TW200509300A - Interconnect structure and method of forming the same - Google Patents

Interconnect structure and method of forming the same

Info

Publication number
TW200509300A
TW200509300A TW092123522A TW92123522A TW200509300A TW 200509300 A TW200509300 A TW 200509300A TW 092123522 A TW092123522 A TW 092123522A TW 92123522 A TW92123522 A TW 92123522A TW 200509300 A TW200509300 A TW 200509300A
Authority
TW
Taiwan
Prior art keywords
plug
dielectric layer
forming
interconnect structure
same
Prior art date
Application number
TW092123522A
Other languages
Chinese (zh)
Other versions
TWI240367B (en
Inventor
Shih-Fan Kuan
Kuo-Chien Wu
Kawn-Mou Chen
Original Assignee
Nanya Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanya Technology Corp filed Critical Nanya Technology Corp
Priority to TW92123522A priority Critical patent/TWI240367B/en
Publication of TW200509300A publication Critical patent/TW200509300A/en
Application granted granted Critical
Publication of TWI240367B publication Critical patent/TWI240367B/en

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A method of forming a interconnect structure is described. A first dielectric layer having a plug therein is provided. Removing a portion of the first dielectric layer to expose the sidewalls of the top portion of the plug. Then, a portion of the exposed top portion of the plug is removed. A second dielectric layer is formed over the first dielectric layer covering the plug. Removing the second dielectric layer until the plug is exposed. A conductive line is formed on the second dielectric layer and is electrically connected to the plug. Since the top portion of the plug is reduced, short between the plug and other conductive line will not occur.
TW92123522A 2003-08-27 2003-08-27 Interconnect structure and method of forming the same TWI240367B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92123522A TWI240367B (en) 2003-08-27 2003-08-27 Interconnect structure and method of forming the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92123522A TWI240367B (en) 2003-08-27 2003-08-27 Interconnect structure and method of forming the same

Publications (2)

Publication Number Publication Date
TW200509300A true TW200509300A (en) 2005-03-01
TWI240367B TWI240367B (en) 2005-09-21

Family

ID=37007737

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92123522A TWI240367B (en) 2003-08-27 2003-08-27 Interconnect structure and method of forming the same

Country Status (1)

Country Link
TW (1) TWI240367B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521894B2 (en) 2020-07-18 2022-12-06 International Business Machines Corporation Partial wrap around top contact

Also Published As

Publication number Publication date
TWI240367B (en) 2005-09-21

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