TW200512902A - Heat dissipative substrate for light-emitting diode and manufacturing method thereof - Google Patents

Heat dissipative substrate for light-emitting diode and manufacturing method thereof

Info

Publication number
TW200512902A
TW200512902A TW092126980A TW92126980A TW200512902A TW 200512902 A TW200512902 A TW 200512902A TW 092126980 A TW092126980 A TW 092126980A TW 92126980 A TW92126980 A TW 92126980A TW 200512902 A TW200512902 A TW 200512902A
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
heat dissipative
manufacturing
dissipative substrate
Prior art date
Application number
TW092126980A
Other languages
Chinese (zh)
Other versions
TWI239613B (en
Inventor
Chih-Sung Chang
Tzer-Perng Chen
Original Assignee
United Epitaxy Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Epitaxy Co Ltd filed Critical United Epitaxy Co Ltd
Priority to TW92126980A priority Critical patent/TWI239613B/en
Publication of TW200512902A publication Critical patent/TW200512902A/en
Application granted granted Critical
Publication of TWI239613B publication Critical patent/TWI239613B/en

Links

Landscapes

  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Disclosed are a heat dissipative substrate for a light-emitting diode and a manufacturing method thereof. The heat dissipative substrate comprises a low expansion layer and two high thermal conductivity layers disposed on the opposite surfaces of the low expansion layer, these layers are bonded together so as to impose physical constraints on each other to thereby realize high heat dissipation rate and low expansion rate. The light-emitting diode is mounted on the heat dissipative substrate to effect efficient heat dissipation and to protect the structure of the light-emitting diode from the damage caused by the thermal expansion of the heat dissipative substrate.
TW92126980A 2003-09-30 2003-09-30 Heat sink substrate for light-emitting diode and the manufacturing method thereof TWI239613B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92126980A TWI239613B (en) 2003-09-30 2003-09-30 Heat sink substrate for light-emitting diode and the manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92126980A TWI239613B (en) 2003-09-30 2003-09-30 Heat sink substrate for light-emitting diode and the manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200512902A true TW200512902A (en) 2005-04-01
TWI239613B TWI239613B (en) 2005-09-11

Family

ID=37007488

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92126980A TWI239613B (en) 2003-09-30 2003-09-30 Heat sink substrate for light-emitting diode and the manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI239613B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102318094A (en) * 2009-02-18 2012-01-11 昭和电工株式会社 Light-emitting diode, light-emitting diode lamp, and method for producing light-emitting diode
US8288655B2 (en) 2008-08-29 2012-10-16 Industrial Technology Research Institute Circuit board structure and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420714B (en) * 2010-08-16 2013-12-21 Moreco Engineering Inc The thermal conductive structure of light - emitting diodes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8288655B2 (en) 2008-08-29 2012-10-16 Industrial Technology Research Institute Circuit board structure and manufacturing method thereof
TWI387417B (en) * 2008-08-29 2013-02-21 Ind Tech Res Inst Circuit board structure and manufacturing method thereof
CN102318094A (en) * 2009-02-18 2012-01-11 昭和电工株式会社 Light-emitting diode, light-emitting diode lamp, and method for producing light-emitting diode

Also Published As

Publication number Publication date
TWI239613B (en) 2005-09-11

Similar Documents

Publication Publication Date Title
TW200717753A (en) Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material
WO2009066561A1 (en) Organic electroluminescent device and method for manufacturing the same
TW200640027A (en) Highly heat-dissipating light-emitting diode
WO2008105428A1 (en) Light-emitting device
WO2004100279A3 (en) High-power solid state light emitter package
WO2012061183A3 (en) Flexible led device for thermal management and method of making
TW200717106A (en) Backlight unit having heat dissipating layer, display device having heat dissipating layer, and method for manufacturing heat dissipating layer
WO2011119007A3 (en) Heat-dissipating tape and method for manufacturing same
JP2007525713A5 (en)
MX2012011434A (en) Lightweight heat sinks and led lamps employing same.
WO2008123172A1 (en) Heat spreader module, heat sink and method for manufacturing the heat spreader module and the heat sink
EP2093814A3 (en) Light-emitting diode, electronic apparatus, and light-emitting diode manufacturing method
FR2914984B1 (en) EQUIPPED FLEXIBLE ELECTRONIC SUPPORT SUPPORTING AT LEAST ONE ELECTROLUMINESCENT DIODE AND ASSOCIATED MANUFACTURING METHOD.
WO2008045886A3 (en) Protection for the epitaxial structure of metal devices
TW200511538A (en) Heat dissipating structure and semiconductor package with the heat dissipating structure
TW200701503A (en) Light-emitting diode and method for manufacturing the same
TW200742162A (en) Semiconductor package mounting apparatus
TW200512902A (en) Heat dissipative substrate for light-emitting diode and manufacturing method thereof
US10980111B2 (en) Circuit board and display device
TW200616254A (en) Light emitting diode structure and manufacturing method thereof
TW200601583A (en) Light emitting diode having an adhesive layer and manufacturing method thereof
TW200625567A (en) Electronic package and fabricating method thereof
TW200625513A (en) Substrate and method for fabricating the same
ATE532395T1 (en) COOLING SYSTEM FOR LED CHIP ARRANGEMENT
WO2007143668A3 (en) Thermally enhanced memory module

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent