TW200520671A - Assembly fixture and assembly method of heat radiation module - Google Patents

Assembly fixture and assembly method of heat radiation module

Info

Publication number
TW200520671A
TW200520671A TW092135126A TW92135126A TW200520671A TW 200520671 A TW200520671 A TW 200520671A TW 092135126 A TW092135126 A TW 092135126A TW 92135126 A TW92135126 A TW 92135126A TW 200520671 A TW200520671 A TW 200520671A
Authority
TW
Taiwan
Prior art keywords
heat radiation
assembly
radiation module
movable plate
assembly fixture
Prior art date
Application number
TW092135126A
Other languages
Chinese (zh)
Other versions
TWI231173B (en
Inventor
Hsiu-Chen Pan
Original Assignee
Mitac Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Int Corp filed Critical Mitac Int Corp
Priority to TW92135126A priority Critical patent/TWI231173B/en
Application granted granted Critical
Publication of TWI231173B publication Critical patent/TWI231173B/en
Publication of TW200520671A publication Critical patent/TW200520671A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An assembly fixture of heat radiation module is provided, which is suitable for assembling a heat radiation module. The assembly fixture of heat radiation module comprises a base and a movable plate, wherein a side of the movable plate is rotary connected to the base, and a plurality of locating holes is disposed on the movable plate. When the L-type heatsink and the U-type heatsink are disposed on the movable plate by the locating holes, the locking holes of the L-type heatsink and the locking portion of the U-type heatsink is matched. The assembly fixture of heat radiation module provided before can improve the assembly precision of the heat radiating module, and can increase the speed and the yield factor of the assembly process.
TW92135126A 2003-12-12 2003-12-12 Assembly fixture and assembly method of heat radiation module TWI231173B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92135126A TWI231173B (en) 2003-12-12 2003-12-12 Assembly fixture and assembly method of heat radiation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92135126A TWI231173B (en) 2003-12-12 2003-12-12 Assembly fixture and assembly method of heat radiation module

Publications (2)

Publication Number Publication Date
TWI231173B TWI231173B (en) 2005-04-11
TW200520671A true TW200520671A (en) 2005-06-16

Family

ID=36086413

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92135126A TWI231173B (en) 2003-12-12 2003-12-12 Assembly fixture and assembly method of heat radiation module

Country Status (1)

Country Link
TW (1) TWI231173B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464338B (en) * 2011-11-29 2014-12-11 Hon Hai Prec Ind Co Ltd Testing device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI788955B (en) * 2021-08-16 2023-01-01 和碩聯合科技股份有限公司 Positioning fixture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464338B (en) * 2011-11-29 2014-12-11 Hon Hai Prec Ind Co Ltd Testing device

Also Published As

Publication number Publication date
TWI231173B (en) 2005-04-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees