TW200508306A - Rubber-modified styrenic resin composition - Google Patents
Rubber-modified styrenic resin compositionInfo
- Publication number
- TW200508306A TW200508306A TW092122969A TW92122969A TW200508306A TW 200508306 A TW200508306 A TW 200508306A TW 092122969 A TW092122969 A TW 092122969A TW 92122969 A TW92122969 A TW 92122969A TW 200508306 A TW200508306 A TW 200508306A
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- rubber
- parts
- resin composition
- styrenic resin
- Prior art date
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
Abstract
A rubber-modified styrenic resin composition has the advantages of good impact resistance and fluidity, good anti-stress-cracking, and low smudge, and is composed of a styrenic copolymer (A) as a continuous phase and rubber particles (B) as a dispersed phase. The styrenic copolymer (A) is composed of (i-1) 50 to 90 parts by weight of styrenic monomers, (i-2) 10 to 50 parts by weight of acrylonitrilized vinyl monomers, (i-3) 0 to 40 parts by weight of other copolymerizable vinyl monomers, based on 100 parts by weight of the sum of the above-mentioned (i-1), (i-2), (i-3), and 0.0005 to 1.0 parts by weight of multi-functional maleimide monomers, in which the rubber content in the rubber-modified styrenic resin composition is 1 to 40 wt%. According to tests, the styrenic copolymer (A) has a MFR of MI(g/10 minutes) measured at 200 DEG C at a load of 1.0 kg, a MFR of HMI (g/10 minutes) measured at 200 DEG C at a load of 10 kg, and a MIR (=HMI/MI) of 21.5 to 30.0. Furthermore, the invented heat resistant rubber-modified styrenic resin composition has a weight average molecular weight of 60,000 to 145,000.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92122969A TWI242577B (en) | 2003-08-21 | 2003-08-21 | Rubber modified styrene system resin composition |
JP2004241103A JP4833529B2 (en) | 2003-08-21 | 2004-08-20 | Rubber-modified styrenic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92122969A TWI242577B (en) | 2003-08-21 | 2003-08-21 | Rubber modified styrene system resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200508306A true TW200508306A (en) | 2005-03-01 |
TWI242577B TWI242577B (en) | 2005-11-01 |
Family
ID=34420988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92122969A TWI242577B (en) | 2003-08-21 | 2003-08-21 | Rubber modified styrene system resin composition |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4833529B2 (en) |
TW (1) | TWI242577B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI449740B (en) * | 2011-09-02 | 2014-08-21 | Chi Mei Corp | Rubber modified styrene resin and molded article produced |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI279406B (en) * | 2005-08-17 | 2007-04-21 | Chi Mei Corp | The transparent styrene resin composition |
TWI496830B (en) * | 2013-12-26 | 2015-08-21 | Chi Mei Corp | Rubber modified styrene-based resin, preparation thereof and the molding product made therefrom. |
TWI531608B (en) * | 2014-12-31 | 2016-05-01 | 奇美實業股份有限公司 | Rubber-modified polystyrene-based resin composition and preparation method thereof |
CN104861654A (en) * | 2015-06-09 | 2015-08-26 | 苏州圣谱拉新材料科技有限公司 | High-strength light composite material and preparation method thereof |
-
2003
- 2003-08-21 TW TW92122969A patent/TWI242577B/en not_active IP Right Cessation
-
2004
- 2004-08-20 JP JP2004241103A patent/JP4833529B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI449740B (en) * | 2011-09-02 | 2014-08-21 | Chi Mei Corp | Rubber modified styrene resin and molded article produced |
Also Published As
Publication number | Publication date |
---|---|
JP4833529B2 (en) | 2011-12-07 |
JP2005068427A (en) | 2005-03-17 |
TWI242577B (en) | 2005-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |