TW200513510A - High-temperature resistance adhesive tape and fabrication method thereof - Google Patents

High-temperature resistance adhesive tape and fabrication method thereof

Info

Publication number
TW200513510A
TW200513510A TW093130198A TW93130198A TW200513510A TW 200513510 A TW200513510 A TW 200513510A TW 093130198 A TW093130198 A TW 093130198A TW 93130198 A TW93130198 A TW 93130198A TW 200513510 A TW200513510 A TW 200513510A
Authority
TW
Taiwan
Prior art keywords
temperature resistance
adhesive tape
substrate film
fabrication method
resistance adhesive
Prior art date
Application number
TW093130198A
Other languages
Chinese (zh)
Other versions
TWI288171B (en
Inventor
Sang-Kyun Kim
Jeong-Yeol Moon
Hyun-Jin Kim
Jong-Min Park
Original Assignee
Kolon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Inc filed Critical Kolon Inc
Publication of TW200513510A publication Critical patent/TW200513510A/en
Application granted granted Critical
Publication of TWI288171B publication Critical patent/TWI288171B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2471/00—Presence of polyether
    • C09J2471/006—Presence of polyether in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2481/00—Presence of sulfur containing polymers
    • C09J2481/006—Presence of sulfur containing polymers in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention is directed to a high-temperature resistance adhesive tape, and a fabrication method thereof. The high-temperature resistance adhesive tape prepared by coating an adhesive composition on a substrate film physically surface-modified by corona or plasma treatment to form an adhesive layer and then performing a heat treatment for drying and curing at 140 to 230 DEG C shows an enhanced adhesion between the adhesive layer and the substrate film through the physical surface modification of the substrate film to minimize a residue of the tape on an adherend, enabling its use for a high-temperature semiconductor process, and minimizes the unreacted functional group of the platinum catalyst through a high temperature process to reduce an appreciable change in properties on ageing, such as a deterioration of adhesion.
TW093130198A 2003-10-08 2004-10-06 High-temperature resistance adhesive tape and fabrication method thereof TWI288171B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030069858A KR20050034061A (en) 2003-10-08 2003-10-08 High temperature resistance adhesive tape and preparation method thereof

Publications (2)

Publication Number Publication Date
TW200513510A true TW200513510A (en) 2005-04-16
TWI288171B TWI288171B (en) 2007-10-11

Family

ID=34420547

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130198A TWI288171B (en) 2003-10-08 2004-10-06 High-temperature resistance adhesive tape and fabrication method thereof

Country Status (4)

Country Link
JP (1) JP2007508408A (en)
KR (1) KR20050034061A (en)
TW (1) TWI288171B (en)
WO (1) WO2005033238A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2639278A1 (en) * 2012-03-13 2013-09-18 Nitto Denko Corporation Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape
KR20160020643A (en) 2014-08-13 2016-02-24 순천향대학교 산학협력단 Electronic assembly bonding method using an adhesive
CN115340827A (en) * 2022-08-10 2022-11-15 苏州泰仑电子材料有限公司 High-temperature-resistant and high-viscosity adhesive tape and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364382A (en) * 1989-08-02 1991-03-19 Shin Etsu Chem Co Ltd Preparation of pressure-sensitive adhesive tape or sheet
JPH04206111A (en) * 1990-11-29 1992-07-28 Shin Etsu Chem Co Ltd Bonding sheet
JP3085484B2 (en) * 1992-04-10 2000-09-11 東レ株式会社 Release film
JP3357695B2 (en) * 1992-12-28 2002-12-16 王子タック株式会社 Method for producing fluororesin adhesive tape
JPH10140127A (en) * 1996-11-14 1998-05-26 Kanegafuchi Chem Ind Co Ltd Adhesive composition and its production
JP4784720B2 (en) * 2001-09-25 2011-10-05 信越化学工業株式会社 Adhesive tape

Also Published As

Publication number Publication date
TWI288171B (en) 2007-10-11
JP2007508408A (en) 2007-04-05
KR20050034061A (en) 2005-04-14
WO2005033238A1 (en) 2005-04-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees