TW200505315A - Conductive sheet having more than one through hole or via hole - Google Patents

Conductive sheet having more than one through hole or via hole

Info

Publication number
TW200505315A
TW200505315A TW093120489A TW93120489A TW200505315A TW 200505315 A TW200505315 A TW 200505315A TW 093120489 A TW093120489 A TW 093120489A TW 93120489 A TW93120489 A TW 93120489A TW 200505315 A TW200505315 A TW 200505315A
Authority
TW
Taiwan
Prior art keywords
hole
conductive
conductive sheet
rear faces
conductive layer
Prior art date
Application number
TW093120489A
Other languages
Chinese (zh)
Inventor
Shigeki Miura
Original Assignee
Fcm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fcm Co Ltd filed Critical Fcm Co Ltd
Publication of TW200505315A publication Critical patent/TW200505315A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The conductive sheet (1) of the present invention has the conductive layer on the front and rear faces of the insulating substrate (2) formed directly, and is electrically connected to the conductive layer existing the other face through a through hole or a via hole (4) opening a hole so that one or more conductive layer existing the front and rear faces penetrates the insulating base substance (2). The feature of the conductive sheet (1) is: at least one or more conductive layers (3a) not connected electrically to the other conductive layers (3b), (3c) on the same surface on the front and rear faces of the insulating substance (2) are formed. In the corresponding part of the insulating substrate (2) forming one or more conductive layers, the two or more through hole or the two or more via holes (4) are formed.
TW093120489A 2003-07-10 2004-07-08 Conductive sheet having more than one through hole or via hole TW200505315A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003194858A JP2005032901A (en) 2003-07-10 2003-07-10 Conductive sheet

Publications (1)

Publication Number Publication Date
TW200505315A true TW200505315A (en) 2005-02-01

Family

ID=34055703

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093120489A TW200505315A (en) 2003-07-10 2004-07-08 Conductive sheet having more than one through hole or via hole

Country Status (3)

Country Link
JP (1) JP2005032901A (en)
TW (1) TW200505315A (en)
WO (1) WO2005005142A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384906B (en) * 2009-05-21 2013-02-01 Subtron Technology Co Ltd Substrate having through hole structure

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176926A (en) * 2008-01-24 2009-08-06 Fujikura Ltd Through wiring substrate and manufacturing method thereof
US8528827B2 (en) 2010-06-18 2013-09-10 Semiconductor Energy Laboratory Co., Ltd. Antenna, semiconductor device, and method of manufacturing antenna
JPWO2015076121A1 (en) * 2013-11-20 2017-03-16 株式会社村田製作所 Multilayer wiring board and probe card having the same
JP5807670B2 (en) * 2013-12-19 2015-11-10 株式会社豊田自動織機 Wiring board
JP6662569B2 (en) * 2015-01-07 2020-03-11 Ｎｔｔエレクトロニクス株式会社 Flexible printed wiring board and mounting method thereof
RU2630680C2 (en) * 2015-09-21 2017-09-12 Акционерное общество "Концерн "Моринформсистема - Агат" Strong multilayer printed board, containing low-cutting control circuits
WO2018074078A1 (en) * 2016-10-21 2018-04-26 株式会社村田製作所 Printed circuit board with connector
JP7385365B2 (en) * 2019-03-14 2023-11-22 株式会社日立国際電気 Sales support system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6295894A (en) * 1985-10-23 1987-05-02 株式会社エイト工業 Formation of through hole substrate
JPH02301187A (en) * 1989-05-16 1990-12-13 Casio Comput Co Ltd Manufacture of both-sided wiring board
JP3123638B2 (en) * 1995-09-25 2001-01-15 株式会社三井ハイテック Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384906B (en) * 2009-05-21 2013-02-01 Subtron Technology Co Ltd Substrate having through hole structure

Also Published As

Publication number Publication date
WO2005005142A1 (en) 2005-01-20
JP2005032901A (en) 2005-02-03

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