TW200512902A - Heat dissipative substrate for light-emitting diode and manufacturing method thereof - Google Patents
Heat dissipative substrate for light-emitting diode and manufacturing method thereofInfo
- Publication number
- TW200512902A TW200512902A TW092126980A TW92126980A TW200512902A TW 200512902 A TW200512902 A TW 200512902A TW 092126980 A TW092126980 A TW 092126980A TW 92126980 A TW92126980 A TW 92126980A TW 200512902 A TW200512902 A TW 200512902A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting diode
- heat dissipative
- manufacturing
- dissipative substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 230000017525 heat dissipation Effects 0.000 abstract 2
Landscapes
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Disclosed are a heat dissipative substrate for a light-emitting diode and a manufacturing method thereof. The heat dissipative substrate comprises a low expansion layer and two high thermal conductivity layers disposed on the opposite surfaces of the low expansion layer, these layers are bonded together so as to impose physical constraints on each other to thereby realize high heat dissipation rate and low expansion rate. The light-emitting diode is mounted on the heat dissipative substrate to effect efficient heat dissipation and to protect the structure of the light-emitting diode from the damage caused by the thermal expansion of the heat dissipative substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92126980A TWI239613B (en) | 2003-09-30 | 2003-09-30 | Heat sink substrate for light-emitting diode and the manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92126980A TWI239613B (en) | 2003-09-30 | 2003-09-30 | Heat sink substrate for light-emitting diode and the manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200512902A true TW200512902A (en) | 2005-04-01 |
TWI239613B TWI239613B (en) | 2005-09-11 |
Family
ID=37007488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92126980A TWI239613B (en) | 2003-09-30 | 2003-09-30 | Heat sink substrate for light-emitting diode and the manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI239613B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102318094A (en) * | 2009-02-18 | 2012-01-11 | 昭和电工株式会社 | Light-emitting diode, light-emitting diode lamp, and method for producing light-emitting diode |
US8288655B2 (en) | 2008-08-29 | 2012-10-16 | Industrial Technology Research Institute | Circuit board structure and manufacturing method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI420714B (en) * | 2010-08-16 | 2013-12-21 | Moreco Engineering Inc | The thermal conductive structure of light - emitting diodes |
-
2003
- 2003-09-30 TW TW92126980A patent/TWI239613B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8288655B2 (en) | 2008-08-29 | 2012-10-16 | Industrial Technology Research Institute | Circuit board structure and manufacturing method thereof |
TWI387417B (en) * | 2008-08-29 | 2013-02-21 | Ind Tech Res Inst | Circuit board structure and manufacturing method thereof |
CN102318094A (en) * | 2009-02-18 | 2012-01-11 | 昭和电工株式会社 | Light-emitting diode, light-emitting diode lamp, and method for producing light-emitting diode |
Also Published As
Publication number | Publication date |
---|---|
TWI239613B (en) | 2005-09-11 |
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Legal Events
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