TW200502347A - Adhesive and adhesive film - Google Patents

Adhesive and adhesive film

Info

Publication number
TW200502347A
TW200502347A TW093112604A TW93112604A TW200502347A TW 200502347 A TW200502347 A TW 200502347A TW 093112604 A TW093112604 A TW 093112604A TW 93112604 A TW93112604 A TW 93112604A TW 200502347 A TW200502347 A TW 200502347A
Authority
TW
Taiwan
Prior art keywords
adhesive
film
adhesive film
present
polyimide
Prior art date
Application number
TW093112604A
Other languages
Chinese (zh)
Other versions
TWI341859B (en
Inventor
Shuta Kihara
Ko Kedo
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of TW200502347A publication Critical patent/TW200502347A/en
Application granted granted Critical
Publication of TWI341859B publication Critical patent/TWI341859B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention provides an adhesive and adhesive film comprising polyimide with repeating unit represented by the following general formula (I): wherein the R and Φ as shown in this specification. The adhesive and the adhesive film of the present invention have excellent properties of adhesion, heat resistance, flexibility and dielectric behavior at high frequency region, etc.
TW093112604A 2003-05-09 2004-05-05 Adhesive and adhesive film TWI341859B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003131722 2003-05-09
JP2003133357 2003-05-12

Publications (2)

Publication Number Publication Date
TW200502347A true TW200502347A (en) 2005-01-16
TWI341859B TWI341859B (en) 2011-05-11

Family

ID=34379687

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093112604A TWI341859B (en) 2003-05-09 2004-05-05 Adhesive and adhesive film

Country Status (3)

Country Link
KR (1) KR101056555B1 (en)
CN (1) CN100512602C (en)
TW (1) TWI341859B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MXPA06010596A (en) * 2005-12-23 2007-06-22 3M Innovative Properties Co High temperature heat resistant adhesive tape, with low electrostatic generation, made with a polyetherimide polymer.
ES2549149T3 (en) * 2012-02-08 2015-10-23 Mitsubishi Gas Chemical Company, Inc. Crystalline Thermoplastic Polyimide Resin
CN108327377B (en) * 2018-03-13 2023-05-23 广西师范大学 Polyimide film or polyimide copper-clad plate's preparation facilities

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094862A (en) * 1974-03-05 1978-06-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for preparing thermoplastic aromatic polyimides
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
KR910000867B1 (en) * 1987-01-27 1991-02-11 미쯔이도오 아쯔 가가꾸 가부시기가이샤 Process for the preparation of polymide for heat-resistant adhesive
JP4147639B2 (en) * 1998-09-29 2008-09-10 宇部興産株式会社 Flexible metal foil laminate
US6887580B2 (en) * 2000-02-01 2005-05-03 Nippon Steel Chemical Co., Ltd. Adhesive polyimide resin and adhesive laminate
KR100917101B1 (en) * 2000-08-04 2009-09-15 도요 보세키 가부시키가이샤 Flexible metal laminate and production method thereof
JP4491986B2 (en) * 2001-03-29 2010-06-30 宇部興産株式会社 Surface treatment method and polyimide film having metal thin film

Also Published As

Publication number Publication date
CN1551715A (en) 2004-12-01
KR101056555B1 (en) 2011-08-11
TWI341859B (en) 2011-05-11
CN100512602C (en) 2009-07-08
KR20040095739A (en) 2004-11-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees