，例如AWG4〇(直徑約 0.5mm)，亦即雙線佈線，可利用於取代該FFc 1()〇與 130。該雙線佈線為包含一對扭轉或平行導體且互相絕 緣之單線佈線。當其直徑極小時，該雙線佈線不會大大 犬出邛，即使其提供於該基板2之表面上。該雙線佈線 之導體對包含互相相鄰之信號佈線與接地佈線。藉此， 由此結構獲得遮蔽效果。 已於上方詳細說明本發明之具體實施例。然而，本 鲞明不限於箣述具體實施例。舉例而言，該漫射光栅5〇 可藉由蝕刻氫氟酸形成。該漫射光柵50亦可藉由一化 學或物理移除過程應用雷射、噴砂 '或切割形成。換言 之，该漫射光栅50可由溝渠取代突出部形成。 在前述第一、第三及第四具體實施例中，已說明應 用具有模式轉換元件78、80、82、與84稱為「光柵型 怨」之表面聲波產生裝置之情況。然而，本發明並不限 於應用此型態之表面聲波產生裝置之裝置。舉例而言， 本發明可應用至藉由利用壓克力柱如第十二圖中所示 之模形轉換器產生表面聲波之聲波接觸檢測裝置。本發 明亦可應用至應用形成於超音波振動器上之一對梳狀 電極’而無光柵或楔之聲波接觸檢測裝置。在此情況 中’超音波振動以該超音波振動器之邊緣方向，而非其 20 200532171 厚度方向傳送。因此，該超音波振動器可提供於與該模 式轉換元件78、80、82及84相同之表面上。 利用於本發明中之FPC 4可以任何想要的黏著劑黏 著附加至該基板2。然而，最好壓電振動器使用紫外線 固化黏著劑黏著附加。這允許該轉換器8、10、12及14 之位置關於該模式轉換元件78、80、82及84調整，以 確認導致黏著之紫外線之照射前表面聲波之最佳產生。 該偽波散射裝置可為導致漫射反射與弱化之型 態，如上所述。注意兩個轉換器（感測器）12與14於上述 籲 具體實施例中提供於互相接近處。然而，該轉換器（感測 器）12與14可與該傳送轉換器8與10切換位置，使得 其互相分離放置。在此情況中，當表面聲波自該轉換器 12與14漏出，而另一個轉換器14與12不在其附近時， 會抑制由另一轉換器拾取的噪音。除此之外，可減少自 控制器6至該傳送轉換器8與10之電子路徑。因此， 可抑制來自該電子路徑之偽輻射，亦即電磁波的發射。The curved part is represented by the component symbol 69 in the second figure. ^ F + 10 °. The f branch 4b is aligned with b along the lateral edge 44 of the substrate 2. Second: Hai FPC 4 is fixed to the substrate by an adhesive (not shown) or the like. ‘Spirit. FPC Next, the configuration of the reflection array 33 will be described with reference to the fifth figure. 200532171 The fifth figure is a front view of the reflection array 33, and corresponds to the first figure. Diffuse gratings 34, 36, 38, etc. for scattering pseudo waves are omitted from the fifth figure. Each of the reflection arrays 18, 22, 28, and 32 has inclined lines 16, 20, 26, and 30 at 45. Angle tilt. The oblique lines 16, 20, 26, and 30 are arranged to reflect surface acoustic waves toward a reflection array facing them across the substrate 2. The reflection array 33 is formed by printing fine particles of lead glass that has been formed into a paste on the front surface of the substrate 2 such as screen printing, and then sintering at about 500 ° C. Note that the corner portion of the substrate 2 is shown in the fifth figure and is represented by the element symbol 25. Alternatively, a UV-curable organic ink or an organic ink in which metal particles are added as a filler to improve its reflection properties may be used as the material of the reflection array. The interval between the oblique lines 16, 20, 26, and 30 decreases, that is, the oblique lines are arranged at a higher density, which is farther from the transfer-side converters 8 and 10. This is because when the inclined lines 16, 20, 26, and 30 are penetrated, the intensity of the surface acoustic wave becomes weak. Therefore, it becomes necessary to adopt the above-mentioned configuration to compensate for the weakening so as to uniformly propagate the surface acoustic wave along the front surface of the substrate 2. Note that the reflective arrays 22 and 28 are provided slightly inward from the upper edge 24 and the lateral edge 44 (refer to the first figure) of the substrate, respectively. This allows the tilt lines 40, 42, 46, and 48 of the diffusion grating 50 to be described later to be provided on the outside of the reflection arrays 22 and 28. Next, a diffusion grating 50 that functions as the same pseudo wave scattering device will be described with reference to the sixth figure. The sixth figure corresponds to the first figure and shows the front view of the diffuser grid 50 and the mode conversion elements 78, 80, 82, and 84. The oblique lines 40 and 42 constituting the second reflection array are formed in correlation with each other at opposite corners near the upper edge 24 of the substrate 2. The angle of the oblique line makes it approximately perpendicular to the central portion of the substrate 2 and gradually decreases toward its edges. In a similar manner, the 13 200532171 other oblique lines 46 and 48 that make up the second reflective array are related to each other to gradually change the angle formed at opposite corners. This makes the pseudo waves not reflect in the same direction but diffuse. The oblique lines 40, 42, 46, and 48 are placed in a region such as a tape adhered to a conventional touch panel. That is, the inclined lines 40, 42, 46, and 48 are formed to replace the belts of the conventional touch panel. The pseudo waves reaching these areas are diffusely reflected by the oblique lines 40, 42, 46, and 48 so that they do not propagate to the converters (sensors) 12 and 14. The attenuation rate of the ultrasonic vibration energy varies according to the frequency of the ultrasonic wave, the vibration mode, and the glass type. The intensity of the surface acoustic wave at a frequency of 5 · 5 ΜΗζ was weakened to 1/10 of its original intensity after traveling 40 cm along a typical substrate 2 formed of soda lime glass. Therefore, the unreflected reflection pseudo wave quickly weakens and disappears when it is reflected across the substrate 2. Tilt at 45 ° or -45. A plurality of separate ridges at other angles, that is, oblique lines, are formed at the rectangular diffusion gratings 34, 36, and 38. The shape of the ridge will be described with reference to the seventh and eighth figures. The seventh figure is an enlarged view of a part of the diffused light grid 36 and the reflective array 33. The eighth figure is an enlarged view of a part of the diffusion grating 38 and the reflection array 33. The angle of the inclined line 36a of the diffusion grating 36 clearly shown in the seventh figure is different from that of the reflecting surface arrays 18 and 32. Similarly, the eighth figure clearly shows the diffusion grating 38 composed of steeply inclined lines 38a. These diffusion gratings 36 and 38 also act as pseudo waves propagating along the front surface of the substrate 2 toward the outside at angles diffusely reflected outside 45 ° or -45 °. Although not illustrated in detail, the diffusion grating 34 occupies a similar structure and function. The oblique lines 36a and 38a may be parallel or gradually change the angle in the respective diffusion gratings 36 and 38. The diffusion gratings 34 and 38 also function to block the path of the surface acoustic wave propagating in a direction other than a predetermined direction so that it does not reach the converters (sensors) Π and 14. 14 200532171 The non-luminous thumb 50 is formed from the wrong glass particles and printed on the substrate 2 in the same manner as the reflective array 33. Therefore, the diffusion grating 50 can be printed at the same time as the reflection array 33 is formed. This will improve productivity and reduce manufacturing costs. The inclined lines 36a and 38a of the diffusion gratings 36 and 38 are formed as a plurality of ridges. However, the diffusion grating is not limited to being formed by ridges, and various modifications are possible. The other structure of the crying light is shown in the ninth figure. The ninth figure is an enlarged view of another form of the diffusion grating. This diffusion grating 51 is composed of a large number of diamond-shaped protrusions 51a in a plan view. The pseudo wave reaching the diffuse grating 51 is repeatedly reflected in the area by the protrusion 51 a and weakened at this time to thereby form. The shape of the protrusion is not limited to a diamond shape, and may be any desired shape, such as a rectangle, a triangle, another polygon, or an oval. The tenth figure is a front view showing the relative positions of the diffusion grating 50 and the reflection array 33 formed on the front surface of the substrate 2. The tenth figure clearly shows that the inclined lines 40 and 42 are located outside the reflection array 28 and the inclined lines 46 and 48 are located outside the reflection array 22. The diffusion gratings 34, 36, and 38 'are placed so that the surface acoustic waves that penetrate the reflection array 33 without reflection are reflected in a direction different from that in which the reflection array 33 reflects them. For example, the surface acoustic waves generated by the converter 8 and the mode conversion element 78 are reflected by the reflection array 18 toward the reflection array 22 when they pass through. The surface acoustic wave not reflected by the reflection array is reaches the diffusion grating 36. As shown in the seventh figure, the diffusion grating 36 functions to reflect surface acoustic waves toward the outside of the substrate 2. That is, the diffusion grating 36 reflects the surface acoustic wave in a direction opposite to the main direction, so that the ultrasonic vibration that would cause noise does not reach the converter (sensor) 12. The oblique lines 40, 42, 46, and 15 200532171 48 formed along the edge of the substrate 2 constitute bulk waves that propagate along the front surface of the substrate 2 with diffuse reflection and weakening. Generally, body waves are converted into surface acoustic waves by the mode conversion elements 78 and 80. However, not 100% converted body waves propagate in other directions outward from their intended direction. Therefore, the oblique lines 40, 42, 46, and 48 are utilized to weaken these pseudo-body waves. In addition, the surface acoustic wave propagates in the directions other than its predetermined direction after being converted by the mode conversion elements 78 and 80. The oblique lines 40, 42, 46, and 48 also diffusely reflect these stray surface acoustic waves, causing them to scatter in various directions. Pseudo-ultrasonic vibrations reach the converters (sensors) 12 and 14 to reduce the risk of noise and therefore diffuse reflections are reduced. The dolphin picture 82 is printed between the oblique lines 40 and 42 'in the tenth figure and also between the oblique lines 46 and 48. This picture 82 also effectively reduces noise. The picture 82 has a curved outline. Reaching the 82nd round of the picture The body waves or stray surface acoustic waves of the temple are reflected and weakened in various directions. Any picture can be applied as long as it is formed by curved lines or its angle causes diffuse reflection of the pseudo wave to various directions'. Alternatively, a pattern may be printed on these portions of the substrate 2. Next, a second embodiment of the device of the present invention will be described with reference to the twelfth figure. The twelfth figure is an enlarged view of a part of a touch panel in which an inclined surface is formed on the edge of a glass substrate, and a converter is mounted on the inclined surface. The upward inclined surface 94 is formed along the entire length of the edge of the substrate 90 of the touch 92 in this second embodiment, corresponding to the upper edge 24 and the lateral edge 44 of the previous specific embodiment. A converter 98 (wedge converter) having a triangular cross section is adhered to the inclined surface 94 ° FPC 96 is adhered to the rear surface 90a of the substrate 90. The part 96a of the FPC 96 extends outwards and is connected to the converter 98 through the electrode 99. Note that in the twelfth figure, the component symbol 97 represents the converter 16 200532171 = 2: Dagger, piezoelectric component. This converter, 98 1 is a transfer converter or = :, state. In addition, the FPC 96 may be available on the inclined surface 94. Cry. In the touch panel 92 of the ^ th embodiment, in the case where the converter 2 is a transmission converter, the ultrasonic vibration generated thereby = the inclined surface 94, and then along the substrate 9. Before the surface 90b two spread, as indicated by arrow 95. The change of 90 ° b that propagates along the front surface, such as contact with fingers. The detection of the change and the touch position are determined in the same manner as in the previous embodiment. In the twelfth embodiment illustrated in the figure, the converter 98 is provided on the substrate 90 and the surface 94. Therefore, the converter 98 does not exit from the substrate 90, and is easily adapted to a condenser, even if the periphery of the substrate 9 () is covered by a condenser or the like. Next, the third embodiment of the present invention will be described with reference to FIGS. 13 to 15. The third embodiment of the device uses a peach flat cable (hereinafter referred to as “FFC”) on its touch panel 103 ^ °, and the same parts as the first embodiment are represented by the same element symbols. The thirteenth figure is a front view of the FFC 100 attached to the substrate 2. The fourteenth figure is an enlarged view of a part of the FFC 100 of the thirteenth figure. The fifteenth figure is a schematic enlarged sectional view of the FFC 100. As shown in the fifteenth figure, the FFC 100 contains three flat linear conductors. The three flat ... conductive conductors have two substantially parallel signal wirings 104 and 104, and the ground wiring 02 between the two signal wirings 104 is substantially parallel thereto. The signal wiring 104 and the ground wiring 102 are insulated from each other by a flat insulator%. With this structure, the signal wiring 104 is shielded by the ground wiring 102. The outer periphery of the side insulator 106 is made of a conductive film 108 such as copper plating 17 200532171 f ^, which is electrically connected to the ground wiring 102 via a connection portion 108a. In addition to the structure, in addition to the ground wiring 102, the two signal wiring / connecting iU8 shields further improve the anti-EMI properties. The film 108 is covered and protected by an insulating outer cover 110. Two FFCs 100 constructed in one way are used on the substrate 2 as shown in Figs. 12 and 14. That is, FFC 100a is provided at the upper edge 24 of the substrate 2, and FFC 100b is provided at the lateral edge 44. The expression 100a is connected to the FFC 100b via a rigid circuit board 112. The electrical connector ι14 is mounted on the rigid circuit board M]. The electrical connector 114 functions to establish an electrical connection with the controller 6 'as shown by the dotted line. 100. The direction of the FFC 100b is changed by folding from the lateral edge 44 toward the upper edge 24. The converters 12 and 14 are connected to the rigid circuit board 112 via conductors 116 and 116. The converters 8 and 10 are electrically connected to the distal ends of the FFCs 100a and 100b by welding, respectively. The FFC 100, the converters 8, 10, 12, 14, and the rigid circuit board 112 are adhered to the substrate 2. Note that the rigid circuit board 112 may be replaced by FPC. The wiring and the connector 6 for connecting the electrical connector 114 are not limited to the FFC 100. Alternatively, FPC, two-wire wiring (to be described later), or the FFC from which the conductive film 108 and the insulating outer cover 110 shown in FIG. 15 are removed since then, that is, including the ground wiring 102 and the signal wiring 104 and the FFC of the insulator 106. Next, a fourth embodiment of the device of the present invention will be described with reference to FIGS. 16 to 18. The touch panel 133 of the fourth embodiment uses another form of FFC. The sixteenth to eighteenth pictures correspond to the thirteenth to fifteenth pictures, respectively. The sixteenth figure is a front view of the FFC 130 attached to the substrate. Figure 17 is an enlarged view of FFC 130-18 18 200532171 of Figure 16. The eighteenth figure is a schematic enlarged sectional view of the FFC 130 of the sixteenth figure. As shown in the eighteenth figure, the FFC 130 includes two flat conductors. The two flat conductive signal wirings 132 and the ground wiring 134 are arranged in parallel with each other. The periphery of the signal wiring 132 and the ground wiring 134 is covered by an insulator 136. The insulator 136 is further covered by an external cover 138, although this external cover 138 is not always necessary. In this embodiment, the thirteenth to fifteenth figures show that the film 108 of the previous embodiment is omitted. However, the signal wiring 132 is in a state where it is shielded by the ground wiring 134. The FFC 130 includes an FFC 130 a adhered to the upper edge 24 of the substrate 2 and an FFC 130 b adhered to the lateral edge 44. The FFC 130a and the FFC 130b are electrically connected via a rigid circuit board 140. The rigid circuit board 140 includes a main body 140 a along the upper edge 24 and an arm portion 140 b facing the lateral edge 44. The FFC 130a is connected to the main body 140a by welding. The FFC 130b is connected to the arm portion 140b. The converters 12 and 14 are electrically connected to the rigid circuit board 140 via FFC 130c and FFC 130d, respectively. A connector 142 for connecting the rigid circuit board 140 and the controller 6 via the FFc 130 is mounted on the rigid circuit board 140. Note that the FFC 130 is only partially shown in the seventeenth figure by a dotted line, and the control state 6 is omitted. Note that this rigid circuit board worker can be replaced by FPC. The wiring used to connect the electrical connector 142 to the rigid circuit board may be FPC or two-wire wiring, such as the FFC 130 replacement. -In the third and fourth embodiments shown in the thirteenth to eighteenth drawings, only the small-section rigid circuit boards 112 and 140 or Fpc are necessary. Therefore, the preservation of materials is improved, the usability is improved, and the cost is reduced. Therefore, in order to combine the effect of cheap FFC with the wiring length portion, it is possible to reduce the cost of the devices according to the third and fourth embodiments. In the case where the rigid circuit boards 112 and 140 are applied, it is necessary to separate a conductor such as the FFC 130 to be connected to the converters 8, 10, 12, and 14. However, in the case where the rigid circuit boards 12 and 14 are replaced by Fpc, the converters 8, 10, 12 and 14 can be directly soldered to their Ji °… wiring with a very small cross-sectional area, such as AWG 4 0 0.5mm), that is, two-wire wiring, can be used to replace the FFc 1 () 0 and 130. The two-wire wiring is a single-wire wiring including a pair of twisted or parallel conductors and insulated from each other. When the diameter thereof is extremely small, the two-wire wiring does not greatly swell, even if it is provided on the surface of the substrate 2. The conductor pair of the two-wire wiring includes a signal wiring and a ground wiring which are adjacent to each other. Thereby, a shielding effect is obtained with this structure. Specific embodiments of the present invention have been described above in detail. However, this description is not limited to the specific embodiments described. For example, the diffusion grating 50 can be formed by etching hydrofluoric acid. The diffusion grating 50 can also be formed by applying a laser, sandblasting, or cutting through a chemical or physical removal process. In other words, the diffusion grating 50 may be formed by a trench instead of the protrusion. In the foregoing first, third, and fourth specific embodiments, the case where the surface acoustic wave generating device having the mode conversion elements 78, 80, 82, and 84 referred to as a "grating type" has been described has been applied. However, the present invention is not limited to a device using this type of surface acoustic wave generating device. For example, the present invention can be applied to an acoustic wave contact detection device that generates a surface acoustic wave by using a mode converter of an acrylic column as shown in FIG. The present invention can also be applied to an acoustic wave contact detection device using a pair of comb electrodes' formed on an ultrasonic vibrator without a grating or a wedge. In this case, the 'ultrasonic vibration is transmitted in the direction of the edge of the ultrasonic vibrator instead of the thickness direction of the 2005 200532171. Therefore, the ultrasonic vibrator can be provided on the same surface as the mode conversion elements 78, 80, 82, and 84. The FPC 4 used in the present invention can be attached to the substrate 2 with any desired adhesive. However, it is preferable that the piezoelectric vibrator be attached using an ultraviolet curing adhesive. This allows the positions of the converters 8, 10, 12, and 14 to be adjusted with respect to the mode conversion elements 78, 80, 82, and 84 to confirm the best generation of surface acoustic waves before irradiation of the ultraviolet rays causing adhesion. The pseudo wave scattering device may be of a type that causes diffuse reflection and weakening, as described above. Note that the two converters (sensors) 12 and 14 are provided close to each other in the specific embodiment described above. However, the converters (sensors) 12 and 14 can switch positions with the transfer converters 8 and 10 so that they are placed separately from each other. In this case, when a surface acoustic wave leaks from the converters 12 and 14 and the other converters 14 and 12 are not in the vicinity thereof, the noise picked up by the other converter is suppressed. In addition, the electronic path from the controller 6 to the transfer converters 8 and 10 can be reduced. Therefore, it is possible to suppress spurious radiation from the electronic path, that is, emission of electromagnetic waves.
21 200532171 【圖式簡單說明】 第一圖係觸控面板之前視圖，係利用於本發明之聲 波接觸檢測裝置中。 第二圖係前視圖，顯示附加至基板之FPC。 第三圖係概略平面圖，顯示該FPC之整體。 第四圖係第三圖中由B指示之FPC部分之放大圖。 第五圖係反射陣列之前視圖，對應至第一圖。 第六圖係模式轉換元件與漫射光柵之前視圖，對應 至第一圖。 第七圖係該反射陣列與該漫射光柵之部分放大圖。 第八圖係該反射陣列與該漫射光柵之另一部分放 大圖。 第九圖係該漫射光柵之另一形式之放大圖。 第十圖係前視圖，顯示該漫射光柵與該反射陣列之 相對位置。 第十一圖係第一圖之基板之概略部分放大圖，自箭 頭A之方向檢視。 第十二圖係部分放大剖面圖，顯示該觸控面板之第 二具體實施例，其中一傾斜表面形成於該基板之邊緣， 且一轉換器裝設於該傾斜表面上。 第十三圖係附加至該基板之FFC之前視圖。 第十四圖係第十三圖之FFC之部分放大圖。 第十五圖係該FFC之概略放大剖面圖。 第十六圖係附加至該基板之FFC之前視圖。 第十七圖係第十六圖之FFC之部分放大圖。 200532171 第十八圖係第十六圖之FFC之概略放大剖面圖。 【主要元件符號說明】 1 裝置 2 基板 3 觸控面板 4 撓性印刷電路 4a FPC分支 4b FPC分支 6 控制器 8 轉換器 10 轉換器 12 轉換器 14 轉換器 16 傾斜線 18 反射陣列 20 傾斜線 22 反射陣列 24 上邊緣 26 傾斜線 28 反射陣列 30 傾斜線 32 反射陣列 33 反射陣列 34 矩形部 36 矩形部 38 矩形部 40 傾斜線21 200532171 [Brief description of the drawings] The first figure is a front view of a touch panel and is used in the acoustic wave contact detection device of the present invention. The second figure is a front view showing the FPC attached to the substrate. The third figure is a schematic plan view showing the whole of the FPC. The fourth figure is an enlarged view of the FPC part indicated by B in the third figure. The fifth diagram is a front view of the reflection array, and corresponds to the first diagram. The sixth diagram is a front view of the mode conversion element and the diffusion grating, corresponding to the first diagram. The seventh figure is a partial enlarged view of the reflection array and the diffusion grating. The eighth figure is an enlarged view of another part of the reflection array and the diffusion grating. The ninth figure is an enlarged view of another form of the diffusion grating. The tenth figure is a front view showing the relative position of the diffusion grating and the reflection array. The eleventh figure is an enlarged view of the outline of the substrate of the first figure, viewed from the direction of the arrow A. The twelfth figure is a partially enlarged sectional view showing a second specific embodiment of the touch panel, wherein an inclined surface is formed on an edge of the substrate, and a converter is mounted on the inclined surface. The thirteenth figure is a front view of the FFC attached to the substrate. The fourteenth figure is an enlarged view of a part of the FFC of the thirteenth figure. The fifteenth figure is a schematic enlarged sectional view of the FFC. The sixteenth figure is a front view of the FFC attached to the substrate. The seventeenth figure is an enlarged view of a part of the FFC of the sixteenth figure. 200532171 The eighteenth figure is a schematic enlarged sectional view of the FFC of the sixteenth figure. [Description of main component symbols] 1 Device 2 Substrate 3 Touch panel 4 Flexible printed circuit 4a FPC branch 4b FPC branch 6 Controller 8 Converter 10 Converter 12 Converter 14 Converter 16 Inclined line 18 Reflection array 20 Inclined line 22 Reflective array 24 Upper edge 26 Slanted line 28 Reflected array 30 Slanted line 32 Reflected array 33 Reflected array 34 Rectangular portion 36 Rectangular portion 38 Rectangular portion 40 Slanted line
23 200532171 42 傾斜線 43 漫射光柵 44 橫向邊緣 45 下邊緣 46 傾斜線 48 傾斜線 49 漫射光柵 50 漫射光柵23 200532171 42 Inclined line 43 Diffuse grating 44 Lateral edge 45 Lower edge 46 Inclined line 48 Inclined line 49 Diffuse grating 50 Diffuse grating