TW200503952A - Corundum for filling in resin and resin composition - Google Patents
Corundum for filling in resin and resin compositionInfo
- Publication number
- TW200503952A TW200503952A TW093116023A TW93116023A TW200503952A TW 200503952 A TW200503952 A TW 200503952A TW 093116023 A TW093116023 A TW 093116023A TW 93116023 A TW93116023 A TW 93116023A TW 200503952 A TW200503952 A TW 200503952A
- Authority
- TW
- Taiwan
- Prior art keywords
- corundum
- filling
- resin
- component
- less
- Prior art date
Links
- 229910052593 corundum Inorganic materials 0.000 title abstract 3
- 239000010431 corundum Substances 0.000 title abstract 3
- 239000011347 resin Substances 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 title abstract 2
- 239000011342 resin composition Substances 0.000 title 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 abstract 1
- 235000021388 linseed oil Nutrition 0.000 abstract 1
- 239000000944 linseed oil Substances 0.000 abstract 1
- 239000011163 secondary particle Substances 0.000 abstract 1
- 229920002545 silicone oil Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003158802 | 2003-06-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200503952A true TW200503952A (en) | 2005-02-01 |
TWI346648B TWI346648B (zh) | 2011-08-11 |
Family
ID=37131018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093116023A TW200503952A (en) | 2003-06-04 | 2004-06-03 | Corundum for filling in resin and resin composition |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100709548B1 (zh) |
TW (1) | TW200503952A (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW197458B (zh) * | 1991-02-14 | 1993-01-01 | Ciba Geigy Ag | |
US5929138A (en) | 1996-11-05 | 1999-07-27 | Raychem Corporation | Highly thermally conductive yet highly comformable alumina filled composition and method of making the same |
US6096414A (en) | 1997-11-25 | 2000-08-01 | Parker-Hannifin Corporation | High dielectric strength thermal interface material |
JP3444199B2 (ja) | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及びその製造方法 |
-
2004
- 2004-06-03 TW TW093116023A patent/TW200503952A/zh not_active IP Right Cessation
- 2004-06-03 KR KR1020057023150A patent/KR100709548B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI346648B (zh) | 2011-08-11 |
KR20060025545A (ko) | 2006-03-21 |
KR100709548B1 (ko) | 2007-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |