TW200500542A - Pad of building material - Google Patents

Pad of building material

Info

Publication number
TW200500542A
TW200500542A TW093102419A TW93102419A TW200500542A TW 200500542 A TW200500542 A TW 200500542A TW 093102419 A TW093102419 A TW 093102419A TW 93102419 A TW93102419 A TW 93102419A TW 200500542 A TW200500542 A TW 200500542A
Authority
TW
Taiwan
Prior art keywords
pad
adhesive
hole
building material
solidified
Prior art date
Application number
TW093102419A
Other languages
Chinese (zh)
Other versions
TWI326732B (en
Inventor
Hideki Kobayashi
Shinji Toriyama
Jiro Akimoto
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003040531A external-priority patent/JP2004250922A/en
Priority claimed from JP2003040536A external-priority patent/JP3654289B2/en
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of TW200500542A publication Critical patent/TW200500542A/en
Application granted granted Critical
Publication of TWI326732B publication Critical patent/TWI326732B/zh

Links

Abstract

Problems to be solved: to provide a pad of building material to improve prevention effect of peeling off of material that is adhered by adhesive. Solutions: Adhesive S is inside the through hole 30 at the condition that a pad 23 overlaps over a resin pad 20; the adhesive S adheres to the back Tr of ceramic tile T beside the pad 23 and then solidified; the adhesive S overflows from the side of the pad bottom 26 around the through hole 30 and solidified as the profile of the pad bottom 26; the adhesive S offers the resin pad 20 the effect of preventing the ceramic tile 20 from peeling off via its anchor-shaped Sa that overflows form the through hole 30 and solidified; there is a curved concave 38 enveloping around the peripheral of the anchor-shaped Sa ; the concave 38 is able to limit deformation of the through hole 30 or camber around the through hole 30 caused by camber of a seat 24. (Diagram 1: Pad of building material)
TW093102419A 2003-02-19 2004-02-03 Pad of building material TW200500542A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003040531A JP2004250922A (en) 2003-02-19 2003-02-19 Building material mat and manufacturing method therefor
JP2003040536A JP3654289B2 (en) 2003-02-19 2003-02-19 Resin mat and building material mat using the same

Publications (2)

Publication Number Publication Date
TW200500542A true TW200500542A (en) 2005-01-01
TWI326732B TWI326732B (en) 2010-07-01

Family

ID=34315573

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102419A TW200500542A (en) 2003-02-19 2004-02-03 Pad of building material

Country Status (2)

Country Link
CN (1) CN1292136C (en)
TW (1) TW200500542A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4689732B2 (en) * 2009-06-22 2011-05-25 フクビ化学工業株式会社 Plastic spacer
US8539727B2 (en) * 2009-11-19 2013-09-24 Sun Wah Lui Mechanically-held tile
CN102409825B (en) * 2010-09-26 2013-11-06 佛山市嘉邦园艺用品有限公司 Resin pad and brick pad using same
CN103362268B (en) * 2013-07-22 2016-05-18 新疆拓新节能新材料有限公司 A kind of Side fascia
CN105708030B (en) * 2014-06-01 2017-09-26 云朵网络有限公司 A kind of connector and the footwear including the connector
CN103976497B (en) * 2014-06-01 2016-07-06 云朵网络有限公司 A kind of connector and include the footwear of this connector

Also Published As

Publication number Publication date
CN1523181A (en) 2004-08-25
TWI326732B (en) 2010-07-01
CN1292136C (en) 2006-12-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees