TW200514822A - Composition of copper-clad laminate with high dimensional stability - Google Patents
Composition of copper-clad laminate with high dimensional stabilityInfo
- Publication number
- TW200514822A TW200514822A TW092130564A TW92130564A TW200514822A TW 200514822 A TW200514822 A TW 200514822A TW 092130564 A TW092130564 A TW 092130564A TW 92130564 A TW92130564 A TW 92130564A TW 200514822 A TW200514822 A TW 200514822A
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- parts
- composition
- copper
- dimensional stability
- Prior art date
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
A composition of epoxy resin material for copper-clad laminate is provided The composition comprises 100 parts by weight of epoxy, 2.2~3.5 parts by weight of Dicyandiamide curing agent or 20~60 parts by weight of phenol curing agent, 0.01~2.0 parts by weight of catalyst, 15~90 parts by weight of filler and 0.1~5.0 parts by weight of dispersant. The addition of fillers improves the resin flow property of epoxy gel film, and increases the dimensional stability of laminate. The fillers are inorganic compound with a diameter of 1~100 μm, including talc, CaCO3, Al(OH)3, SiO2 and Al2O3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092130564A TW200514822A (en) | 2003-10-31 | 2003-10-31 | Composition of copper-clad laminate with high dimensional stability |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092130564A TW200514822A (en) | 2003-10-31 | 2003-10-31 | Composition of copper-clad laminate with high dimensional stability |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200514822A true TW200514822A (en) | 2005-05-01 |
Family
ID=57798841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092130564A TW200514822A (en) | 2003-10-31 | 2003-10-31 | Composition of copper-clad laminate with high dimensional stability |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200514822A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102399375A (en) * | 2010-09-06 | 2012-04-04 | 台耀科技股份有限公司 | Epoxy resin blend |
-
2003
- 2003-10-31 TW TW092130564A patent/TW200514822A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102399375A (en) * | 2010-09-06 | 2012-04-04 | 台耀科技股份有限公司 | Epoxy resin blend |
CN102399375B (en) * | 2010-09-06 | 2014-11-05 | 台燿科技股份有限公司 | Epoxy resin blend |
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